STRUCTURE STATUS DETERMINATION DEVICE, STATUS DETERMINATION SYSTEM, AND STATUS DETERMINATION METHOD

    公开(公告)号:US20180052117A1

    公开(公告)日:2018-02-22

    申请号:US15555154

    申请日:2016-03-14

    Inventor: Hiroshi IMAI

    Abstract: The purpose of the present invention is to accurately detect structures from a remote location without contact while distinguishing between defects such as cracking, separation, and internal cavities. This status determination device includes: a displacement calculation unit that calculates a two-dimensional spatial distribution of displacement in time-series images, said time-series images being taken before and after a load is applied to a surface of a structure; a correction amount calculation unit that calculates a correction amount from the two-dimensional spatial distribution of displacement in the time-series images, said correction amount being based on the amount of movement of the structure surface in the normal direction as induced by said loading; a displacement correction unit that subtracts the correction amount from the two-dimensional spatial distribution of displacement in the time-series images, and extracts a two-dimensional spatial distribution of displacement of the structure surface; and an abnormality determination unit for identifying defects in the structure on the basis of a comparison of the two-dimensional spatial distribution of displacement of the structure surface and a pre-prepared spatial distribution of displacement.

    METHOD OF GENERATING A COMPENSATION MATRIX DURING A SUBSTRATE INSPECTION
    5.
    发明申请
    METHOD OF GENERATING A COMPENSATION MATRIX DURING A SUBSTRATE INSPECTION 审中-公开
    在基板检查期间产生补偿矩阵的方法

    公开(公告)号:US20160223468A1

    公开(公告)日:2016-08-04

    申请号:US15021341

    申请日:2014-09-11

    Abstract: The present invention relates to a method for generating a compensation matrix during a substrate inspection. The method comprises the steps of: selecting information of N1 (N1≧2) feature objects which are randomly predetermined within a field of view (FOV) on a substrate; generating a first compensation matrix on the basis of information of the feature objects which are extracted on the substrate; comparing an offset value of each of all the feature objects with a predetermined reference value by applying all the feature objects within the FOV to the compensation matrix to count the number of the feature objects of which the offset value of the each of all the feature objects is less than the predetermined reference value; and repeatedly performing the above steps N2 times (N2≧1), and generating a second compensation matrix using information of the feature objects which have the offset value which is less than the predetermined reference value, in case the number of the counted feature objects is the maximum.

    Abstract translation: 本发明涉及在衬底检查期间产生补偿矩阵的方法。 该方法包括以下步骤:在衬底上选择在视场(FOV)内随机地预定的N1(N1≥2)个特征对象的信息; 基于在所述基板上提取的特征对象的信息生成第一补偿矩阵; 通过将FOV内的所有特征对象应用于补偿矩阵来对所有特征对象中的每一个的偏移值与预定的参考值进行比较,以对所有特征对象中的每一个的偏移值进行计数的特征对象的数量 小于预定的参考值; 并重复执行上述步骤N2次(N2≥1),并且使用具有小于预定参考值的偏移值的特征对象的信息生成第二补偿矩阵,在计数特征对象的数量为 最大值。

    Defect inspection method and device therefor
    6.
    发明授权
    Defect inspection method and device therefor 有权
    缺陷检查方法及其设备

    公开(公告)号:US09239283B2

    公开(公告)日:2016-01-19

    申请号:US13993888

    申请日:2011-11-08

    Abstract: To process a signal from a plurality of detectors without being affected by a variation in the height of a substrate, and to detect more minute defects on the substrate, a defect inspection device is provided with a photoelectric converter having a plurality of rows of optical sensor arrays in each of first and second light-collecting/detecting unit and a processing unit for processing a detection signal from the first and the second light-collecting/detecting unit to determine the extent to which the positions of the focal points of the first and the second light-collecting/detecting unit are misaligned with respect to the surface of a test specimen, and processing the detection signal to correct a misalignment between the first and the second light-collecting/detecting unit, and the corrected detection signal outputted from the first and the second light-collecting/detecting unit are combined together to detect the defects on the test specimen.

    Abstract translation: 为了处理来自多个检测器的信号而不受基板高度的变化的影响,并且在基板上检测更多的微小缺陷,缺陷检查装置设置有具有多行光学传感器的光电转换器 在第一和第二集光/检测单元中的每一个中的阵列,以及处理单元,用于处理来自第一和第二聚光/检测单元的检测信号,以确定第一和第二聚光/ 第二聚光/检测单元相对于试样的表面不对准,并且处理检测信号以校正第一和第二聚光/检测单元之间的未对准,并且校正的检测信号从 第一和第二聚光/检测单元组合在一起以检测试样上的缺陷。

    SUBSTRATE INSPECTION METHOD, SUBSTRATE MANUFACTURING METHOD AND SUBSTRATE INSPECTION DEVICE
    9.
    发明申请
    SUBSTRATE INSPECTION METHOD, SUBSTRATE MANUFACTURING METHOD AND SUBSTRATE INSPECTION DEVICE 审中-公开
    基板检查方法,基板制造方法和基板检查装置

    公开(公告)号:US20150029324A1

    公开(公告)日:2015-01-29

    申请号:US14337520

    申请日:2014-07-22

    Inventor: Masaru TANABE

    Abstract: There is provided a substrate inspection method for inspecting a substrate having a plurality of holes formed on a plate-shaped material, including: an image acquisition step (S103) of picking-up an image of the holes formed on the substrate via an optical system including a microscope having an objective lens of a specific magnification, from one surface side of the substrate; a super resolution image processing step (S104) of obtaining a super resolution image corresponding to a picked-up image via an optical system including a microscope having an objective lens of higher magnification than the specific magnification, by applying super resolution image processing to the image obtained in the image acquisition step (S103); and an inspection step (S108) of inspecting a proper or improper hole formed on the substrate using the super resolution image obtained in the super resolution image processing step (S104).

    Abstract translation: 提供了一种用于检查形成在板状材料上的具有多个孔的基板的基板检查方法,包括:图像获取步骤(S103),其通过光学系统拍摄形成在基板上的孔的图像 包括具有特定放大倍数的物镜的显微镜,从所述基板的一个表面侧; 超分辨率图像处理步骤(S104),通过对包含具有比特定倍率高的倍率的物镜的显微镜的光学系统获得与拾取图像相对应的超分辨率图像,通过对图像应用超分辨率图像处理 在图像获取步骤(S103)中获得; 以及使用超分辨率图像处理步骤(S104)中获得的超分辨率图像来检查形成在基板上的适当或不正确的孔的检查步骤(S108)。

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