摘要:
Self-dispersing, hardenable epoxy resins produced by reacting one or more &agr;,&bgr;-unsaturated carboxylic acid esters with one or more aminopolyalkylene oxide compounds, reacting the thus formed intermediate with one or more polyhydroxy compounds, and reacting the thus formed intermediate with one or more polyepoxide compounds, are described. Processes for their production, aqueous dispersions containing the same and methods for their use are also described.
摘要:
Self-dispersing, hardenable epoxy resins produced by reacting one or more α,β-unsaturated carboxylic acid esters with one or more aminopolyalkylene oxide compounds, and reacting the thus formed intermediate with one or more polyepoxide compounds, are described. Processes for their production, aqueous dispersions containing the same and methods for their use are also described.
摘要:
Hardeners for epoxy resins produced by reacting one or more &agr;,&bgr;-unsaturated carboxylic acid esters with one or more aminopolyalkylene oxide compounds, reacting the thus formed intermediate with one or more polyhydroxy compounds, reacting the thus formed intermediate with one or more polyepoxide compounds, and reacting the thus formed intermediate with one or more amines are described. Processes for their production, aqueous dispersions containing the same and methods for their use are also described.
摘要:
Hardeners for epoxy resins produced by reacting one or more &agr;,&bgr;-unsaturated carboxylic acid esters with one or more aminopolyalkylene oxide compounds, reacting the thus formed intermediate with one or more polyepoxide compounds, and reacting the thus formed intermediate with one or more amines are described. Processes for their production, aqueous dispersions containing the same and methods for their use are also described.
摘要:
Self-dispersing, hardenable epoxy resins produced by reacting one or more α,β-unsaturated carboxylic acid esters with one or more aminopolyalkylene oxide compounds, and reacting the thus formed intermediate with one or more polyepoxide compounds, are described. Processes for their production, aqueous dispersions containing the same and methods for their use are also described.
摘要:
Hardeners for epoxy resins produced by reacting one or more &agr;,&bgr;-unsaturated carboxylic acid esters with one or more hydroxy compounds, reacting the thus formed intermediate with one or more aminopolyalkylene oxide compounds, reacting the thus formed intermediate with one or more polyepoxide compounds, and reacting the thus formed intermediate with one or more amines are described. Processes for their production, aqueous dispersions containing the same and methods for their use are also described.
摘要:
A self-dispersible curable epoxy resin composition containing a reaction product of: (a) 1.0 equivalent of epoxy resin; (b) 0.01 to 1.0 equivalent of polyhydric phenol; and (c) 0.005 to 0.5 equivalent of an amine/epoxy adduct formed by reacting: (i) an aromatic polyepoxide; and (ii) a polyoxyalkylenamine, in an equivalent ratio of from about 1:0.10 to 1:0.28.
摘要:
The present invention relates to adhesion-improved, curable compositions comprising a cyclic ether, a cyclic thiocarbonate, an amine and a carboxylic acid. A method of making such compositions and their use in adhesives, sealants and coatings are also provided.
摘要:
The present invention relates to primer compositions for adhesive bonding systems. The primer compositions may be in the form of sprayable aqueous dispersions, which are shelf stable at ambient temperatures for up to three months under ambient temperature conditions, and demonstrate a cure profile of 45 to 120 minutes within the temperature range of 220° F. to 350° F. within 60 minutes of application. Significantly, the inventive primer compositions are substantially free of chromate.
摘要:
Polyamides based on reaction products of C4-C18 dicarboxylic acids and diamines are suitable as molding compositions for the production of moldings in the low pressure injection molding process, and for adhesive sealing or filling in the production of electrical or electronic devices, in particular of plugs, cables, switches, sensors, transponders, modules, printed circuit boards or smart cards. In comparison with conventional molding compositions based in known hot melt adhesives, said polyamides exhibit higher strength values, higher abrasion resistance and higher chemical resistance.