Alignment system and method and device manufactured thereby
    1.
    发明申请
    Alignment system and method and device manufactured thereby 有权
    对准系统及其制造方法和装置

    公开(公告)号:US20050254030A1

    公开(公告)日:2005-11-17

    申请号:US10845516

    申请日:2004-05-14

    IPC分类号: G03F7/20 G03B27/42 H01L21/027

    CPC分类号: G03B27/42 G03F9/7046

    摘要: An arrangement for and a method of automatically selecting substrate alignment marks on a substrate in a lithographic apparatus or overlay metrology targets in an overlay metrology apparatus. The apparatus has a processor and a memory connected to the processor. The memory stores locations of one or more sets of substrate alignment marks or overlay metrology targets available for selection and selection rules to select suitable substrate alignment marks or overlay metrology targets from this at least one set. The selection rules are based on experimental or theoretical knowledge about which substrate alignment mark or overlay metrology targets locations are optimal in dependence on one or more selection criteria.

    摘要翻译: 一种在光刻设备中的衬底上自动选择衬底对准标记的装置和方法,或者覆盖测量装置中的重叠度量目标。 该装置具有连接到处理器的处理器和存储器。 存储器存储可用于选择和选择规则的一组或多组衬底对准标记或重叠测量目标的位置,以从该至少一个组中选择合适的衬底对准标记或重叠度量目标。 选择规则基于关于哪个衬底对准标记或覆盖度量目标位置根据一个或多个选择标准是最佳的实验或理论知识。