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公开(公告)号：US10889887B2
公开(公告)日：2021-01-12
申请号：US15670487
申请日：2017-08-07
Applicant: Honeywell International Inc.
Inventor： Michael R. Pinter
IPC: C23C14/34 , C04B35/653 , C04B35/547 , C23C14/06 , C22C1/00 , H01J37/34
Abstract: In one embodiment, a physical vapor deposition device includes a phase change material sputtering target includes a primary matrix and at least one additional phase. The primary matrix includes at least one element from Group VI of the periodic table excluding oxygen and one or more elements from Group IV or Group V of the periodic table. The additional phase is substantially homogenously dispersed in the primary matrix.
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公开(公告)号：US10046417B2
公开(公告)日：2018-08-14
申请号：US15119453
申请日：2014-02-20
Applicant: Honeywell International Inc.
Inventor： Jianxing Li , Michael R. Pinter , Vikki L. Johnson
Abstract: A solder wire composition may include 85 to 95 weight percent bismuth, and at least 5 weight percent copper. The solder wire composition may have a diameter of less than about 1 millimeter, and an elongation at break of at least 20%.
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公开(公告)号：US11946132B2
公开(公告)日：2024-04-02
申请号：US17114216
申请日：2020-12-07
Applicant: Honeywell International Inc.
Inventor： Michael R. Pinter
IPC: C23C14/34 , C04B35/547 , C04B35/653 , C22C1/00 , C23C14/06 , H01J37/34
CPC classification number: C23C14/3407 , C04B35/547 , C04B35/653 , C22C1/00 , C23C14/0623 , C23C14/3414 , H01J37/3426 , H01J37/3429
Abstract: In one embodiment, a physical vapor deposition device includes a phase change material sputtering target includes a primary matrix and at least one additional phase. The primary matrix includes at least one element from Group VI of the periodic table excluding oxygen and one or more elements from Group IV or Group V of the periodic table. The additional phase is substantially homogenously dispersed in the primary matrix.
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公开(公告)号：US20180051370A1
公开(公告)日：2018-02-22
申请号：US15670487
申请日：2017-08-07
Applicant: Honeywell International Inc.
Inventor： Michael R. Pinter
IPC: C23C14/34
CPC classification number: C23C14/3407 , C04B35/547 , C04B35/653 , C22C1/00 , C23C14/0623 , C23C14/3414
Abstract: In one embodiment, a physical vapor deposition device includes a phase change material sputtering target includes a primary matrix and at least one additional phase. The primary matrix includes at least one element from Group VI of the periodic table excluding oxygen and one or more elements from Group IV or Group V of the periodic table. The additional phase is substantially homogenously dispersed in the primary matrix.
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公开(公告)号：US20150004427A1
公开(公告)日：2015-01-01
申请号：US14460844
申请日：2014-08-15
Applicant: HONEYWELL INTERNATIONAL INC.
Inventor： Jianxing Li , Michael R. Pinter , David E. Steele
CPC classification number: B23K35/282 , B23K35/025 , C22C1/02 , C22C18/04 , Y10T428/12
Abstract: A solder may include zinc, aluminum, magnesium and gallium. The zinc may be present in an amount from about 82% to 96% by weight of the solder. The aluminum may be present in an amount from about 3% to about 15% by weight of the solder. The magnesium may be present in an amount from about 0.5% to about 1.5% by weight of the solder. The gallium may be present in an amount between about 0.5% to about 1.5% by weight of the solder.
Abstract translation: 焊料可以包括锌，铝，镁和镓。 锌可以以焊料重量的约82％至96％的量存在。 铝可以以焊料重量的约3％至约15％的量存在。 镁可以以焊料重量的约0.5％至约1.5％的量存在。 镓可以以焊料重量的约0.5％至约1.5％的量存在。
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Patent Agency Ranking
公开(公告)号：US10661393B2
公开(公告)日：2020-05-26
申请号：US16035222
申请日：2018-07-13
Applicant: Honeywell International Inc.
Inventor： Jianxing Li , Michael R. Pinter , Vikki L. Johnson
Abstract: A solder wire composition may include 85 to 95 weight percent bismuth, and at least 5 weight percent copper. The solder wire composition may have a diameter of less than about 1 millimeter, and an elongation at break of at least 20%.
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公开(公告)号：US20180094340A1
公开(公告)日：2018-04-05
申请号：US15705989
申请日：2017-09-15
Applicant: Honeywell International Inc.
Inventor： Stephane Ferrasse , Frank C. Alford , Michael R. Pinter , Susan D. Strothers
CPC classification number: C22C21/08 , B21C23/001 , B21J5/002 , C22C1/026 , C22F1/002 , C22F1/047 , C23C14/3407 , H01J37/3435
Abstract: A method of forming a high strength aluminum alloy. The method comprises heating an aluminum material including scandium to a solutionizing temperature of the aluminum material such that scandium is dispersed throughout the aluminum material to form an aluminum alloy. The method further comprises extruding the aluminum alloy with equal channel angular extrusion to form a high strength aluminum alloy, such that the high strength aluminum alloy has a yield strength greater than about 40 ksi after being at a temperature from about 300° C. to about 400° C. for at least one hour.
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公开(公告)号：US20210095370A1
公开(公告)日：2021-04-01
申请号：US17114216
申请日：2020-12-07
Applicant: Honeywell International Inc.
Inventor： Michael R. Pinter
IPC: C23C14/34 , C04B35/653 , C04B35/547 , C23C14/06 , C22C1/00 , H01J37/34
Abstract: In one embodiment, a physical vapor deposition device includes a phase change material sputtering target includes a primary matrix and at least one additional phase. The primary matrix includes at least one element from Group VI of the periodic table excluding oxygen and one or more elements from Group IV or Group V of the periodic table. The additional phase is substantially homogenously dispersed in the primary matrix.
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公开(公告)号：US20170008131A1
公开(公告)日：2017-01-12
申请号：US15119453
申请日：2014-02-20
Applicant: HONEYWELL INTERNATIONAL INC
Inventor： Jianxing Li , Michael R. Pinter , Vikki L. Johnson
CPC classification number: B23K35/0227 , B21C23/08 , B23K35/264 , C22C12/00 , C22F1/16
Abstract: A solder wire composition may include 85 to 95 weight percent bismuth, and at least 5 weight percent copper. The solder wire composition may have a diameter of less than about 1 millimeter, and an elongation at break of at least 20%.
Abstract translation: 焊丝组合物可以包括85-95重量％的铋和至少5重量％的铜。 焊丝组合物可以具有小于约1毫米的直径，并且断裂伸长率至少为20％。
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公开(公告)号：US10900102B2
公开(公告)日：2021-01-26
申请号：US15705989
申请日：2017-09-15
Applicant: Honeywell International Inc.
Inventor： Stephane Ferrasse , Frank C. Alford , Michael R. Pinter , Susan D. Strothers
IPC: C23C14/35 , C22C21/08 , C22F1/047 , C23C14/34 , H01J37/34 , C22F1/00 , C22C1/02 , B21C23/00 , B21J5/00
Abstract: A method of forming a high strength aluminum alloy. The method comprises heating an aluminum material including scandium to a solutionizing temperature of the aluminum material such that scandium is dispersed throughout the aluminum material to form an aluminum alloy. The method further comprises extruding the aluminum alloy with equal channel angular extrusion to form a high strength aluminum alloy, such that the high strength aluminum alloy has a yield strength greater than about 40 ksi after being at a temperature from about 300° C. to about 400° C. for at least one hour.
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