Radiation plate and power semiconductor module IC package
    1.
    发明授权
    Radiation plate and power semiconductor module IC package 有权
    辐射板和功率半导体模块IC封装

    公开(公告)号:US07180176B2

    公开(公告)日:2007-02-20

    申请号:US10487396

    申请日:2002-08-22

    IPC分类号: H01L23/36 C22C9/00 C22C9/06

    摘要: Heat dissipating plate (4) made of copper-base alloy is proposed that exhibits high degree of flatness after joining in the step of assembling power semiconductor modules, IC packages, etc., that will not crack in the solder (3) joint if subjected to heat cycles during joining or in an environment of use, and that has high heat conductivity and cost effectiveness. The heat dissipating plate (4) uses a copper-base alloy having a 0.2% yield strength of at least 300 N/mm2 which is characterized in that the 0.2% yield strength after heating at 400° C. for 10 minutes is at least 90% of the 0.2% yield strength before heating and that said copper-base alloy has a heat conductivity of at least 350 W/m·K and contains at least one element of the group consisting of Fe, Co and Ni plus P in a total amount of 0.01–0.3%; the heat dissipating plate (4) is 10–200 mm long on each side, 0.1–5 mm thick and warped by 200 μm or less in a curved shape with a radius of curvature of at least 100 mm; this heat dissipating plate (4) exhibits high degree of flatness after the assembling step and assures improved heat dissipating performance.

    摘要翻译: 提出了由铜基合金制成的散热板(4),在组装功率半导体模块,IC封装等的步骤中,在焊接(3)接头中不会开裂的步骤中,在接合之后呈现高度的平坦度 在接合或使用环境中加热循环,并且具有高导热性和成本效益。 散热板(4)使用0.2%屈服强度为300N / mm 2以上的铜基合金,其特征在于在400℃加热后的0.2%屈服强度 10分钟是加热前0.2%屈服强度的至少90%,所述铜基合金的导热率至少为350W / mK,并且包含至少一种元素,由Fe,Co和 Ni加P,总量为0.01-0.3%; 散热板(4)的每侧长10-200毫米,厚度为0.1-5毫米,曲率半径至少为100毫米的弯曲形状弯曲200微米或更小; 该散热板(4)在组装步骤之后表现出高度的平整度,并且确保了散热性能的提高。

    Controlling method for image forming apparatus
    4.
    发明申请
    Controlling method for image forming apparatus 有权
    成像设备的控制方法

    公开(公告)号:US20060088331A1

    公开(公告)日:2006-04-27

    申请号:US11175435

    申请日:2005-07-07

    IPC分类号: G03G15/00

    摘要: A controlling method for controlling an image forming apparatus has a step of displaying a prinnting paper illustration representing printing paper on an operating screen and a step of displaying at least one icon related to a process function of the image forming apparatus. The controlling method further has a step of selecting a process function that corresponds to the specified icon and a step of determining the location to which the selected process function is applied upon receiving an instruction for a position on the printing paper illustration.

    摘要翻译: 用于控制图像形成装置的控制方法具有在操作画面上显示表示打印纸的打印纸图示的步骤,以及显示与图像形成装置的处理功能相关的至少一个图标的步骤。 所述控制方法还具有选择对应于所述指定图标的处理功能的步骤,以及在接收到所述打印纸图示上的位置的指令时,确定应用所选择的处理功能的位置的步骤。

    Controlling method for image forming apparatus
    5.
    发明授权
    Controlling method for image forming apparatus 有权
    成像设备的控制方法

    公开(公告)号:US07424236B2

    公开(公告)日:2008-09-09

    申请号:US11175435

    申请日:2005-07-07

    IPC分类号: G03G15/00

    摘要: A controlling method for controlling an image forming apparatus has a step of displaying a printing paper illustration representing printing paper on an operating screen and a step of displaying at least one icon related to a process function of the image forming apparatus. The controlling method further has a step of selecting a process function that corresponds to the specified icon and a step of determining the location to which the selected process function is applied upon receiving an instruction for a position on the printing paper illustration.

    摘要翻译: 用于控制图像形成装置的控制方法具有在操作屏幕上显示表示打印纸的打印纸图示的步骤,以及显示与图像形成装置的处理功能相关的至少一个图标的步骤。 所述控制方法还具有选择对应于所述指定图标的处理功能的步骤,以及在接收到所述打印纸图示上的位置的指令时,确定应用所选择的处理功能的位置的步骤。

    Thermoplastic resin composition
    6.
    发明授权
    Thermoplastic resin composition 失效
    热塑性树脂组合物

    公开(公告)号:US06995204B2

    公开(公告)日:2006-02-07

    申请号:US10722525

    申请日:2003-11-28

    IPC分类号: C08K3/32

    CPC分类号: C08K3/40 C08K5/521

    摘要: A thermoplastic resin composition comprising a thermoplastic resin containing no halogen atom, from 0.1 to 50 parts by mass, per 100 parts by mass of said thermoplastic resin, of a phosphate type glass, and from 0.1 to 50 parts by mass, per 100 parts by mass of said thermoplastic resin, of a phosphorus type flame retardant other than the above phosphate type glass.

    摘要翻译: 一种热塑性树脂组合物,其含有不含卤素原子的热塑性树脂,相对于100质量份所述热塑性树脂为磷酸盐型玻璃为0.1〜50质量份,每100份为0.1〜50质量份 所述热塑性树脂的质量比上述磷酸盐型玻璃以外的磷型阻燃剂。