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公开(公告)号：US20250095562A1
公开(公告)日：2025-03-20
申请号：US18572070
申请日：2023-09-07
Applicant: Honor Device Co., Ltd.
Inventor： Jian Bai , Jiehua Tang , Peng Wang
IPC: G09G3/3208
Abstract: A display method for a display panel, and an electronic device. The electronic device stores at least two compensation gray level relationships, a first compensation gray level relationship matches a first gray level range, a second compensation gray level relationship matches a second gray level range, the first compensation gray level relationship is fitted and generated based on an N-nomial algorithm, and the second compensation gray level relationship is obtained in a linear interpolation manner. A gray level value within the first gray level range is greater than a gray level value within the second gray level range. The method includes: obtaining a gray level value of each pixel of an input image; performing gray level compensation on the input image based on the gray level value of each pixel and the at least two compensation gray level relationships; and displaying a compensated image.
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公开(公告)号：US20240237194A9
公开(公告)日：2024-07-11
申请号：US18041767
申请日：2022-08-26
Applicant: Honor Device Co., Ltd.
Inventor： Junjie Yang , Erliang Li , Jian Bai , Xiaohang Li
CPC classification number: H05K1/0268 , H05K1/116 , H05K3/3485 , H05K9/0024 , H05K2201/035
Abstract: This application discloses a circuit board and a manufacturing method thereof, and a terminal device, and relates to the technical field of terminals, to resolve the problem of low reliability of connection between a radio frequency front-end circuit and a radio frequency back-end circuit in a circuit board of a terminal device in a related technology. The circuit board includes a substrate and a liquid metal body, where the substrate is provided with a radio frequency front-end circuit, a radio frequency back-end circuit, and a pad group, where the pad group includes a first pad electrically connected to the radio frequency front-end circuit and a second pad electrically connected to the radio frequency back-end circuit, and the second pad is spaced apart from the first pad; and the liquid metal body is arranged at a position of the pad group and connects the first pad to the second pad, so as to electrically connect the radio frequency front-end circuit to the radio frequency back-end circuit. This application may be applied to a terminal device such as a mobile phone.
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公开(公告)号：US12219695B2
公开(公告)日：2025-02-04
申请号：US18041767
申请日：2022-08-26
Applicant: Honor Device Co., Ltd.
Inventor： Junjie Yang , Erliang Li , Jian Bai , Xiaohang Li
Abstract: A circuit board and a manufacturing method thereof, and a terminal device, and relates to the technical field of terminals, to resolve the problem of low reliability of connection between a radio frequency front-end circuit and a radio frequency back-end circuit in a circuit board of a terminal device in a related technology. The circuit board includes a substrate and a liquid metal body, where the substrate is provided with a radio frequency front-end circuit, a radio frequency back-end circuit, and a pad group, where the pad group includes a first pad electrically connected to the radio frequency front-end circuit and a second pad electrically connected to the radio frequency back-end circuit, and the second pad is spaced apart from the first pad; and the liquid metal body is arranged at a position of the pad group and connects the first pad to the second pad.
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公开(公告)号：US20240138056A1
公开(公告)日：2024-04-25
申请号：US18041767
申请日：2022-08-25
Applicant: Honor Device Co., Ltd.
Inventor： Junjie Yang , Erliang Li , Jian Bai , Xiaohang Li
CPC classification number: H05K1/0268 , H05K1/116 , H05K3/3485 , H05K9/0024 , H05K2201/035
Abstract: This application discloses a circuit board and a manufacturing method thereof, and a terminal device, and relates to the technical field of terminals, to resolve the problem of low reliability of connection between a radio frequency front-end circuit and a radio frequency back-end circuit in a circuit board of a terminal device in a related technology. The circuit board includes a substrate and a liquid metal body, where the substrate is provided with a radio frequency front-end circuit, a radio frequency back-end circuit, and a pad group, where the pad group includes a first pad electrically connected to the radio frequency front-end circuit and a second pad electrically connected to the radio frequency back-end circuit, and the second pad is spaced apart from the first pad; and the liquid metal body is arranged at a position of the pad group and connects the first pad to the second pad, so as to electrically connect the radio frequency front-end circuit to the radio frequency back-end circuit. This application may be applied to a terminal device such as a mobile phone.
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