公开(公告)号：US09793011B2

公开(公告)日：2017-10-17

申请号：US14646223

申请日：2012-11-21

Applicant: Hitachi, Ltd.

Inventor： Ryou Ishibashi ,  Takashi Naitou ,  Motomune Kodama ,  Takuya Aoyagi ,  Tetsushi Hino ,  Motoo Aoyama ,  Tsuneyuki Hashimoto ,  Katsuhito Takahashi ,  Junichi Sakano ,  Hiroshi Nakano

IPC: B32B17/06 ,  G21C3/34 ,  H05K1/03 ,  H05K1/18 ,  G21C3/07 ,  H05K7/20 ,  C03C8/18 ,  G21C3/20 ,  H01L23/15 ,  H01L23/473 ,  F28F19/02 ,  F28F21/00 ,  F28F21/04 ,  C03C8/14 ,  C03C8/24 ,  C04B37/02 ,  H01L23/373 ,  F28D7/16

CPC classification number: G21C3/34 ,  C03C8/14 ,  C03C8/18 ,  C03C8/24 ,  C04B37/025 ,  C04B2237/10 ,  C04B2237/365 ,  C04B2237/38 ,  C04B2237/403 ,  C04B2237/405 ,  C04B2237/407 ,  C04B2237/765 ,  C04B2237/84 ,  F28D7/16 ,  F28F19/02 ,  F28F21/006 ,  F28F21/04 ,  F28F2255/06 ,  G21C3/07 ,  G21C3/20 ,  H01L23/15 ,  H01L23/3735 ,  H01L23/473 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/181 ,  H05K1/0306 ,  H05K1/18 ,  H05K7/20509 ,  Y02E30/40 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: Provided is a structure including a first member (2); a second member (3) disposed opposite to the first member (2); and a glass layer (4) disposed between the first member (2) and the second member (3) so as to bond the first member (2) and the second member (3). A glass transition point of the glass layer (4) is lower than a temperature of the glass layer (4) under operation. In the glass layer (4), at least either of ceramic and metallic particles 4b, 4c is dispersed. In a temperature region lower than the glass transition point of the glass layer (4), a thermal expansion coefficient thereof falls in between thermal expansion coefficients of the first member (2) and the second member (3). This allows thermal strain caused within the structure (1) to be reduced when the structure (1) is operated at a higher temperature than a room temperature.