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公开(公告)号：US20160004068A1
公开(公告)日：2016-01-07
申请号：US14322272
申请日：2014-07-02
Applicant: Himax Display, Inc.
Inventor： Roland V. Gelder , Nan Liu
CPC classification number: G02B26/0841
Abstract: A micro-mirror device and a method for driving a mirror thereof are disclosed. The micro-mirror device includes a mirror, a first and a second electrode, a memory, and a controller. The mirror is tiltable about a hinge. The first electrode and the second electrode are disposed on different sides of the hinge. The memory stores a state data indicating a first electrode state for the first electrode and a second electrode state for the second electrode corresponding to the mirror. The controller is operable to receive the state data of the first and second electrodes from the memory, and in response to a crossover operation request, the controller inverts the states of the first and second electrodes. The controller sends a reset signal to the mirror according to the modified states of the first and second electrodes.
Abstract translation: 公开了一种微镜装置及其反射镜的驱动方法。 微镜装置包括反射镜，第一和第二电极，存储器和控制器。 镜子可绕铰链倾斜。 第一电极和第二电极设置在铰链的不同侧。 存储器存储表示第一电极的第一电极状态的状态数据和对应于反射镜的第二电极的第二电极状态。 控制器可操作以从存储器接收第一和第二电极的状态数据，并且响应于交叉操作请求，控制器反转第一和第二电极的状态。 控制器根据第一和第二电极的修改状态向镜子发送复位信号。
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公开(公告)号：US20160289066A1
公开(公告)日：2016-10-06
申请号：US15177129
申请日：2016-06-08
Applicant: Himax Display, Inc.
Inventor： Roland V. Gelder
CPC classification number: B81C1/00968 , B81B3/0005 , B81B2201/042 , B81C1/00984 , B81C2201/112 , C09D1/00 , C09D4/00 , C10M109/02 , C10N2240/20 , G02B1/12 , G02B1/16 , G02B26/0833
Abstract: A method for forming an anti-stiction coating on a surface of a semiconductor device is provided. Using atomic layer deposition (ALD) processes to activate surface prior to anti-stiction coating deposition, anti-stiction coating having strong chemical bonding to the surface is obtained.
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Patent Agency Ranking
公开(公告)号：US20150210538A1
公开(公告)日：2015-07-30
申请号：US14167819
申请日：2014-01-29
Applicant: Himax Display, Inc.
Inventor： Chun-Hao Su , Roland V. Gelder , Tore Nauta , Wei-Hsiao Chen
CPC classification number: G02B27/0006 , B81B7/0041 , B81C1/00269 , B81C2203/019 , G02B26/0833 , H01L2924/16235
Abstract: A MEMS package structure including a chip, a MEMS device, a lid, a sealant and a first moisture barrier is provided. The chip comprises an active surface. The MEMS system device is disposed on the active surface. The lid is covered on the chip and comprising a recess, wherein the MEMS device is in the recess. The sealant is disposed between the chip and the lid so as to seal the recess, wherein a thickness of the sealant is less than a height of the MEMS device. The first moisture barrier is sealed around the chip, the sealant and the lid.
Abstract translation: 提供了包括芯片，MEMS器件，盖子，密封剂和第一湿气屏障的MEMS封装结构。 芯片包括有源表面。 MEMS系统装置设置在有源表面上。 盖子被覆盖在芯片上并且包括凹部，其中MEMS器件在凹部中。 密封剂设置在芯片和盖之间以密封凹部，其中密封剂的厚度小于MEMS器件的高度。 第一个防潮层围绕芯片，密封剂和盖子密封。
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公开(公告)号：US09500857B2
公开(公告)日：2016-11-22
申请号：US14449940
申请日：2014-08-01
Applicant: Himax Display, Inc.
Inventor： Hui-Lun Chen , Wei-Hsiao Chen , Chien-Tang Wang , Nan Liu , Roland V. Gelder , Chun-Hao Su
CPC classification number: G02B26/0841 , B81B3/0013 , B81B3/0021 , B81B2201/045
Abstract: A microelectromechanical system (MEMS) device includes a substrate and at least one MEMS unit disposed on the substrate. The MEMS unit includes at least one first electrode, at least one second electrode, at least one landing element, and a hinge layer. The first electrode is disposed on the substrate. The second electrode is disposed on the substrate. The landing element is disposed on the substrate. The hinge layer includes a hinge portion and at least one cantilever portion. The hinge portion is connected to the second electrode. The cantilever portion is connected to the hinge portion. The cantilever portion has a first opening and at least one spring disposed in the first opening and connected to at least one side of the first opening. When a voltage difference exists between the first electrode and the second electrode, the hinge portion is distorted and the spring thus touches the landing element.
Abstract translation: 微机电系统（MEMS）装置包括衬底和设置在衬底上的至少一个MEMS单元。 MEMS单元包括至少一个第一电极，至少一个第二电极，至少一个着陆元件和铰链层。 第一电极设置在基板上。 第二电极设置在基板上。 着陆元件设置在基板上。 铰链层包括铰链部分和至少一个悬臂部分。 铰链部分连接到第二电极。 悬臂部分连接到铰链部分。 悬臂部分具有第一开口和设置在第一开口中并连接到第一开口的至少一侧的至少一个弹簧。 当在第一电极和第二电极之间存在电压差时，铰链部分变形，弹簧因此接触着陆部件。
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公开(公告)号：US20160033759A1
公开(公告)日：2016-02-04
申请号：US14449940
申请日：2014-08-01
Applicant: Himax Display, Inc.
Inventor： Hui-Lun Chen , Wei-Hsiao Chen , Chien-Tang Wang , Nan Liu , Roland V. Gelder , Chun-Hao Su
CPC classification number: G02B26/0841 , B81B3/0013 , B81B3/0021 , B81B2201/045
Abstract: A microelectromechanical system (MEMS) device includes a substrate and at least one MEMS unit disposed on the substrate. The MEMS unit includes at least one first electrode, at least one second electrode, at least one landing element, and a hinge layer. The first electrode is disposed on the substrate. The second electrode is disposed on the substrate. The landing element is disposed on the substrate. The hinge layer includes a hinge portion and at least one cantilever portion. The hinge portion is connected to the second electrode. The cantilever portion is connected to the hinge portion. The cantilever portion has a first opening and at least one spring disposed in the first opening and connected to at least one side of the first opening. When a voltage difference exists between the first electrode and the second electrode, the hinge portion is distorted and the spring thus touches the landing element.
Abstract translation: 微机电系统（MEMS）装置包括衬底和设置在衬底上的至少一个MEMS单元。 MEMS单元包括至少一个第一电极，至少一个第二电极，至少一个着陆元件和铰链层。 第一电极设置在基板上。 第二电极设置在基板上。 着陆元件设置在基板上。 铰链层包括铰链部分和至少一个悬臂部分。 铰链部分连接到第二电极。 悬臂部分连接到铰链部分。 悬臂部分具有第一开口和设置在第一开口中并连接到第一开口的至少一侧的至少一个弹簧。 当在第一电极和第二电极之间存在电压差时，铰链部分变形，弹簧因此接触着陆部件。
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6.发明申请公开(公告)号：US20150346391A1
公开(公告)日：2015-12-03
申请号：US14287736
申请日：2014-05-27
Applicant: Himax Display, Inc.
Inventor： Roland V. Gelder
CPC classification number: B81C1/00968 , B81B3/0005 , B81B2201/042 , B81C1/00984 , B81C2201/112 , C09D1/00 , C09D4/00 , C10M109/02 , C10N2240/20 , G02B1/12 , G02B1/16 , G02B26/0833
Abstract: A method for forming an anti-stiction coating on a surface of a semiconductor device is provided. Using atomic layer deposition (ALD) processes to activate surface prior to anti-stiction coating deposition, anti-stiction coating having strong chemical bonding to the surface is obtained.
Abstract translation: 提供了在半导体器件的表面上形成抗静电涂层的方法。 使用原子层沉积（ALD）工艺在抗静电涂层沉积之前激活表面，获得与表面具有强化学键合的抗静电涂层。
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公开(公告)号：US09102513B1
公开(公告)日：2015-08-11
申请号：US14167819
申请日：2014-01-29
Applicant: Himax Display, Inc.
Inventor： Chun-Hao Su , Roland V. Gelder , Tore Nauta , Wei-Hsiao Chen
CPC classification number: G02B27/0006 , B81B7/0041 , B81C1/00269 , B81C2203/019 , G02B26/0833 , H01L2924/16235
Abstract: A MEMS package structure including a chip, a MEMS device, a lid, a sealant and a first moisture barrier is provided. The chip comprises an active surface. The MEMS system device is disposed on the active surface. The lid is covered on the chip and comprising a recess, wherein the MEMS device is in the recess. The sealant is disposed between the chip and the lid so as to seal the recess, wherein a thickness of the sealant is less than a height of the MEMS device. The first moisture barrier is sealed around the chip, the sealant and the lid.
Abstract translation: 提供了包括芯片，MEMS器件，盖子，密封剂和第一湿气屏障的MEMS封装结构。 芯片包括有源表面。 MEMS系统装置设置在有源表面上。 盖子被覆盖在芯片上并且包括凹部，其中MEMS器件在凹部中。 密封剂设置在芯片和盖之间以密封凹部，其中密封剂的厚度小于MEMS器件的高度。 第一个防潮层围绕芯片，密封剂和盖子密封。
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