公开(公告)号：US06800188B2

公开(公告)日：2004-10-05

申请号：US10140882

申请日：2002-05-09

申请人： Hideki Hagiwara ,  Ryoichi Kimizuka ,  Yoshitaka Terashima ,  Megumi Maruyama ,  Takashi Miyake ,  Hiroshi Nagasawa ,  Tsuyoshi Sahoda ,  Seiji Iimura

发明人： Hideki Hagiwara ,  Ryoichi Kimizuka ,  Yoshitaka Terashima ,  Megumi Maruyama ,  Takashi Miyake ,  Hiroshi Nagasawa ,  Tsuyoshi Sahoda ,  Seiji Iimura

IPC分类号： C25D340

CPC分类号： C25D3/38 ,  H05K3/423

摘要： A copper plating bath comprising a reaction condensate of an amine compound and glycidyl ether and/or a quaternary ammonium derivative of this reaction condensate, and a plating method using this copper plating bath are disclosed. A copper plating bath capable of providing highly reliable copper plating on a substrate such as a silicone wafer semiconductor substrate or printed board having minute circuit patterns and small holes such as blind via-holes, through-holes, and the like, and a method of copper plating using the copper plating bath can be provided.

摘要翻译： 公开了一种包含胺化合物和缩水甘油醚的反应缩合物和/或该反应冷凝物的季铵衍生物的镀铜浴和使用该镀铜浴的镀覆方法。 能够在诸如硅胶晶片半导体基板或具有微小电路图案的印刷电路板和诸如盲孔，通孔等的小孔的基板上提供高可靠性镀铜的镀铜浴，以及 可以提供使用镀铜浴的镀铜。

公开(公告)号：US06193789B1

公开(公告)日：2001-02-27

申请号：US09194434

申请日：1998-12-01

申请人： Hideo Honma ,  Tomoyuki Fujinami ,  Yoshitaka Terashima ,  Shinji Hayashi ,  Satoru Shimizu

发明人： Hideo Honma ,  Tomoyuki Fujinami ,  Yoshitaka Terashima ,  Shinji Hayashi ,  Satoru Shimizu

IPC分类号： C23C1838

CPC分类号： H05K3/384 ,  C23C18/40 ,  H05K3/4611 ,  H05K2201/0355 ,  H05K2203/0307 ,  H05K2203/072

摘要： An electroless copper plating solution which is based on an electroless copper plating solution comprising a copper ion, a complexing agent, a hypophosphorous acid compound as a reducing agent, and a metallic catalyst for initiating a reductive reaction, as characterized by further comprising a lithium ion or both a lithium ion and a polyoxyethylene type surfactant, and a method for electroless copper plating using the same, as well as a plated product made by such a process. The electroless copper plating solution in the present invention enables a uniform and acicular copper film to be deposited on the surface of a plating object, and therefore can be used for improving the strength of adhesion between various metals and resins, including bonding of a copper foil to a resin as applied in a conductive circuit such as a multi-layer printed circuit board or in a copper-plated laminate.

摘要翻译： 一种基于包含铜离子，络合剂，次磷酸化合物作为还原剂的化学镀铜溶液和用于引发还原反应的金属催化剂的化学镀铜溶液，其特征在于还包括锂离子 或锂离子和聚氧乙烯型表面活性剂，以及使用该方法的无电镀铜方法，以及通过这种方法制成的镀覆物。 本发明的化学镀铜溶液能够在电镀对象的表面上沉积均匀的针状铜膜，因此可以用于提高各种金属和树脂之间的粘合强度，包括将铜箔 适用于诸如多层印刷电路板的导电电路中或在镀铜层压板中的树脂。