公开(公告)号：US20240304563A1

公开(公告)日：2024-09-12

申请号：US18272746

申请日：2021-02-26

Applicant: Hitachi High-Tech Corporation

Inventor： Liang LI ,  Kosuke MATSUMOTO ,  Wei Chean TAN ,  Kyo RYO ,  Junji YAMAMOTO

IPC: H01L23/544 ,  G06T7/11 ,  G06T7/66 ,  G06T7/73

CPC classification number: H01L23/544 ,  G06T7/11 ,  G06T7/66 ,  G06T7/74 ,  G06T2207/30148 ,  H01L2223/54426

Abstract: The present invention specifies the position of a mark formed on a semiconductor wafer from an image of the semiconductor wafer. A mark 201 includes at least a first pattern 501 and a second pattern 502. The first and second patterns have an identical shape of line symmetry with respect to a first axis and a second axis that are orthogonal to each other, and are arranged so as to be point symmetric. A position specification method according to the present disclosure includes: a first procedure of setting a partial image region 301 to an image 200; a second procedure of dividing the partial image region on the basis of a division index 401, and setting a part of a region of a first divided image as a reference image 402; a third procedure of determining whether a mark exists in the partial image region; and a fourth procedure of calculating, when it is determined in the third procedure that a mark exists in the partial image region, a representative position of the mark in the partial image region.

公开(公告)号：US20230298310A1

公开(公告)日：2023-09-21

申请号：US18009783

申请日：2020-07-09

Applicant: Hitachi High-Tech Corporation

Inventor： Liang LI ,  Wataru NAGATOMO ,  Yuichi ABE

IPC: G06V10/75 ,  G06T5/50 ,  G06V10/60 ,  G06V10/74 ,  G06V10/774

CPC classification number: G06V10/7515 ,  G06T5/50 ,  G06V10/60 ,  G06V10/761 ,  G06V10/774 ,  G06T2207/10061 ,  G06T2207/20081 ,  G06T2207/20221

Abstract: The present disclosure proposes a pattern matching device capable of achieving matching processing that is characterized by involving a learning function even for a semiconductor pattern including a repetitive pattern, in particular. The pattern matching device pertaining to the present disclosure is provided with a learning unit for estimating a first correlation image having, as pixel values thereof, numerical values representing a correlation between a first image and a second image. The pattern matching device calculates a second correlation image having, as pixel values thereof, numerical values representing the correlation between a derivative image generated from the first image and the first image, and the learning unit performs learning so as to reduce the difference between the first correlation image and the second correlation image (refer to FIG. 1).

公开(公告)号：US20230071668A1

公开(公告)日：2023-03-09

申请号：US17800155

申请日：2020-02-20

Applicant: Hitachi High-Tech Corporation

Inventor： Liang LI ,  Yuichi ABE ,  Wataru NAGATOMO

IPC: G06T7/12 ,  G06V10/44 ,  G06V10/75 ,  G06V10/60

Abstract: A pattern matching apparatus includes a computer system configured to execute pattern matching processing between first pattern data based on design data 104 and second pattern data representing a captured image 102 of an electron microscope. The computer system acquires a first edge candidate group including one or more first edge candidates, acquires a selection-required number (the number of second edge candidates to be selected based on the second pattern data), acquires a second edge candidate group including the second edge candidates of the selection-required number, acquires an association evaluation value for each of different association combinations between the first edge candidate group and the second edge candidate group, selects one of the combinations based on the association evaluation value, and calculates a matching shift amount based on the selected combination.