公开(公告)号：US20150021304A1

公开(公告)日：2015-01-22

申请号：US13945509

申请日：2013-07-18

Applicant: Hitachi Via Mechanics, Ltd.

Inventor： Hidekatsu OZAWA

IPC: G06Q10/04 ,  B23K26/38 ,  H05K3/00

CPC classification number: G06Q10/043 ,  B23K26/02 ,  B23K26/04 ,  B23K26/0648 ,  B23K26/082 ,  B23K26/0853 ,  B23K26/38 ,  B23K26/382 ,  B23K26/40 ,  B23K2103/50 ,  H05K3/00 ,  H05K3/0005 ,  H05K3/0008 ,  H05K3/0026

Abstract: Variation in hole diameter due to heating effects is minimized even if the shortest machining route is set, and machining quality is improved. A printed circuit board to be scanned by a laser beam is divided into a plurality of scan areas (S1). An order of drilling within the scan area is sorted to obtain a scanning route with the shortest distance (S2). The order of the (N+1)th hole and the (N+2)th hole is swapped in each scanning area if it is determined that the distance between the Nth hole and the (N+1)th hole (here, N is an integer in a range of 1≦N≦“the maximum number of holes to be drilled in the area”−1″) is less than a predetermined threshold value, and that N+1 is not correspond to the maximum number of holes to be drilled in the scanning area (S3). The scanning area is machined and then machining each scanning area, specifically in machining the (N+1)th hole, after pausing for a period of a predetermined heat dissipation time if it is determined that the distance between the N-th hole and the (N+1)th hole swapped is less than the predetermined threshold value. Subsequently, machining is performed (S4).

Abstract translation: 即使设置最短的加工路径，并且加工质量得到改善，由于加热效果而导致的孔径的变化被最小化。 由激光束扫描的印刷电路板被划分为多个扫描区域（S1）。 对扫描区域内的钻孔顺序进行排序，得到距离最短的扫描路线（S2）。 如果确定第N孔和第（N + 1）孔之间的距离（这里为N（N + 1））孔，则在每个扫描区域中交替排列第（N + 1）孔和第（N + 是1＆nlE范围内的整数; N＆nlE;“区域”-1“中要钻孔的最大数量）小于预定阈值，并且N + 1不对应于最大孔数 在扫描区域中钻（S3）。 对扫描区域进行加工，然后加工每个扫描区域，特别是在第（N + 1）孔加工一段预定的散热时间后，如果确定第N个孔和 （N + 1）个孔小于预定阈值。 随后，进行加工（S4）。