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    Heat sink apparatus for an electronic component
    4.
    发明授权
    Heat sink apparatus for an electronic component 失效
    电子元件用散热装置

    公开(公告)号：US5828551A

    公开(公告)日：1998-10-27

    申请号：US827616

    申请日：1997-04-09

    申请人： Izumi Hoshino ,  Hideo Matsushima

    发明人： Izumi Hoshino ,  Hideo Matsushima

    IPC分类号： H01L23/40 ,  H01L23/467 ,  H05K7/20

    CPC分类号： H01L23/467 ,  H01L23/4093 ,  H01L2924/0002

    摘要： A heat sink apparatus of the present invention comprises a heat conductive base comprising a plate member having a first surface and a second surface, a plurality of heat dissipation fins projecting upwardly from the first surface and extending radially toward a circumference of the plate member, the second surface being adapted to be in contact engagement with a surface of the electronic device, the first surface slopping down radially toward the circumference of the plate member, and a fan assembly mounted above the heat dissipation fins. The second surface is substantially flat and a thickness of the plate member decreases radially toward the circumference of the plate member. The heat dissipation fins are arranged to define a non-finned zone of the first surface and the non-finned zone is a concave. The heat sink apparatus further comprises a casing includes an upper wall, a lower surface of which is positioned adjacent to upper edges of the heat dissipation fins.

    摘要翻译： 本发明的散热装置包括导热基体，其包括具有第一表面和第二表面的板构件，从第一表面向上突出并沿着板构件的圆周径向延伸的多个散热翅片， 所述第二表面适于与所述电子设备的表面接触接合，所述第一表面径向朝向所述板构件的圆周倾斜，以及安装在所述散热片上方的风扇组件。 第二表面基本上平坦，并且板构件的厚度朝向板构件的圆周径向减小。 散热翅片布置成限定第一表面的非翅片区域，非翅片区域是凹形的。 散热装置还包括壳体，其包括上壁，其下表面邻近散热翅片的上边缘定位。