公开(公告)号：US09666395B2

公开(公告)日：2017-05-30

申请号：US14903713

申请日：2014-05-16

申请人： Hitachi Automotive Systems, Ltd.

发明人： Shinjiro Watari ,  Shuichi Kokubun ,  Takeshi Yamada ,  Tsuyoshi Harada

IPC分类号： H01L23/28 ,  H01L29/16 ,  H01H45/04 ,  F02N11/08 ,  H05K5/02 ,  F02N15/06 ,  H05K3/34

CPC分类号： H01H45/04 ,  F02N11/087 ,  F02N15/067 ,  F02N2011/0874 ,  H01L23/28 ,  H01L29/16 ,  H01L2924/0002 ,  H05K3/34 ,  H05K5/0247 ,  H05K2201/1031 ,  H05K2201/10424 ,  Y02P70/611 ,  H01L2924/00

摘要： Provided is a power semiconductor module wherein stress generated at a soldering section of a relay terminal is relaxed. A power semiconductor module (1) is provided with a substrate (2), relay terminals (9, 10), external connecting terminals (13, 14) and a relay terminal holding member (6). The relay terminals (9, 10) are connected to the substrate (2) with a solder (4) therebetween. The external connecting terminals (13, 14) are bonded to the relay terminals (9, 10), respectively. The non-conductive relay terminal holding member (6) holds end portions of the relay terminals (9, 10) said end portions being on the side bonded to the solder (4).