摘要:
A tough and heat resisting aluminum alloy comprising aluminum, a transition metal element and a rare earth element, and having a modulated structure which comprises an aluminum matrix and an intermetallic compound precipitated to form a network in the aluminum matrix. Also disclosed in a process for producing the aluminum alloy which comprises the steps of: rapid quenching and solidifying a liquid aluminum alloy at a quenching rate of 102 to 105 K/sec to obtain an aluminum-based supersaturated solid solution; and heat treating the quenched aluminum-based supersaturated solid solution at a heat treating temperature of 473 K or higher, the temperature increasing rate to the heat treating temperature being 1.5 K/sec or higher.
摘要:
An aluminum alloy is industrially producible and has higher strength and toughness than the prior art alloys. The high-strength high-toughness aluminum alloy includes a first phase of .alpha.-aluminum consisting of crystal grains whose mean crystal grain size is within the range of 60 to 1000 nm and a second phase of at least two different of intermetallic compounds consisting of crystal grains whose mean crystal grain sizes are within the range of 20 to 2000 nm. The crystal grains of the intermetallic compounds are dispersed so that they are only intermittently, and not continuously, linked throughout the alloy material.
摘要:
The invention offers an aluminum alloy that not only has high hardness accompanied by balanced ductility but also has high toughness and superior processability. The invention also offers a method for manufacturing an aluminum-alloy member that not only has high hardness accompanied by balanced ductility but also has high toughness and superior processability. The aluminum alloy comprises (1) not less than 0.1 wt. % and not more than 8 wt. % Constituent A comprising one or more kinds of elements selected from the group consisting of titanium, vanadium, hafnium, and zirconium, (2) not less than 0.1 wt. % and not more than 20 wt. % Constituent B comprising one or more kinds of elements selected from the group consisting of lanthanum, cerium, praseodymium, neodymium, mischmetal, calcium, strontium, and barium, and (3) not less than 0.1 wt. % and not more than 20 wt. % Constituent C comprising one or more kinds of elements selected from the group consisting of magnesium and lithium.
摘要:
An electric junction box having a casing and a circuit structure accommodated in the casing. The circuit structure includes a plurality of first bus bars arranged at intervals and synthetic resin members disposed between the adjacent first bus bars and firmly attached to the first bus bars. The synthetic resin members have heat conductivity higher than that of air. Since the heat generated from the first bus bars during electrical connecting can be transmitted to the synthetic resin members, the electric junction box can be prevented from being locally heated to a high temperature.
摘要:
An electric junction box having a casing and a circuit structure accommodated in the casing. The circuit structure includes a plurality of first bus bars arranged at intervals and synthetic resin members disposed between the adjacent first bus bars and firmly attached to the first bus bars. The synthetic resin members have heat conductivity higher than that of air. Since the heat generated from the first bus bars during electrical connecting can be transmitted to the synthetic resin members, the electric junction box can be prevented from being locally heated to a high temperature.
摘要:
An electric connection box has a circuit board, a conductive member (a first bus bar, a second bus bar, a first connection fitting, a second connection fitting, or a lead terminal) connected to the circuit board and extending in the direction away from the circuit board, a relay provided at the end of the conductive member which is located on the opposite side of the circuit board, and a case for receiving the circuit board and having an opening provided at a position corresponding to the relay. The relay is exposed at the opening to the outside of the case.
摘要:
A wafer holder is provided in which local heat radiation in supporting and heating wafers is kept under control and temperature uniformity of the wafer retaining surface is enhanced, and by making use of the wafer holder a semiconductor manufacturing apparatus suitable for processing larger-diameter wafers is made available. In a wafer holder (1) including within a ceramic substrate (2) a resistive heating element (3) or the like and being furnished with a lead (4) penetrating a reaction chamber (6), the lead (4) is housed in a tubular guide member (5), and an interval between the guide member (5) and the reaction chamber (6) as well as the interior of the guide member (5) are hermetically sealed. The guide member (5) and the ceramic substrate (2) are not joined together, and in the interior of the guide member (5) in which the inside is hermetically sealed, the atmosphere toward the ceramic substrate (2) is preferably substantially the same as the atmosphere in the reaction chamber (6).
摘要:
An electric junction box having a casing and a circuit structure accommodated in the casing. The circuit structure includes a plurality of first bus bars arranged at intervals and synthetic resin members disposed between the adjacent first bus bars and firmly attached to the first bus bars. The synthetic resin members have heat conductivity higher than that of air. Since the heat generated from the first bus bars during electrical connecting can be transmitted to the synthetic resin members, the electric junction box can be prevented from being locally heated to a high temperature.
摘要:
An electric connection box includes an electronic circuit board having an electronic component, and a power circuit board having a power circuit, which are disposed upright in a casing. A vertically-extending component area for mounting a heat generating component is formed on the power circuit board, so as not to face the electronic circuit board. A partition wall for separating the component area from the electronic circuit board is provided in the casing, and thereby a first air passage for allowing air to flow vertically along the component area is formed in the casing. A first inlet port connected to the first air passage is formed on the casing, and a first outlet port connected to the first air passage and positioned above the first inlet port is formed on the casing.
摘要:
Affords a holder for use in semiconductor or liquid-crystal manufacturing devices—as well as semiconductor or liquid-crystal manufacturing devices in which the holder is installed—in which temperature uniformity in the processed-object retaining face is heightened. Configuring the holder with, furnished atop a ceramic susceptor, a composite of a ceramic and a metal improves the temperature uniformity in the holder's processed-object retaining face and makes for curtailing the generation of particulates and other contaminants. In addition, putting a coating on at least the retaining face improves the durability of the holder. Installing a holder of this sort in a semiconductor manufacturing device or a liquid-crystal manufacturing device contributes to making available semiconductor or liquid-crystal manufacturing devices whose productivity and throughput are excellent.