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公开(公告)号：US09102513B1
公开(公告)日：2015-08-11
申请号：US14167819
申请日：2014-01-29
申请人： Himax Display, Inc.
发明人： Chun-Hao Su , Roland V. Gelder , Tore Nauta , Wei-Hsiao Chen
CPC分类号： G02B27/0006 , B81B7/0041 , B81C1/00269 , B81C2203/019 , G02B26/0833 , H01L2924/16235
摘要： A MEMS package structure including a chip, a MEMS device, a lid, a sealant and a first moisture barrier is provided. The chip comprises an active surface. The MEMS system device is disposed on the active surface. The lid is covered on the chip and comprising a recess, wherein the MEMS device is in the recess. The sealant is disposed between the chip and the lid so as to seal the recess, wherein a thickness of the sealant is less than a height of the MEMS device. The first moisture barrier is sealed around the chip, the sealant and the lid.
摘要翻译： 提供了包括芯片，MEMS器件，盖子，密封剂和第一湿气屏障的MEMS封装结构。 芯片包括有源表面。 MEMS系统装置设置在有源表面上。 盖子被覆盖在芯片上并且包括凹部，其中MEMS器件在凹部中。 密封剂设置在芯片和盖之间以密封凹部，其中密封剂的厚度小于MEMS器件的高度。 第一个防潮层围绕芯片，密封剂和盖子密封。
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公开(公告)号：US20150210538A1
公开(公告)日：2015-07-30
申请号：US14167819
申请日：2014-01-29
申请人： Himax Display, Inc.
发明人： Chun-Hao Su , Roland V. Gelder , Tore Nauta , Wei-Hsiao Chen
CPC分类号： G02B27/0006 , B81B7/0041 , B81C1/00269 , B81C2203/019 , G02B26/0833 , H01L2924/16235
摘要： A MEMS package structure including a chip, a MEMS device, a lid, a sealant and a first moisture barrier is provided. The chip comprises an active surface. The MEMS system device is disposed on the active surface. The lid is covered on the chip and comprising a recess, wherein the MEMS device is in the recess. The sealant is disposed between the chip and the lid so as to seal the recess, wherein a thickness of the sealant is less than a height of the MEMS device. The first moisture barrier is sealed around the chip, the sealant and the lid.
摘要翻译： 提供了包括芯片，MEMS器件，盖子，密封剂和第一湿气屏障的MEMS封装结构。 芯片包括有源表面。 MEMS系统装置设置在有源表面上。 盖子被覆盖在芯片上并且包括凹部，其中MEMS器件在凹部中。 密封剂设置在芯片和盖之间以密封凹部，其中密封剂的厚度小于MEMS器件的高度。 第一个防潮层围绕芯片，密封剂和盖子密封。
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