Recording control apparatus, one-time recording medium, recording system, and recording medium control method and program
    3.
    发明申请
    Recording control apparatus, one-time recording medium, recording system, and recording medium control method and program 审中-公开
    记录控制装置,一次性记录介质,记录系统和记录介质控制方法和程序

    公开(公告)号:US20090210645A1

    公开(公告)日:2009-08-20

    申请号:US12378676

    申请日:2009-02-18

    IPC分类号: G06F12/00

    摘要: A recording control apparatus includes an attribute information reader, a medium determining unit, and a command transmitter. When a recording medium is removably loaded into a loading unit, the attribute information reader reads attribute information therefrom. On the basis of the attribute information, the medium determining unit determines whether or not the recording medium is a one-time recording medium capable of writing data once. If the recording medium is determined to be a one-time recording medium that has been set to a write-protected state in advance, the command transmitter transmits to the recording medium an unlock command for unlocking the write-protected state thereof.

    摘要翻译: 记录控制装置包括属性信息读取器,介质确定单元和命令发送器。 当记录介质可移除地装载到加载单元中时,属性信息读取器从其读取属性信息。 基于属性信息,介质确定单元确定记录介质是否是能够一次写入数据的一次性记录介质。 如果将记录介质确定为预先设置为写保护状态的一次记录介质,则命令发送器向记录介质发送解锁其写入保护状态的解锁命令。

    Semiconductor wafer examination system

    公开(公告)号:US07035447B2

    公开(公告)日:2006-04-25

    申请号:US09732393

    申请日:2000-12-07

    申请人: Kunihiko Take

    发明人: Kunihiko Take

    IPC分类号: G06K9/00

    摘要: A semiconductor wafer examination system can accurately and reliably detects defects of semiconductor wafers. The semiconductor wafer examination system 1 comprises a defect classification device for automatically classifying defects of semiconductor wafers on the basis of defect detection parameters and a knowledge base and a classification support device for supporting the operation of the defect classification device. The defect detection parameters define the permissible deviation of the surface image of a defective semiconductor wafer from that of a normal semiconductor wafer. The knowledge base contains data for the types of defects that can occur in semiconductor wafers and data for showing the characteristics of each type. The classification support device prepares data on isolated defective areas that are used for selecting and/or altering the defect detection parameters and preparing the knowledge base.