公开(公告)号：US20230230886A1

公开(公告)日：2023-07-20

申请号：US18065698

申请日：2022-12-14

Applicant: Hitachi High-Tech Corporation

Inventor： Kenji YASUI ,  Mayuka OSAKI ,  Hitoshi NAMAI ,  Yuki OJIMA ,  Wataru NAGATOMO ,  Masami IKOTA ,  Maki KIMURA

IPC: H01L21/66 ,  G06T7/50 ,  G06T1/00

CPC classification number: H01L22/12 ,  G06T7/50 ,  G06T1/0007 ,  G06T2207/30148

Abstract: To provide a technique capable of quantitatively grasping a change in three-dimensional shape including a cross-sectional shape of a pattern within a surface of a wafer or between wafers in a non-destructive manner before cross-sectional observation. A processor system of a semiconductor inspection system acquires images captured by an electron microscope (SEM) for a sample (S102), calculates, for a reference region defined on a surface of the sample, first feature data corresponding to each of a plurality of locations in the reference region from the captured image (S103A), calculates a first statistical value based on the first feature data at the plurality of locations (S103B), calculates, for each of a plurality of evaluation regions defined as points or regions on the surface of the sample in correspondence with the reference region, second feature data corresponding to each of one or more locations in the evaluation region from the captured image, as feature data of the same type as the first feature data (S104A), and converts the second feature data using the first statistical value to obtain second feature data after conversion (S105).

公开(公告)号：US20230298310A1

公开(公告)日：2023-09-21

申请号：US18009783

申请日：2020-07-09

Applicant: Hitachi High-Tech Corporation

Inventor： Liang LI ,  Wataru NAGATOMO ,  Yuichi ABE

IPC: G06V10/75 ,  G06T5/50 ,  G06V10/60 ,  G06V10/74 ,  G06V10/774

CPC classification number: G06V10/7515 ,  G06T5/50 ,  G06V10/60 ,  G06V10/761 ,  G06V10/774 ,  G06T2207/10061 ,  G06T2207/20081 ,  G06T2207/20221

Abstract: The present disclosure proposes a pattern matching device capable of achieving matching processing that is characterized by involving a learning function even for a semiconductor pattern including a repetitive pattern, in particular. The pattern matching device pertaining to the present disclosure is provided with a learning unit for estimating a first correlation image having, as pixel values thereof, numerical values representing a correlation between a first image and a second image. The pattern matching device calculates a second correlation image having, as pixel values thereof, numerical values representing the correlation between a derivative image generated from the first image and the first image, and the learning unit performs learning so as to reduce the difference between the first correlation image and the second correlation image (refer to FIG. 1).

公开(公告)号：US20230071668A1

公开(公告)日：2023-03-09

申请号：US17800155

申请日：2020-02-20

Applicant: Hitachi High-Tech Corporation

Inventor： Liang LI ,  Yuichi ABE ,  Wataru NAGATOMO

IPC: G06T7/12 ,  G06V10/44 ,  G06V10/75 ,  G06V10/60

Abstract: A pattern matching apparatus includes a computer system configured to execute pattern matching processing between first pattern data based on design data 104 and second pattern data representing a captured image 102 of an electron microscope. The computer system acquires a first edge candidate group including one or more first edge candidates, acquires a selection-required number (the number of second edge candidates to be selected based on the second pattern data), acquires a second edge candidate group including the second edge candidates of the selection-required number, acquires an association evaluation value for each of different association combinations between the first edge candidate group and the second edge candidate group, selects one of the combinations based on the association evaluation value, and calculates a matching shift amount based on the selected combination.