摘要:
An addition-curable type silicone rubber composition comprising (A) an organopolysiloxane having an alkenyl group such as vinyl in its molecule, (B) an organohydrogenpolysiloxane having at least two SiH groups in its molecule, (C) a platinum catalyst such as platinum, chloroplatinic acid, etc., (D) an inorganic filler, (E) an organic titanium compound such as tetraethyl titanate, and (F) water. The composition exhibits good fluidity, and behaves like a Newtonian fluid, even where carbon black or a silica or alumina having an average particle diameter of 1 .mu.m or above is incorporated in the composition as an inorganic filler for improving such characteristics as heat resistance, thermal conductivity, etc.
摘要:
A gel-forming silicone composition comprising, compounded in a gel-forming base composition, a silane compound having the following general formula (1) or (2): ##STR1## wherein R.sup.1 is an alkyl or aryl group, R.sup.2 is an alkyl or alkoxyalkyl group, R.sup.3 and R.sup.4 are each a hydrogen atom, a methyl group or an ethyl group, R.sup.5 is an alkyl group or an ester linkage-containing group, and a, b and n are each an integer from 0 to 2. The composition is capable of forming, under mild conditions, a silicone gel which exhibits good adherence to a variety of substrates.
摘要:
A platinum catalyst containing (A) a platinum complex having a vinyl-containing organosiloxane ligand and (B) a vinyl-containing organopolysiloxane is prepared by mixing components (A) and (B) such that at least 2 mol of vinyl group in component (B) is available per mol of platinum atom in component (A) and heating the mixture at 40.degree.-100.degree. C. for at least 1 hour. When blended in an addition reaction curing type organosiloxane composition, the platinum catalyst has the advantage that even after long-term storage at elevated temperatures, it remains stable and active enough to cause the organosiloxane composition to cure.
摘要:
The present fluorosilicone composition is an addition reaction curable composition that uses, as an alkenyl group-containing organopolysiloxane, a fluorine-containing organopolysiloxane represented by the following general formula (1): ##STR1## wherein R represents a vinyl group, R.sup.1 represents an alkyl group or a phenyl group, R.sup.2 represents a group represented by the following formula (2): ##STR2## in which p is an integer of 2 to 8 and q is an integer of 1 to 10, and n and m are each a positive integer. This composition can form a gellike cured product particularly excellent in acid resistance.
摘要:
An organopolysiloxane gel composition improved upon discoloration due to thermal deterioration, which comprises (A) 100 pts. wt. of an organopolysiloxane containing alkenyl groups in side chains, (B) a specified amount of an organohydrogenpolysiloxane containing on the statistical average one terminal hydrogen and one terminal alkenyl group, and (C) a catalytic amount of addition reaction catalyst.
摘要:
A solvent-free liquid silicone rubber composition comprising (A) an organopolysiloxane containing at least two alkenyl groups, (B) an organohydrogenpolysiloxane having at least two hydrogen atoms each attached to a silicon atom, (C) wet silica having a BET specific surface area of 150-250 m2/g, a mean particle size of 0.01-20 &mgr;m, and a sodium ion content of up to 0.35 wt % Na2O, (D) an adhesive agent, and (E) a platinum group catalyst is useful for coating onto air bag base fabric to form a thin film having good infiltration, strong adhesion and minimized surface tack.
摘要:
A silicone composition is of the addition reaction type which comprises a vinyl group-containing organopolysiloxane, an organohydrogenpolysiloxane which has at least one hydrogen atom joined to a silicon atom in one molecule, a platinum group metal catalyst, and an aluminum oxide powder which is substantially round or spherical in shape with an average particle size of not larger than 50 .mu.m and wherein when the aluminum oxide powder is subjected to extraction of alkali metal ions and halogen ions under conditions of 121.degree. C., 2 atmospheric pressures, 100% R.H. and 20 hours, the contents of both ions are, respectively, not larger than 5 ppm. The cured product obtained from the composition has high thermal conductivity and the composition is useful as a sealant of electric and electronic parts and can prevent the parts from being corroded.
摘要:
An organopolysiloxane composition, comprising(A) an organopolysiloxane having alkenyl groups bonded to silicon atoms,(B) an organohydrogenpolysiloxane having two or more hydrogen atoms bonded to silicon atoms, and(C) an addition reaction catalyst, wherein the vinyl group containing organopolysiloxane (A) as a base polymer and the organohydrogenpolysiloxane (B) as a crosslinking agent each have at least two alkoxy group and/or at least one epoxy group in the molecule. By subjecting this composition to addition curing, a gel cured product excellent in adhesion particularly to metals is obtained.
摘要:
A gel-forming silicone composition comprising (A) an organopolysiloxane containing a silicon-bonded alkenyl group or groups in an average amount of from 0.15 to 0.35 mol % based on all silicon-bonded organic groups contained per molecule, (B) a non-functional organopolysiloxane, (C) an organohydrogenpolysiloxane containing an average of 2 silicon-bonded hydrogen atoms per molecule, and (D) an addition reaction catalyst. The silicone composition is able to give a gel-like cured silicone product with low modulus of elasticity while retaining flexibility.
摘要:
To a silicone composition comprising (A) an organopolysiloxane having at least two alkenyl groups in a molecule, (B) an organohydrogenpolysiloxane having at least two hydrogen atoms each directly attached to a silicon atom in a molecule, and (C) a platinum catalyst, (D) a compound having a phenyl group and a secondary or tertiary amino group directly attached thereto is added to render the composition flame retardant. The composition cures into a transparent product having improved flame retardancy meeting the UL standard and is suitable for use in the protection of electronic parts like ICs and hybrid ICs.