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公开(公告)号：US20220414833A1
公开(公告)日：2022-12-29
申请号：US17749331
申请日：2022-05-20
Applicant: Hitachi High-Tech Corporation
Inventor： Kosuke FUKUDA , Masayoshi ISHIKAWA , Yasuhiro YOSHIDA , Hiroyuki SHINDO
Abstract: An inspection apparatus includes an image distortion estimation unit that estimates a distortion amount between a reference image and an inspection image, an image distortion correction unit that corrects the inspection image and/or the reference image using an estimated distortion amount, and an inspection unit that performs inspection using a corrected inspection image and the reference image or the inspection image and a corrected reference image. The image distortion estimation unit estimates a distortion amount in which only distortion occurring in an entire image can be corrected by adjustment of a correction condition.
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公开(公告)号：US20220335594A1
公开(公告)日：2022-10-20
申请号：US17716237
申请日：2022-04-08
Applicant: Hitachi High-Tech Corporation
Inventor： Yasushi EBIZUKA , Hiroyuki SHINDO , Ryugo KAGETANI
IPC: G06T7/00
Abstract: Provided are a defect inspection apparatus and a defect inspection method that can inspect various types of defects in a synthesized image. The defect inspection apparatus synthesizes a first detection signal from a first detector and a second detection signal from a second detector with a first synthesis ratio to generate a first synthesized image, and synthesizes the first detection signal and the second detection signal with a second synthesis ratio different from the first synthesis ratio to generate a second synthesized image. The defect inspection apparatus generates a first inspection image based on the first synthesized image and generates a second inspection image based on the second synthesized image. The defect inspection apparatus executes a logical operation on the first inspection image and the second inspection image to generate a synthesized inspection image. The defect inspection apparatus executes defect determination on the synthesized inspection image.
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公开(公告)号：US20230077332A1
公开(公告)日：2023-03-16
申请号：US17895264
申请日：2022-08-25
Applicant: Hitachi High-Tech Corporation
Inventor： Yuko SANO , Masayoshi ISHIKAWA , Hiroyuki SHINDO
IPC: G06T7/00 , G01N21/95 , G06T7/70 , G06V10/764 , G06V10/22 , G06V10/774 , G06V10/82
Abstract: A defect inspection system includes: a defect detection unit that detects defect positions in an inspection image by comparing an inspection image with a reference image that is an image having no defect; a filter model that classifies detected defect positions into false defect or a designated type of defect; a filter condition holding unit that holds a filter condition; a defect region extraction unit that collects the defect positions detected by the defect detection unit for each predetermined distance; a defect filter unit that determines whether or not each defect region satisfies the filter condition and extracts only the defect region that satisfies the filter condition; and a normalization unit that normalizes the inspection image based on a processing step at the time of inspection and a normalization condition set for each processing step or each imaging condition.
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4.发明申请公开(公告)号：US20210080485A1
公开(公告)日：2021-03-18
申请号：US16984813
申请日：2020-08-04
Applicant: Hitachi High-Tech Corporation
Inventor： Kenji YAMASAKI , Hiroyuki SHINDO , Taeko KASHIWA , Ryugo KAGETANI
Abstract: This invention is directed to a pattern height information correction system which includes a contour line information of a pattern extracted from an acquired image including at least an AFM (atomic force microscope) module, a design information database that stores design information including at least layer information, and a computer system that divides the extracted pattern into regions based on the design information stored in the design information database relating to the extracted pattern and associates the divided regions with layer information, in which the computer system specifies a horizontal region designated as horizontal in advance from the divided regions, creates an approximated curved surface based on the specified horizontal region corresponding to the same layer information, and corrects height information of the extracted pattern using the approximated curved surface.
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5.发明公开公开(公告)号：US20230222764A1
公开(公告)日：2023-07-13
申请号：US18009890
申请日：2020-06-16
Applicant: Hitachi High-Tech Corporation
Inventor： Masanori OUCHI , Masayoshi ISHIKAWA , Yasutaka TOYODA , Hiroyuki SHINDO
CPC classification number: G06V10/751 , G06T7/0006 , G06V10/758 , G06V10/761 , G06T2207/30148
Abstract: An image processing method whereby data pertaining to an estimated captured image obtained from reference data of a sample is acquired using an input acceptance unit, an estimation unit, and an output unit. The data is used when comparing the estimated image and an actual image of the sample, wherein the method includes: an input acceptance unit accepting input of the reference data, process information pertaining to the sample, and trained model data; the estimation unit using the reference data, the process information, and the model data to calculate captured image statistics representing a probabilistic distribution of values attained by the data of the captured image; and the output unit outputting the captured image statistics, and generating the estimated captured image from the captured image statistics. This permits reducing the time required for estimation and to perform comparison in real time.
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Patent Agency Ranking
公开(公告)号：US20230194253A1
公开(公告)日：2023-06-22
申请号：US17926651
申请日：2020-05-25
Applicant: Hitachi High-Tech Corporation
Inventor： Ryugo KAGETANI , Kaoru FUKAYA , Hiroyuki SHINDO
IPC: G01B15/04 , G01N23/2251
CPC classification number: G01B15/04 , G01N23/2251 , G01N2223/6116
Abstract: An object of the disclosure is to provide a pattern inspection and measurement apparatus that can accurately specify a corner point formed on a sample. The pattern inspection and measurement apparatus according to the disclosure specifies a pair of corner points as a corner pair candidate on design data, and specifies a corner point on an actually formed shape pattern in accordance with a relative relation between the corner pair candidate on the design data and the corner pair candidate in the shape pattern (see FIG. 13).
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公开(公告)号：US20220036116A1
公开(公告)日：2022-02-03
申请号：US17503438
申请日：2021-10-18
Applicant: Hitachi High-Tech Corporation
Inventor： Shinichi SHINODA , Yasutaka TOYODA , Shigetoshi SAKIMURA , Masayoshi ISHIKAWA , Hiroyuki SHINDO , Hitoshi SUGAHARA
Abstract: An object of the present invention is to achieve both suppression of data amount of an image processing system that learns a collation image to be used for image identification using a discriminator and improvement of identification performance of the discriminator. In order to achieve the above object, there is proposed an image processing system including a discriminator that identifies an image using a collation image, the image processing system further including a machine learning engine that performs machine learning of collation image data required for image identification. The machine learning engine searches for a successfully identified image using an image for which identification has been failed, and adds information, obtained based on a partial image of the image for which identification has been failed and which has been selected by an input device to the successfully identified image obtained by the search to generate corrected collation image data.
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公开(公告)号：US20250061559A1
公开(公告)日：2025-02-20
申请号：US18721543
申请日：2021-12-28
Applicant: Hitachi High-Tech Corporation
Inventor： Kosuke FUKUDA , Masayoshi ISHIKAWA , Yasuhiro YOSHIDA , Hiroyuki SHINDO
Abstract: Provided is an image inspection device which can prevent a degradation in the accuracy of an estimation value of a probability distribution caused by position displacement between design data and a captured image in image processing in which a model that estimates a pixel value probability distribution of a captured image is trained by using design data and the captured image of a sample. The image inspection device inspects a captured image by using design data and the capture image of a sample, the device being characterized by comprising: a training processing unit which trains a probability distribution estimation model that estimates, from the design data, a pixel value probability distribution of the captured image; and an inspection processing unit which inspects a captured image for inspection by using the probability distribution estimation model created in the training processing unit, design data for inspection, and the captured image for inspection, wherein the training processing unit includes: a probability distribution estimation unit which estimates, from sample design data for training, a pixel value probability distribution of a sample captured image for training; a position displacement amount estimation unit which estimates a position displacement amount between a probability distribution during training estimated by the probability distribution estimation unit, and the captured image for training; a position displacement reflection unit which reflects, to the probability distribution during training, the estimation position displacement amount estimated by the position displacement amount estimation unit; and a model update unit which evaluates the probability distribution estimation model of the probability distribution estimation unit by using the captured image for training and the probability distribution during training to which the position displacement calculated by the position displacement reflection unit has been reflected, and updates parameters of the probability distribution estimation model according to the evaluation values.
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公开(公告)号：US20240404043A1
公开(公告)日：2024-12-05
申请号：US18797711
申请日：2024-08-08
Applicant: Hitachi High-Tech Corporation
Inventor： Masanori OUCHI , Shinichi SHINODA , Yasutaka TOYODA , Ryou YUMIBA , Hiroyuki SHINDO
Abstract: The purpose of the present invention is to provide a computer program for achieving die-to-database inspection at high speed and with few false reports, and a semiconductor inspection device using the same. To achieve this purpose, the present invention proposes: a computer program comprising an encoder layer that is configured to determine the features of a design data image, and a decoder layer that is configured to generate, on the basis of a variation in an image (inspection target image) obtained by photographing an inspection target pattern, a statistic pertaining to the brightness values of pixels from feature values output by the encoder layer, wherein die-to-database inspection with few false reports can be achieved by comparing the inspection target image and the statistic obtained from the decoder layer and pertaining to the brightness values, and thereby detecting a defect region in the image; and a semiconductor inspection device using the same.
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公开(公告)号：US20230004811A1
公开(公告)日：2023-01-05
申请号：US17791967
申请日：2020-02-07
Applicant: Hitachi High-Tech Corporation
Inventor： Masayoshi ISHIKAWA , Masanori OUCHI , Hiroyuki SHINDO , Yasutaka TOYODA , Shinichi SHINODA
IPC: G06N3/08
Abstract: A learning processing device and method achieves learning of a lightweight model that is completed in a short amount of time. The learning processing device obtains a new, second learning model from an existing first learning model. An input unit acquires a first learning model generated in advance by learning a first learning data set, and an unpruned neural network (hereinafter, NN). An important parameter identification unit uses the first learning model and the NN to initialize a NN to be learned, and uses a second learning data set and the initialized NN to identify a degree of importance of parameters in a recognition process of the initialized NN. A new model generation unit carries out a pruning process for deleting parameters which are not important from the initialized NN, thereby generating a second NN; and a learning unit uses the second learning data set to learn the second NN.
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