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    Photovoltaic device
    1.
    发明授权
    Photovoltaic device 失效
    光伏装置

    公开(公告)号：US6121542A

    公开(公告)日：2000-09-19

    申请号：US857906

    申请日：1997-05-16

    申请人： Hidenori Shiotsuka ,  Takahiro Mori ,  Ichiro Kataoka ,  Takeshi Takada ,  Satoru Yamada ,  Ayako Shiotsuka

    发明人： Hidenori Shiotsuka ,  Takahiro Mori ,  Ichiro Kataoka ,  Takeshi Takada ,  Satoru Yamada ,  Ayako Shiotsuka

    IPC分类号： H01L31/0224 ,  H01L31/048 ,  H01L31/00

    CPC分类号： H01L31/048 ,  H01L31/022425 ,  H01L31/022466 ,  Y02E10/50

    摘要： A photovoltaic device including a photovoltaic element comprising a substrate having an electrically conductive face, a semiconductor layer formed on said electrically conductive surface of said substrate, and a transparent and electrically conductive electrode layer formed on said semiconductor layer; a power generation region having a metallic wire arranged over said transparent and electrically conductive electrode layer of said photovoltaic element; and a fixing region of fixing an end portion of said metallic wire, wherein said metallic wire is fixed to a polymer film through an adhesive material, and if necessary, said metallic wire is positioned between a bus bar and said adhesive material while electrically connecting with said bus bar. A solar cell module, construction member, or power generation apparatus comprising said photovoltaic device. A process for producing said photovoltaic device.

    摘要翻译： 一种光电器件，包括光电元件，其包括具有导电面的衬底，形成在所述衬底的所述导电表面上的半导体层以及形成在所述半导体层上的透明导电电极层; 具有布置在所述光电元件的所述透明导电电极层上的金属线的发电区域; 以及固定所述金属线的端部的固定区域，其中所述金属线通过粘合剂材料固定到聚合物膜上，并且如果需要，所述金属线位于母线和所述粘合材料之间，同时电连接 说巴士吧。 一种太阳能电池模块，构造构件或包括所述光伏器件的发电装置。 一种制造所述光电器件的方法。

    Method for manufacturing a solar cell module having photovoltaic cell sandwiched between covering materials
    3.
    发明授权
    Method for manufacturing a solar cell module having photovoltaic cell sandwiched between covering materials 失效
    具有夹在被覆材料之间的太阳能电池的太阳能电池模块的制造方法

    公开(公告)号：US6113718A

    公开(公告)日：2000-09-05

    申请号：US999144

    申请日：1997-12-29

    申请人： Satoru Yamada ,  Takahiro Mori ,  Ichiro Kataoka ,  Hidenori Shiotsuka ,  Ayako Shiotsuka

    发明人： Satoru Yamada ,  Takahiro Mori ,  Ichiro Kataoka ,  Hidenori Shiotsuka ,  Ayako Shiotsuka

    IPC分类号： H01L31/04 ,  H01L21/56 ,  H01L31/048

    CPC分类号： H01L31/048 ,  Y02E10/50

    摘要： A method for manufacturing a solar cell module including a photovoltaic cell between a surface covering material and a back-surface covering material is disclosed that includes the steps of sequentially laminating a member elastically deformable in the direction of the thickness and a member having a flexural rigidity on the surface covering material and/or the back-surface covering material, and providing an external pressure to the member having the flexural rigidity to cover the photovoltaic cell with the surface covering material and the back-surface covering material. According to the above-described manufacturing method, by providing the member elastically deformable in the direction of the thickness, it is possible to prevent deformation and breakage of the photovoltaic cell and rupture of the covering materials. Furthermore, by utilizing a property such that hardness changes in accordance with an amount of deformation, possesed by the member which is deformed in the direction of the thickness, foaming of a foamed member can be homogenized. In addition, since the pressure is provided via the member having the flexural rigidity, the surfaces of the covering materials of the solar cell module are not deformed more than the amount of deformation of the member which is elastically deformed in the direction of the thickness. As a result, large undulation does not occur in the solar cell module.

    摘要翻译： 公开了一种在表面覆盖材料和背面覆盖材料之间包括太阳能电池的太阳能电池模块的制造方法，其包括以下步骤：在厚度方向上可弹性变形的部件和具有弯曲刚度的部件 在表面覆盖材料和/或背面覆盖材料上，并且具有弯曲刚性的构件提供外部压力以用表面覆盖材料和背面覆盖材料覆盖光伏电池。 根据上述制造方法，通过提供沿厚度方向可弹性变形的构件，可以防止光伏电池的变形和断裂以及覆盖材料的破裂。 此外，通过利用硬度根据变形量而变化的特性，其由沿厚度方向变形的构件所具有的，可以均匀化发泡构件的发泡。 此外，由于通过具有抗弯刚度的构件提供压力，所以太阳能电池模块的覆盖材料的表面不会比在厚度方向上弹性变形的构件的变形量更大地变形。 结果，在太阳能电池模块中不会发生大的起伏。

    Light-transmissive resin sealed semiconductor
    8.
    发明授权
    Light-transmissive resin sealed semiconductor 失效
    透光树脂密封半导体

    公开(公告)号：US5684325A

    公开(公告)日：1997-11-04

    申请号：US429036

    申请日：1995-04-26

    申请人： Ichiro Kataoka ,  Takahiro Mori ,  Satoru Yamada ,  Hidenori Shiotsuka ,  Ayako Komori

    发明人： Ichiro Kataoka ,  Takahiro Mori ,  Satoru Yamada ,  Hidenori Shiotsuka ,  Ayako Komori

    IPC分类号： H01L31/04 ,  H01L31/042 ,  H01L31/048 ,  H01L31/20 ,  H01L31/0203

    CPC分类号： H01L31/048 ,  H01L31/202 ,  Y02E10/50 ,  Y02P70/521

    摘要： A light-transmissive resin sealed semiconductor is provided which is sealed at least at a light incident face of a photoelectric transducer with an organic polymer resin layer, which comprises a copolymer of ethylene and an unsaturated fatty acid ester. This light-transmissive resin sealed semiconductor has a surface layer which has high heat resistance, and low hygroscopicity, and does not liberate a free acid even in the presence of moisture. Thereby the semiconductor is prevented from deterioration of performances caused by the drop of the shunt resistance of the photovoltaic element under high humidity environment.

    摘要翻译： 提供一种透光树脂密封半导体，其至少在具有有机聚合物树脂层的光电转换器的光入射面处被密封，所述有机聚合物树脂层包括乙烯和不饱和脂肪酸酯的共聚物。 该透光性树脂密封半导体具有耐热性高，吸湿性低的表层，即使在水分存在下也不释放游离酸。 由此，防止半导体在高湿度环境下由光电元件的分流电阻下降引起的性能劣化。

    Semicondonductor device and a process for the production thereof
    10.
    发明授权
    Semicondonductor device and a process for the production thereof 失效
    半导体器件及其制造方法

    公开(公告)号：US06320115B1

    公开(公告)日：2001-11-20

    申请号：US08684089

    申请日：1996-07-19

    申请人： Ichiro Kataoka ,  Takahiro Mori ,  Satoru Yamada ,  Hidenori Shiotsuka ,  Ayako Komori

    发明人： Ichiro Kataoka ,  Takahiro Mori ,  Satoru Yamada ,  Hidenori Shiotsuka ,  Ayako Komori

    IPC分类号： H01L2500

    CPC分类号： B32B17/04 ,  B32B17/10788 ,  H01L31/0445 ,  H01L31/048 ,  H01L31/056 ,  Y02E10/52

    摘要： A semiconductor device having a semiconductor element, characterized in that said semiconductor device comprises a stacked body obtained by providing a laminate comprising said semiconductor element and a sealing resin which are interposed between a front surface member and a back face member, evacuating said laminate at a vacuum of 5 Torr or less for 5 to 40 minutes, subjecting the laminate thus treated to thermocompression bonding at a vacuum degree of 5 Torr or less, and cooling the laminate subjected to said thermocompression bonding so as to engage in contact bonding. The laminated semiconductor device is free of the air bubbles therein.

    摘要翻译： 一种具有半导体元件的半导体器件，其特征在于，所述半导体器件包括通过提供包含所述半导体元件的层叠体和插入在前表面元件和背面元件之间的密封树脂而获得的层叠体， 5乇以下的真空度为5〜40分钟，对该层叠体进行5Torr以下的真空度的热压接，将进行了所述热压接的层压体进行接合接合。 叠层半导体器件中没有气泡。