摘要:
The invention is directed to a phase shift photomask for which a film made of a material capable of providing an etching stopper layer that excels in etching selectivity and can interrupt etching surely and automatically, and provides a phase shift photomask at least comprising a substrate 30 and a phase shifter pattern made of a material composed mainly of silicon oxide that is provided on the surface of the substrate directly or with an opaque layer 37 interposed therebetween, said phase shift photomask being characterized in that the surface 30 is provided on the surface with an etching stopper layer 30 that comprises a mixture of Al.sub.2 O.sub.3 with MgO, ZrO.sub.2, Ta.sub.2 O.sub.5 or HfO, or CrO.sub.x, CrN.sub.y, CrC.sub.z, CrO.sub.x N.sub.y, CrO.sub.x C.sub.z or CrO.sub.x N.sub.y C.sub.z, or MgF.sub.2-2x O.sub.y, CaF.sub.2-2x O.sub.y, LiF.sub.2-2x O.sub.y, BaF.sub.2-2x O.sub.y, La.sub.2 F.sub.6-2x O.sub.y or Ce.sub.2 F.sub.6-2x O.sub.y, whereby the etching stopper layer is allowed to etch a transparent film for a phase shifter surely and accurately, when making a phase shifter pattern by etching.
摘要翻译:本发明涉及一种相移光掩模,其中由能够提供蚀刻选择性优异并且可以中断和自动中断蚀刻的蚀刻阻挡层的材料制成的膜,并且提供至少包括基板30的相移光掩模和 由主要由氧化硅构成的材料制成的移相器图案,其直接设置在基板的表面上,或者设置在其间的不透明层37,所述相移光掩模的特征在于,表面30设置在表面上 蚀刻阻挡层30,其包含Al 2 O 3与MgO,ZrO 2,Ta 2 O 5或HfO,或CrO x,CrN y,CrC z,CrO x N y,CrO x C z或CrO x N y C z或MgF 2 -2 x O y,CaF 2 -2 x O y,LiF 2 -2 x O y,BaF 2 -2 x O y,La 2 F 6 -2xOy或Ce2F6-2x Oy,从而当通过蚀刻制造移相器图案时,可以确切地和准确地蚀刻蚀刻停止层用于移相器的透明膜。
摘要:
A halftone phase shift photomask having a sufficiently high transmittance for light of short wavelength and usable for high-resolution lithography effected by exposure using deep-ultraviolet+radiation, e.g., krypton fluoride excimer laser light. The halftone phase shift photomask has on a transparent substrate a halftone phase shift layer which includes at least one layer composed mainly of a chromium compound. The chromium compound contains at least fluorine atoms in addition to chromium atoms. A transmittance higher than a predetermined level can be obtained even in exposure carried out a relatively short wavelength. The photomask can be used for exposure using deep-ultraviolet+radiation, e.g., krypton fluoride excimer laser light (wavelength: 248 nm). Thus, high-resolution lithography can be realized. Since the photomask can be formed by approximately the same method as in the case of the conventional photomasks, it is possible to improve the yield and reduce the cost.
摘要:
The invention relates a halftone phase shift photomask and a blank therefor, which enables the transmittance of a phase shift portion to be varied even after blank or photomask fabrication, can accommodate to a variety of patterns, and can be fabricated on a mass scale. The exposure light transmittance of a halftone phase shift layer is arbitrarily variable within the range of 1% to 50%, inclusive, by exposing the blank or photomask to a high temperature elevated to at least 150.degree. C., to an oxidizing atmosphere, or to a reducing atmosphere at a step that can provided independent of the steps for film-forming or photomask fabrication step. This enables the exposure light transmittance of the halftone phase shift layer to be changed to any desired value after blank or photomask fabrication, and so an optimal halftone phase shift photomask to be obtained depending on the size, area, location, shape, and the like of the transferred pattern.
摘要:
A halftone phase shift photomask designed so that it is possible to shorten the photoengraving process, use a production line for a conventional photomask, prevent lowering of the contract between the transparent and semitransparent regions at a long wavelength in the visible region, which is used for inspection and measurement, and also prevent charge-up during electron beam exposure, and that ordinary physical cleaning process can be used for the halftone phase shift photomask. The halftone phase shift photomask has on a transparent substrate (1) a region which is semitransparent to exposure light and a region which is transparent to the exposure light so that the phase difference between light passing through the transparent region and light passing through the semitransparent region is substantially .pi. radians. A semitransparent film that constitutes the semitransparent region is arranged in the form of a multilayer film including layers (3, 4) of chromium or a chromium compound. For example, the layer (3) is formed of chromium oxide, chromium oxide nitride, chromium oxide carbide, or chromium oxide nitride carbide, and the layer (4) is formed of chromium or chromium nitride. The layer (3) mainly serves as a phase shift layer, while the layer (4) mainly serves as a transmittance control layer that suppresses the rise of transmittance at the long wavelength side. The semitransparent film is formed by physical vapor deposition.
摘要:
A halftone phase shift photomask having a sufficiently high transmittance for light of short wavelength and usable for high-resolution lithography effected by exposure using deep-ultraviolet+radiation, e.g., krypton fluoride excimer laser light. The halftone phase shift photomask has on a transparent substrate a halftone phase shift layer which includes at least one layer composed mainly of a chromium compound. The chromium compound contains at least fluorine atoms in addition to chromium atoms. A transmittance higher than a predetermined level can be obtained even in exposure carried out at a relatively short wavelength. The photomask can be used for exposure using deep-ultraviolet+radiation, e.g., krypton fluoride excimer laser light (wavelength: 248 nm). Thus, high-resolution lithography can be realized. Since the photomask can be formed by approximately the same method as in the case of the conventional photomasks, it is possible to improve the yield and reduce the cost.
摘要:
The invention relates a halftone phase shift photomask and a blank therefor, which enables the transmittance of a phase shift portion to be varied even after blank or photomask fabrication, can accommodate to a variety of patterns, and can be fabricated on a mass scale. The exposure light transmittance of a halftone phase shift layer is arbitrarily variable within the range of 1% to 50%, inclusive, by exposing the blank or photomask to a high temperature elevated to at least 150.degree. C., to an oxidizing atmosphere, or to a reducing atmosphere at a step that can provided independent of the steps for film-forming or photomask fabrication step. This enables the exposure light transmittance of the halftone phase shift layer to be changed to any desired value after blank or photomask fabrication, and so an optimal halftone phase shift photomask to be obtained depending on the size, area, location, shape, and the like of the transferred pattern.
摘要:
The invention provides a phase shift photomask which includes an etching stopper layer transparent to ultraviolet illumination light and well resistant to etching as well as chemicals, acids, etc., and enables a phase shift angle to be controlled with high accuracy. In a phase shift photomask including a transparent substrate 210, and an etching stopper layer 202 and at least a phase shifter pattern 204 stacked on the substrate in this order, the etching stopper layer 202 is composed predominantly of hafnium oxide.
摘要:
An overlying shifter type phase shift photomask used to produce semiconductor integrated circuits of high integration density, e.g. VLSI, ULSI, etc., which is capable of transferring fine-line patterns to a wafer by projection exposure. The photomask is produced by forming at least a light-blocking layer pattern or a combination of a light-blocking layer pattern and an etching stopper layer for a shifter layer on a transparent substrate, forming a shifter layer over the whole surface of the substrate, and then patterning the shifter layer to form a shifter layer pattern. The production method includes the step of polishing away unevenness on the surface of the shifter layer caused by a step which is produced by the light-blocking layer pattern, thereby leveling the surface of the shifter layer.
摘要:
An automatic control system controls a controlled variable serving as an object 2 to be controlled so that the object 2 approaches a predetermined target value, by means of an optimum regulator 4. The automatic control system include: a gain setting section 48 for setting a gain; a comparing section 48 for comparing the target value with the controlled variable serving as the object; and a weight control section 50 for weighting the gain set by the gain setting section so as to increase the weight from 0 to 1 within a predetermined period of time and for deriving a corrected manipulated variable in response to the time when a difference between the target value and the controlled variable comes within a range of a predetermined percentage of the target value, so that the corrected manipulated variable is added to the manipulated variable derived by the optimum regulator. Thus, the gain is controlled so as to gradually increase only within a restricted range, so that it is possible to quickly and accurately control an object.
摘要:
The invention relates to a phase shift photomask in which the peripheral region portion of a phase shift layer is removed by a relatively simple procedure and which has no or little defect and is inexpensive, a blank therefor, and a process for fabricating them. The process includes the steps of forming phase shift layer 23 all over the surface of one side of transparent substrate 21, and immersing only the peripheral region of substrate 21 in etching solution 25 to etch away the peripheral region of phase shift layer 23, whereby phase shift layer 27 is confined within an area smaller than that of substrate 21.