公开(公告)号：US12018710B2

公开(公告)日：2024-06-25

申请号：US17272043

申请日：2019-08-27

Applicant: Hitachi Automotive Systems, Ltd.

Inventor： Kenta Yakuzawa ,  Toshikazu Shigyo

IPC: F16B5/00 ,  C25D5/12 ,  F16B5/02 ,  F16J15/14 ,  H05K5/06

CPC classification number: F16B5/02 ,  C25D5/12 ,  F16J15/14 ,  H05K5/06 ,  H05K2201/0999

Abstract: An object of the invention is to provide an electronic control unit having a structure that suppresses corrosion of plating and completely seals the substrate side under an environment where corrosion occurs. An electronic control unit 1 includes a printed wiring board 10 in which electronic components are provided, a case 20 in which the printed wiring board 10 is accommodated, and a cover 22 that is provided on the case 20. The case 20 and the cover 22 have joint surfaces that face each other and are connected via a sealing material 28. The joint surface is provided with a screw 30 that passes through the cover 22 or the case 20. A plating 24 is provided in a surface of the case 20 or the cover 22 that is provided with a through hole through which the screw 30 penetrates. An exposed portion 25a of a base material formed by partially peeling off the plating 24 presents inside the case 20 or the cover 22 and on an inner side of the case 20 from the through hole. The sealing material 28 has penetrated into the exposed portion 25a of the base material.