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    Microelectromechanical systems microphone packaging systems
    1.
    发明授权
    Microelectromechanical systems microphone packaging systems 有权
    微机电系统麦克风包装系统

    公开(公告)号：US08421168B2

    公开(公告)日：2013-04-16

    申请号：US12947543

    申请日：2010-11-16

    申请人： Howard Allen ,  Luke England ,  Douglas Alan Hawks ,  Yong Liu ,  Stephen Martin

    发明人： Howard Allen ,  Luke England ,  Douglas Alan Hawks ,  Yong Liu ,  Stephen Martin

    IPC分类号： H01L29/84

    CPC分类号： B81B7/0041 ,  B81B2201/0257 ,  B81B2203/0127 ,  H01L2224/16245 ,  H01L2924/10155 ,  H04R31/00 ,  H04R2201/003

    摘要： This document discusses, among other things, a conductive frame, a silicon die coupled to the conductive frame, the silicon die including a vibratory diaphragm, the die having a silicon die top opposite a silicon die bottom, with a silicon die port extending through the silicon die to the vibratory diaphragm, with a silicon die terminal in electrical communication with the conductive frame and an insulator affixed to the conductive frame and the silicon die, with the insulator extending through interstices in the conductive frame to a conductive frame bottom of the conductive frame, and around an exterior of the silicon die to the silicon die top, with the insulator physically affixed to the silicon die and to the conductive frame, with the silicon die port exposed and with a conductive frame terminal disposed at the conductive frame bottom in electrical communication with the silicon die terminal.

    摘要翻译： 本文件尤其涉及导电框架，耦合到导电框架的硅芯片，包括振动膜片的硅模具，该模具具有与硅模底部相对的硅模顶部，硅模头端口延伸穿过 硅芯片连接到振动膜片，其中硅晶片端子与导电框架电连通，并且绝缘体固定到导电框架和硅模具，其中绝缘体延伸通过导电框架中的间隙到导电框架底部的导电 框架，并且围绕硅晶片的外部到硅晶片顶部，其中绝缘体物理地固定到硅晶片和导电框架，硅晶片端口暴露，导电框架端子设置在导电框架底部 与硅晶片端子进行电气通信。

    MICROELECTROMECHANICAL SYSTEMS MICROPHONE PACKAGING SYSTEMS
    2.
    发明申请
    MICROELECTROMECHANICAL SYSTEMS MICROPHONE PACKAGING SYSTEMS 有权
    微电子系统麦克风包装系统

    公开(公告)号：US20110121413A1

    公开(公告)日：2011-05-26

    申请号：US12947543

    申请日：2010-11-16

    申请人： Howard Allen ,  Luke England ,  Douglas Alan Hawks ,  Yong Liu ,  Stephen Martin

    发明人： Howard Allen ,  Luke England ,  Douglas Alan Hawks ,  Yong Liu ,  Stephen Martin

    IPC分类号： H01L29/84

    CPC分类号： B81B7/0041 ,  B81B2201/0257 ,  B81B2203/0127 ,  H01L2224/16245 ,  H01L2924/10155 ,  H04R31/00 ,  H04R2201/003

    摘要： This document discusses, among other things, a conductive frame, a silicon die coupled to the conductive frame, the silicon die including a vibratory diaphragm, the die having a silicon die top opposite a silicon die bottom, with a silicon die port extending through the silicon die to the vibratory diaphragm, with a silicon die terminal in electrical communication with the conductive frame and an insulator affixed to the conductive frame and the silicon die, with the insulator extending through interstices in the conductive frame to a conductive frame bottom of the conductive frame, and around an exterior of the silicon die to the silicon die top, with the insulator physically affixed to the silicon die and to the conductive frame, with the silicon die port exposed and with a conductive frame terminal disposed at the conductive frame bottom in electrical communication with the silicon die terminal.

    摘要翻译： 本文件尤其涉及导电框架，耦合到导电框架的硅芯片，包括振动膜片的硅模具，该模具具有与硅模底部相对的硅模顶部，硅模头端口延伸穿过 硅芯片连接到振动膜片，其中硅晶片端子与导电框架电连通，并且绝缘体固定到导电框架和硅模具，其中绝缘体延伸通过导电框架中的间隙到导电框架底部的导电 框架，并且围绕硅晶片的外部到硅晶片顶部，其中绝缘体物理地固定到硅晶片和导电框架，硅晶片端口暴露，导电框架端子设置在导电框架底部 与硅晶片端子进行电气通信。