公开(公告)号：US12049421B2

公开(公告)日：2024-07-30

申请号：US17121129

申请日：2020-12-14

Applicant: FATO AUTOMATION TECHNOLOGY CO., LTD

Inventor： Hongwen Shi ,  Hongwei Shi ,  Zhengwen Wang ,  Quanchuan Zhuang

IPC: B23K26/38 ,  B23K26/02 ,  B23K26/142 ,  B23K26/16 ,  B23K26/70 ,  C03B33/06 ,  C03B33/085

CPC classification number: C03B33/0855 ,  B23K26/02 ,  B23K26/142 ,  B23K26/16 ,  B23K26/38 ,  B23K26/702 ,  C03B33/06

Abstract: The present invention provides a cutting method and equipment of auxiliary packaging containers for testing. The method includes: step S001, material feeding; step S002, laser cutting; performs circumferential cutting of the part of the packaging container to be cut by the laser cutting device on the equipment body; step S003, waste gas treatment; step S004, material unloading; the equipment includes an equipment body and a clamping and positioning device and a laser cutting device, the clamping and positioning device is provided on the lower side of the laser cutting device and can be rotated relative to the laser cutting device; the equipment body is equipped with a waste gas discharge device; the cutting method and equipment of auxiliary packaging containers for testing provided by the present invention overcomes the defects of poor cutting effect, narrow application range, inconvenient cutting and low efficiency of the existing cutting methods of packaging containers.

公开(公告)号：US11945044B2

公开(公告)日：2024-04-02

申请号：US16452591

申请日：2019-06-26

Applicant: FANUC CORPORATION

Inventor： Takeshi Mochida

IPC: B23K26/00 ,  B23K26/02 ,  B23K26/082

CPC classification number: B23K26/0093 ,  B23K26/02 ,  B23K26/082

Abstract: In a control device for a laser machining apparatus including a plurality of lasers and a plurality of scanners which respectively scans laser beams outputted from the plurality of lasers, the control device includes: a laser control unit which controls the plurality of lasers, in which the laser control unit includes: a machining program analysis unit which analyzes a machining program, and generates a machining condition command for setting a machining condition of the plurality of lasers, a storage unit which stores machining condition information in which a plurality of the machining conditions and a plurality of the machining condition commands are respectively associated, and a plurality of machining condition reading units which references the machining condition information and reads a machining condition corresponding to a machining condition command analyzed by the machining program analysis unit, and sets the machining condition which was read in a laser of a control target.

公开(公告)号：US20180264589A1

公开(公告)日：2018-09-20

申请号：US15987218

申请日：2018-05-23

Applicant: Samsung Display Co., Ltd. ,  Fraunhofer Gesellschaft zur Foerderung der angewandten Forschung e.V.

Inventor： Jung-Min LEE ,  Alexander Olowinsky ,  Elmar GEHLEN ,  Heidrun KIND ,  Arnold GILLNER

IPC: B23K26/02 ,  H01L51/56 ,  H01L21/66 ,  H01L51/52

CPC classification number: B23K26/02 ,  H01L22/12 ,  H01L51/5246 ,  H01L51/56

Abstract: A laser beam irradiation apparatus including a laser source configured to emit light; a collimator configured to collimate the emitted light; a scanner configured to adjust the collimated light to change an irradiation direction thereof; a first lens part configured to focus the adjusted light to irradiate a laser beam on a sealing part; a camera configured to receive visible light passing through the scanner; a heat sensing part configured to receive infrared (IR) light passing through the scanner; and a control part configured to control a moving direction and an intensity of the laser beam.

公开(公告)号：US20180236607A1

公开(公告)日：2018-08-23

申请号：US15516517

申请日：2015-10-13

Applicant: AMADA HOLDINGS CO., LTD.

Inventor： Kenji MASUDA

IPC: B23K26/38 ,  B23K26/08 ,  G05B19/4155 ,  B23K26/02 ,  G05B19/416

CPC classification number: B23K26/38 ,  B23K26/00 ,  B23K26/02 ,  B23K26/08 ,  B23K2101/18 ,  G05B19/4155 ,  G05B19/416

Abstract: At a time of carrying out a laser cutting processing in a direction intersecting with a processing line at which the laser cutting processing for a work has been carried out, a laser cutting speed is decelerated before a laser beam reaches the processing line at an initial laser cutting speed, and the laser cutting speed is accelerated when an axial center of the laser beam is positioned within a prescribed range in vicinity of a central position of the processing line, and the laser cutting speed is returned to the initial laser cutting speed, in vicinity of a position at which the axial center of the laser beam crosses the processing line. Also, when the axial center of the laser beam and the central position of the processing line almost coincide, the laser output is made to be almost zero.

公开(公告)号：US20180161919A1

公开(公告)日：2018-06-14

申请号：US15835096

申请日：2017-12-07

Applicant: DISCO CORPORATION

Inventor： Hiroaki Yamada

IPC: B23K26/02 ,  B23K26/08 ,  B23K26/40

CPC classification number: B23K26/02 ,  B23K26/08 ,  B23K26/0876 ,  B23K26/359 ,  B23K26/364 ,  B23K26/40 ,  B23K26/60 ,  B23K26/70 ,  B23K2103/50 ,  H01L21/67092 ,  H01L21/67144 ,  H01L21/78 ,  H01L33/0095

Abstract: Disclosed herein is a dividing method of a workpiece including a dicing tape sticking step of sticking a dicing tape to the workpiece, a first laser processing step of irradiating the workpiece with a laser beam with such a wavelength as to be absorbed by the workpiece along a first direction to form first laser-processed grooves, a first expanding step of expanding the dicing tape in a second direction to enlarge the width of the first laser-processed grooves, a second laser processing step of irradiating the workpiece with the laser beam with such a wavelength as to be absorbed by the workpiece along the second direction to form second laser-processed grooves, and a second expanding step of expanding the dicing tape in the first direction to enlarge the width of the second laser-processed grooves.

公开(公告)号：US20180147664A1

公开(公告)日：2018-05-31

申请号：US15820709

申请日：2017-11-22

Applicant: Manz AG

Inventor： Martin FREUNDT ,  Ralf NEHER ,  Benjamin SCHMIEDER

IPC: B23K26/08 ,  B23K26/02 ,  B23K26/20 ,  B23K26/22

CPC classification number: B23K26/0861 ,  B23K26/02 ,  B23K26/037 ,  B23K26/20 ,  B23K26/206 ,  B23K26/22 ,  B23K37/0229 ,  B23K37/0408 ,  B23K2101/36

Abstract: A pressing system for a laser joining system for pressing together parts to be joined (storage cell, base plate) in the area of a joining point, includes a receptacle for accommodating the parts to be joined, a pressing element for locally pressing together the parts to be joined, in the area of the joining point, and a positioning system for the relative positioning of the pressing element and the receptacle and for pressing together the parts to be joined, during the joining process. The positioning system includes a parallel positioning device for the relative positioning of the receptacle and the pressing element in parallel to a plane (E), and an oblique positioning device for the relative positioning of the pressing element and the receptacle obliquely, in particular transversely, with respect to the plane (E) and for pressing together the parts to be joined, during the joining process.

公开(公告)号：US20170361401A1

公开(公告)日：2017-12-21

申请号：US15527124

申请日：2016-08-12

Applicant: LASER ENGINEERING APPLICATIONS

Inventor： Sébastien ESTIVAL ,  Paul-Etienne MARTIN ,  Axel KUPISIEWICZ

IPC: B23K26/06 ,  G02B5/122 ,  B23K26/02 ,  B23K26/382 ,  B23K26/38 ,  B23K26/046 ,  G02B27/28 ,  G02B26/10

CPC classification number: B23K26/0643 ,  B23K26/02 ,  B23K26/046 ,  B23K26/082 ,  B23K26/38 ,  B23K26/382 ,  B23K26/384 ,  G02B5/122 ,  G02B26/0816 ,  G02B26/101 ,  G02B26/105 ,  G02B27/286

Abstract: Machining device (100) comprising: a light source (33); an optial system (2) for obtaining a spatially offest outgoing light beam (7) remaining parallel to a given position upstream focusing means (9), said optical system (2) comprising: a movable mirror (19) such that its normal is able to depict a trajectory in a three-dimensional space, said optical system (2) being configured such that said first incident light beam (4) and said normal to the movable mirror (19) are separated by an angle (15) comprised between 0° and 15° for all possible positions and orientations of said movable mirror (19); driving means (6) for moving said movable mirror (19); a retro refletion system (21) able to provide a second incident light beam (8) parallel to a first refelected light beam (23) on said movable mirror (19); focusing means (9) for focusing outgoing light beam (7) on a target (10).

公开(公告)号：US20170282298A1

公开(公告)日：2017-10-05

申请号：US15423454

申请日：2017-02-02

Applicant: Fuji Jukogyo Kabushiki Kaisha

Inventor： Mayu Nakano ,  Takafumi Adachi

IPC: B23K26/356 ,  B23K26/00 ,  B23K26/02 ,  C21D10/00

CPC classification number: B23K26/356 ,  B23K26/009 ,  B23K26/0093 ,  B23K26/02 ,  B23K26/08 ,  B23K26/146 ,  C21D10/005

Abstract: According to one implementation, a laser peening processing device includes a laser peening processing device includes a laser oscillator, a nozzle and an inclining structure. The laser oscillator emits laser light. The nozzle condenses and irradiates the laser light toward a surface to be processed of a workpiece, with injecting liquid toward the surface to be processed. The inclining structure inclines at least one of the nozzle and the workpiece to make an injection direction of the liquid be different from a normal direction of the surface to be processed. The air bubbles arising by at least one of collision between the liquid and the surface to be processed and shock by irradiation of the laser light on the surface to be processed are flowed in a direction depending on an inclined direction of the surface to the injection direction of the liquid.

公开(公告)号：US20170120388A1

公开(公告)日：2017-05-04

申请号：US15337534

申请日：2016-10-28

Applicant: CITIC Dicastal CO., LTD

Inventor： Fengbao Luo ,  Ruixiao Zhou ,  Chuan Dai ,  Dengyao Li ,  Xiao Liu

IPC: B23K26/361 ,  B23K26/02 ,  B23K26/08 ,  B21D53/26

CPC classification number: B23K26/361 ,  B21D53/264 ,  B23K26/02 ,  B23K26/03 ,  B23K26/0604 ,  B23K26/0823 ,  B23K26/0838 ,  B23K26/0869 ,  B23K26/40 ,  B23K2101/006 ,  B23K2101/06 ,  B23K2103/10

Abstract: The present invention provides a device and method for laser cutting of aluminum alloy wheel blank burrs. The device includes a wheel hub lifting and locking mechanism and one or more groups of lasers mounted to a moving mechanism, and the moving mechanism comprises vertical guide columns (8) and horizontal guide columns (10) mounted to the vertical guide columns (8). During use, the device of the present invention can realize the function of online cutting of wheel burrs, thereby improving work efficiency and reducing manual labor, and the device has the characteristics of high cutting precision, rounded and burr-free cutting parts, stable performances, high degree of automation and the like.

公开(公告)号：US20160228982A1

公开(公告)日：2016-08-11

申请号：US15029753

申请日：2014-10-09

Applicant: AMADA HOLDINGS CO., LTD.

Inventor： Shigeyuki HAJI ,  Taisuke HIRASAWA

IPC: B23K26/00 ,  B23K26/02 ,  B23K26/70

CPC classification number: B23K26/00 ,  B23K26/02 ,  B23K26/08 ,  B23K26/38 ,  B23K26/706 ,  B23K37/0235 ,  B23K37/0408 ,  B23K2101/18

Abstract: A laser processing machine includes a machine main body that has a laser processing head, a processing table on which a workpiece to be processed is laid; and a light-shielding cover that is provided above the processing table, and covers an upper surface of the processing table. The cover is transformable between a deployed state and retracted state, and can adjust an area covering the upper surface of the processing table. According to the laser processing machine, it is possible to cover only a necessary area for laser processing by its compact cover without inhibiting workability for carrying in/out the workpiece.

Abstract translation: 激光加工机包括具有激光加工头的机器主体，放置待处理工件的加工台; 以及遮光罩，其设置在处理台的上方，覆盖处理台的上表面。 盖可在展开状态和缩回状态之间变形，并且可以调整覆盖处理台的上表面的区域。 根据激光加工机，可以仅通过其紧凑的盖覆盖激光加工所需的区域，而不会妨碍用于进出工件的加工性。