Method of an apparatus for heating a substrate
    1.
    发明授权
    Method of an apparatus for heating a substrate 失效
    用于加热衬底的装置的方法

    公开(公告)号:US06686565B2

    公开(公告)日:2004-02-03

    申请号:US09903352

    申请日:2001-07-11

    CPC classification number: H01L21/67109 H05K3/3494

    Abstract: A method of uniformly or substantially uniformly heating at least one surface of a substrate, comprises the steps of supporting a substrate, generating a heated air flow, directing the heated air flow to heat a strip of a first surface of the substrate, and moving the flow path of the heated air in a direction transverse to the direction in which the heated air flow impinges on the substrate until the temperature of the whole or substantially the whole first surface of the substrate has been uniformly or substantially uniformly raised. Apparatus for performing this method is also disclosed.

    Abstract translation: 均匀或基本均匀地加热衬底的至少一个表面的方法包括以下步骤:支撑衬底,产生加热的空气流,引导加热的空气流加热衬底的第一表面的条带,并移动 加热的空气在与加热的空气流冲击基板的方向横向的方向上的流动路径,直到基板的整个或基本上整个第一表面的温度均匀地或基本均匀地升高。 还公开了用于执行该方法的装置。

    Heat treatment method and heat treatment apparatus
    2.
    发明授权
    Heat treatment method and heat treatment apparatus 失效
    热处理方法和热处理装置

    公开(公告)号:US06414280B1

    公开(公告)日:2002-07-02

    申请号:US09539216

    申请日:2000-03-30

    CPC classification number: H01L21/67115 C30B25/105 C30B31/12 H01L21/67109

    Abstract: Uniformity of temperature is established within a wafer, and a higher throughput is achieved while the wafer heating time is dramatically reduced by combining lamp heating with hot-wall heating. Lamps 10 are provided outside the furnace body 3 of a hot-wall CVD apparatus. The hot-wall reactor furnace body 3 is preheated to a prescribed temperature. Wafers W are loaded into the furnace body 3, and these wafers W are rapidly heated immediately thereafter to the desired temperature by light emitted by the lamps 10. The lamps 10 are switched off following heating, and the wafer temperature is allowed to reach a uniform state as a result of heat diffusion in the wafers in the hot-wall reactor furnace body 3. It is also possible to adopt an arrangement in which preheating commensurate with the cooling occurring during the transport period is performed before the wafers W are loaded into the furnace body 3, the wafers W are then loaded into the reactor furnace body 3, and the wafer temperature is allowed to achieve a uniform state.

    Abstract translation: 在晶片内形成均匀的温度,并且通过将灯加热与热壁加热组合来显着降低晶片加热时间,从而实现更高的通量。 灯10设置在热壁CVD装置的炉体3的外部。 将热壁反应炉体3预热至规定温度。 晶片W被装载到炉体3中,并且这些晶片W之后立即被灯10发出的光迅速地加热到期望的温度。加热后关闭灯10,并使晶片温度达到均匀 由于在热壁反应炉体3中的晶片中的热扩散的结果,也可以采用这样的配置:在将晶片W装载到 炉体3,然后将晶片W装载到反应炉体3中,并且允许晶片温度达到均匀的状态。

    Method of measuring electromagnetic radiation
    4.
    发明授权
    Method of measuring electromagnetic radiation 有权
    电磁辐射测量方法

    公开(公告)号:US06369363B2

    公开(公告)日:2002-04-09

    申请号:US09789942

    申请日:2001-02-16

    CPC classification number: G01J5/0003

    Abstract: A method is provide for measuring electromagnetic radiation radiated from a surface of an object that is irradiated by electromagnetic radiation given off by at least one radiation source. The radiation given off by the radiation source is determined by at least one first detector, and the radiation given off by the irradiated object is determined by at least one second detector that measures the radiation. The radiation from the at least one radiation source is actively modulated with at least one characteristic pyrometer. The radiation determined by the second detector is corrected with the radiation determined by the first detector to compensate for the radiation of the radiation source reflected from the object.

    Abstract translation: 提供一种测量从被至少一个辐射源发出的电磁辐射照射的物体表面辐射的电磁辐射的方法。 由辐射源发出的辐射由至少一个第一检测器确定,由照射物体放出的辐射由至少一个测量辐射的第二检测器确定。 来自至少一个辐射源的辐射用至少一个特征性高温计主动调制。 用由第一检测器确定的辐射来校正由第二检测器确定的辐射,以补偿从物体反射的辐射源的辐射。

    Method and apparatus for reducing contamination in a wafer loadlock of a semiconductor wafer processing system
    5.
    发明授权
    Method and apparatus for reducing contamination in a wafer loadlock of a semiconductor wafer processing system 失效
    用于减少半导体晶片处理系统的晶片负载锁中的污染的方法和装置

    公开(公告)号:US06323463B1

    公开(公告)日:2001-11-27

    申请号:US09539158

    申请日:2000-03-29

    CPC classification number: C23C16/4408 C23C14/566 H01L21/67028

    Abstract: A method and apparatus for heating a loadlock to inhibit the formation of contaminants within the loadlock. At least one heater is attached to the walls of the loadlock to boil contaminants from the surfaces within the loadlock. These desorbed contaminants are exhausted from the loadlock by a vacuum pump. Alternatively, a purge gas can be supplied to the loadlock while the loadlock is being heated. The flow of purge gas flushes the desorbed contaminants from the loadlock.

    Abstract translation: 一种用于加热负载锁以抑制负载锁中的污染物形成的方法和装置。 至少一个加热器连接到负载锁的壁上以从负载锁中的表面沸腾污染物。 这些脱附的污染物通过真空泵从装载锁中排出。 或者,在负载锁被加热的同时,可以向负载锁提供净化气体。 净化气体的流动会从装载锁中冲洗解吸的污染物。

    Wrap heater and method for heating food product
    6.
    发明授权
    Wrap heater and method for heating food product 失效
    包装加热器和加热食品的方法

    公开(公告)号:US06300599B1

    公开(公告)日:2001-10-09

    申请号:US09664018

    申请日:2000-09-19

    Abstract: A wrap heater is provided. The wrap heater includes a first heating sleeve and a second heating sleeve. The first heating sleeve includes a first electrically conductive heating grid, a first stiffening layer for providing rigidity, a first thermostat, and a first cover for enclosing the components in the first heating sleeve. The second heating sleeve includes a second electrically conductive heating grid, a second stiffening layer, a thermostat, and a cover enclosing the components of the second heating sleeve. An extension is provided for separating the first heating sleeve and the second heating sleeve. The wrap heater is provided for heating at least two surfaces of a food product. A method for heating food product, such as pizza, is provided.

    Abstract translation: 提供包装加热器。 包装加热器包括第一加热套和第二加热套。 第一加热套管包括第一导电加热格栅,用于提供刚性的第一加强层,第一恒温器和用于封闭第一加热套筒中的部件的第一盖。 第二加热套管包括第二导电加热格栅,第二加强层,恒温器和封闭第二加热套筒的部件的盖。 提供用于分离第一加热套筒和第二加热套筒的延伸部。 包装加热器用于加热食品的至少两个表面。 提供了一种加热食品的方法,如比萨饼。

    Compact, thermally stabilized housing for planar lightguide circuits
    7.
    发明授权
    Compact, thermally stabilized housing for planar lightguide circuits 失效
    紧凑的,热稳定的外壳,用于平面光导电路

    公开(公告)号:US06703588B2

    公开(公告)日:2004-03-09

    申请号:US10159522

    申请日:2002-05-31

    CPC classification number: G02B6/12026 G02B6/12 G02B6/30 G02B6/4201

    Abstract: A housing is provided for maintaining a planar lightguide circuit at a temperature within a predetermined temperature range independent of ambient temperature. The housing includes a planar heating arrangement supporting and in thermal contact with the planar lightguide circuit. Also included is a frame assembly having a first surface on which the planar heating arrangement is fixed. The frame assembly has at least one opening through which extends at least one optical fiber coupled to the planar lightguide circuit. An overmold, which is molded around the frame assembly, includes at least one strain relief member through which the optical fiber extends.

    Abstract translation: 提供了一种用于将平面光导电路保持在独立于环境温度的预定温度范围内的温度的壳体。 壳体包括支撑并与平面光导电路热接触的平面加热装置。 还包括具有固定有平面加热装置的第一表面的框架组件。 框架组件具有至少一个开口,通过该开口延伸耦合到平面光导电路的至少一个光纤。 围绕框架组件模制的包覆模塑包括至少一个应变消除构件,光纤延伸穿过该构件。

    Noncontact article temperature measuring device for food
    10.
    发明授权
    Noncontact article temperature measuring device for food 失效
    非接触式物品温度测量装置

    公开(公告)号:US06242714B1

    公开(公告)日:2001-06-05

    申请号:US09530358

    申请日:2000-07-21

    CPC classification number: G01N33/02 G01K7/343 G01N27/221

    Abstract: A noncontact article temperature measuring device adapted for evaluating the quality including the food temperature, freezed/thawed state, presence/absence of bubble based on food capacitance measurement data and for evaluating/controlling the operation of a thawing device and used for a freezing/thawing system so as to solve conventional problems. The measuring device is so provided that an article of food can be passed or is provided on both vertical sides of a space or on the same plane of one of the sides. The measuring device comprises at least a pair of electrodes serving as a capacitance sensor and a capacitance measuring section for measuring the capacitance of the food article placed in the space from the signal generated by the paired electrodes. The capacitance is measured by applying a predetermined voltage between the electrodes, and the temperature of the article is determined and the freezed/thawed state is recognized from the measured capacitance. The voltage applied to the plus electrode is preferably a high-frequency voltage the frequency of which ranges from 50 kHz to 1 MHz. A guard electrode for preventing lines of electric force from diffusing surrounds the plus electrode at an insulation distance is preferably provided.

    Abstract translation: 一种非接触式物品温度测量装置,其适于基于食物电容测量数据评估包括食物温度,冻结/解冻状态,气泡存在/不存在的质量以及用于评估/控制解冻装置的操作并用于冷冻/解冻 系统,以解决常规问题。 测量装置设置成可以使食品物品通过或设置在空间的两个垂直侧或者在一个侧面的同一平面上。 测量装置包括至少一对用作电容传感器的电极和电容测量部分,用于根据由一对电极产生的信号测量放置在该空间中的食品的电容。 通过在电极之间施加预定电压来测量电容,并且确定制品的温度并且从测量的电容中识别出冷冻/解冻状态。 施加到正电极的电压优选为频率范围为50kHz至1MHz的高频电压。 优选地提供用于防止电力线扩散的保护电极以绝缘距离围绕正电极。

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