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公开(公告)号：US10006826B2
公开(公告)日：2018-06-26
申请号：US15531488
申请日：2015-12-01
发明人： Satoshi Tsubata , Hiroyuki Sawamura
CPC分类号： G01L19/14 , B81B7/0041 , B81B2201/0264 , G01L9/0042 , G01L9/0051 , G01L19/142
摘要： A semiconductor pressure sensor device in which the shape or the structure of a connector portion can be easily changed and which has high waterproof performance. A terminal housing and a second case are engaged with each other via an engagement structure. The terminal housing and a first case are fitted with each other via a fitting structure. Thus, the first case and the second case are fixed to each other via the terminal housing. The first case is fitted in the second case. Then, the terminal housing is fitted with the first case, and the terminal housing is engaged with the second case substantially at the same time. Through such simple process, an opening portion of the first case is covered and a connector portion configured to enable external terminals to be connected to ends, located on one side, of a plurality of lead terminals is formed.
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公开(公告)号：US10718679B2
公开(公告)日：2020-07-21
申请号：US16095964
申请日：2017-04-26
发明人： Hiroyuki Sawamura , Toshiaki Ichii
摘要： A pressure sensor device with good temperature characteristics. An auxiliary fluid introduction path is provided in a bottom wall portion of a first case to introduce a fluid to the vicinity of a recessed portion of the bottom wall portion where an integrated circuit with a large change in temperature characteristics is mounted such that the temperature of the integrated circuit becomes the same as or close to the temperature of the fluid.
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公开(公告)号：US20190137351A1
公开(公告)日：2019-05-09
申请号：US16095964
申请日：2017-04-26
发明人： Hiroyuki Sawamura , Toshiaki Ichii
CPC分类号： G01L9/025 , G01L9/0042 , G01L19/0038 , G01L19/04 , G01L19/0627 , G01L19/143 , G01L19/148
摘要： A pressure sensor device with good temperature characteristics. An auxiliary fluid introduction path is provided in a bottom wall portion of a first case to introduce a fluid to t he vicinity of a recessed portion of the bottom wall portion where an integrated circuit with a large change in temperature characteristics is mounted such that the temperature of the integrated circuit becomes the same as or close to the temperature of the fluid.
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公开(公告)号：US20170328802A1
公开(公告)日：2017-11-16
申请号：US15531488
申请日：2015-12-01
发明人： Satoshi Tsubata , Hiroyuki Sawamura
CPC分类号： G01L19/14 , B81B7/0041 , B81B2201/0264 , G01L9/0042 , G01L9/0051
摘要： A semiconductor pressure sensor device in which the shape or the structure of a connector portion can be easily changed and which has high waterproof performance. A terminal housing and a second case are engaged with each other via an engagement structure. The terminal housing and a first case are fitted with each other via a fitting structure. Thus, the first case and the second case are fixed to each other via the terminal housing. The first case is fitted in the second case. Then, the terminal housing is fitted with the first case, and the terminal housing is engaged with the second case substantially at the same time. Through such simple process, an opening portion of the first case is covered and a connector portion configured to enable external terminals to be connected to ends, located on one side, of a plurality of lead terminals is formed.
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