Abstract:
A method of uniformly or substantially uniformly heating at least one surface of a substrate, comprises the steps of supporting a substrate, generating a heated air flow, directing the heated air flow to heat a strip of a first surface of the substrate, and moving the flow path of the heated air in a direction transverse to the direction in which the heated air flow impinges on the substrate until the temperature of the whole or substantially the whole first surface of the substrate has been uniformly or substantially uniformly raised. Apparatus for performing this method is also disclosed.
Abstract:
Uniformity of temperature is established within a wafer, and a higher throughput is achieved while the wafer heating time is dramatically reduced by combining lamp heating with hot-wall heating. Lamps 10 are provided outside the furnace body 3 of a hot-wall CVD apparatus. The hot-wall reactor furnace body 3 is preheated to a prescribed temperature. Wafers W are loaded into the furnace body 3, and these wafers W are rapidly heated immediately thereafter to the desired temperature by light emitted by the lamps 10. The lamps 10 are switched off following heating, and the wafer temperature is allowed to reach a uniform state as a result of heat diffusion in the wafers in the hot-wall reactor furnace body 3. It is also possible to adopt an arrangement in which preheating commensurate with the cooling occurring during the transport period is performed before the wafers W are loaded into the furnace body 3, the wafers W are then loaded into the reactor furnace body 3, and the wafer temperature is allowed to achieve a uniform state.
Abstract:
A method and apparatus for heating a loadlock to inhibit the formation of contaminants within the loadlock. At least one heater is attached to the walls of the loadlock to boil contaminants from the surfaces within the loadlock. These desorbed contaminants are exhausted from the loadlock by a vacuum pump. Alternatively, a purge gas can be supplied to the loadlock while the loadlock is being heated. The flow of purge gas flushes the desorbed contaminants from the loadlock.
Abstract:
A method is provide for measuring electromagnetic radiation radiated from a surface of an object that is irradiated by electromagnetic radiation given off by at least one radiation source. The radiation given off by the radiation source is determined by at least one first detector, and the radiation given off by the irradiated object is determined by at least one second detector that measures the radiation. The radiation from the at least one radiation source is actively modulated with at least one characteristic pyrometer. The radiation determined by the second detector is corrected with the radiation determined by the first detector to compensate for the radiation of the radiation source reflected from the object.
Abstract:
A method and apparatus for heating a loadlock to inhibit the formation of contaminants within the loadlock. At least one heater is attached to the walls of the loadlock to boil contaminants from the surfaces within the loadlock. These desorbed contaminants are exhausted from the loadlock by a vacuum pump. Alternatively, a purge gas can be supplied to the loadlock while the loadlock is being heated. The flow of purge gas flushes the desorbed contaminants from the loadlock.
Abstract:
A wrap heater is provided. The wrap heater includes a first heating sleeve and a second heating sleeve. The first heating sleeve includes a first electrically conductive heating grid, a first stiffening layer for providing rigidity, a first thermostat, and a first cover for enclosing the components in the first heating sleeve. The second heating sleeve includes a second electrically conductive heating grid, a second stiffening layer, a thermostat, and a cover enclosing the components of the second heating sleeve. An extension is provided for separating the first heating sleeve and the second heating sleeve. The wrap heater is provided for heating at least two surfaces of a food product. A method for heating food product, such as pizza, is provided.
Abstract:
A housing is provided for maintaining a planar lightguide circuit at a temperature within a predetermined temperature range independent of ambient temperature. The housing includes a planar heating arrangement supporting and in thermal contact with the planar lightguide circuit. Also included is a frame assembly having a first surface on which the planar heating arrangement is fixed. The frame assembly has at least one opening through which extends at least one optical fiber coupled to the planar lightguide circuit. An overmold, which is molded around the frame assembly, includes at least one strain relief member through which the optical fiber extends.
Abstract:
The quantity of supply heat of heated gas is controlled so that a supply heat quantity of the heated gas when no heat treatment of solder or the like is needed is made smaller than a supply heat quantity of the heated gas when heat treatment of solder or the like is needed, reducing consumption power when no heat treatment is needed for a board.
Abstract:
A noncontact article temperature measuring device adapted for evaluating the quality including the food temperature, freezed/thawed state, presence/absence of bubble based on food capacitance measurement data and for evaluating/controlling the operation of a thawing device and used for a freezing/thawing system so as to solve conventional problems. The measuring device is so provided that an article of food can be passed or is provided on both vertical sides of a space or on the same plane of one of the sides. The measuring device comprises at least a pair of electrodes serving as a capacitance sensor and a capacitance measuring section for measuring the capacitance of the food article placed in the space from the signal generated by the paired electrodes. The capacitance is measured by applying a predetermined voltage between the electrodes, and the temperature of the article is determined and the freezed/thawed state is recognized from the measured capacitance. The voltage applied to the plus electrode is preferably a high-frequency voltage the frequency of which ranges from 50 kHz to 1 MHz. A guard electrode for preventing lines of electric force from diffusing surrounds the plus electrode at an insulation distance is preferably provided.