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公开(公告)号：US20070279520A1
公开(公告)日：2007-12-06
申请号：US11676813
申请日：2007-02-20
IPC分类号： H04N5/238
CPC分类号： H04N5/2254 , H01L27/14618 , H01L27/14625 , H01L27/14627 , H01L27/14685 , H01L2224/13 , H04N5/2257
摘要： A package module for an image sensing device is provided. The package module includes a substrate having thereon a photoelectric element array, a first optical element array formed on the photoelectric element array, a package lid having thereon a second optical element array opposite to the first optical element array and having an arrangement corresponding to that of the first optical element array; and a spacer disposed on a bonding area between the package lid and the substrate for adjusting a distance between the package lid and the substrate.
摘要翻译： 提供了一种用于图像感测装置的封装模块。 封装模块包括其上具有光电元件阵列的基板，形成在光电元件阵列上的第一光学元件阵列，封装盖，其上具有与第一光学元件阵列相对的第二光学元件阵列，并且具有与 第一光学元件阵列; 以及间隔件，设置在封装盖和基板之间的接合区域上，用于调节封装盖和基板之间的距离。
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公开(公告)号：US07703997B2
公开(公告)日：2010-04-27
申请号：US11653297
申请日：2007-01-16
CPC分类号： H04N5/2254 , H01L27/14618 , H01L27/14625 , H01L27/1469 , H01L2924/16195 , H04N5/2257
摘要： An image sensor module comprises an image sensor chip, at least one lens layer, and at least one bonding layer. The image sensor chip has an image capturing zone manufactured with an image capturing element, and a partition zone surrounding the image capturing zone. The at least one lens layer is stacked on the image sensor chip, having a transparent substrate and a lens mounted on the transparent substrate and adapted to focus the projected image onto the image capturing zone of the image sensor chip. The at least one bonding layer is arranged corresponding to the partition zone of the image sensor chip and bonded between the image sensor chip and the at least one lens layer, mixing of a glue agent and a plurality of spacer elements with which the height of each the spacer elements is determined to be the height of the bonding layer.
摘要翻译： 图像传感器模块包括图像传感器芯片，至少一个透镜层和至少一个结合层。 图像传感器芯片具有由图像捕获元件制造的图像捕获区域和围绕图像捕获区域的分隔区域。 至少一个透镜层堆叠在图像传感器芯片上，具有透明基板和安装在透明基板上的透镜，并且适于将投影图像聚焦到图像传感器芯片的图像捕获区域上。 所述至少一个接合层被布置成对应于图像传感器芯片的分隔区并且结合在图像传感器芯片和至少一个透镜层之间，胶粘剂与多个间隔元件的混合，每个 间隔元件被确定为接合层的高度。
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公开(公告)号：US20070166029A1
公开(公告)日：2007-07-19
申请号：US11653297
申请日：2007-01-16
IPC分类号： G03B17/00
CPC分类号： H04N5/2254 , H01L27/14618 , H01L27/14625 , H01L27/1469 , H01L2924/16195 , H04N5/2257
摘要： An image sensor module comprises an image sensor chip, at least one lens layer, and at least one bonding layer. The image sensor chip has an image capturing zone manufactured with an image capturing element, and a partition zone surrounding the image capturing zone. The at least one lens layer is stacked on the image sensor chip, having a transparent substrate and a lens mounted on the transparent substrate and adapted to focus the projected image onto the image capturing zone of the image sensor chip. The at least one bonding layer is arranged corresponding to the partition zone of the image sensor chip and bonded between the image sensor chip and the at least one lens layer, mixing of a glue agent and a plurality of spacer elements with which the height of each the spacer elements is determined to be the height of the bonding layer.
摘要翻译： 图像传感器模块包括图像传感器芯片，至少一个透镜层和至少一个结合层。 图像传感器芯片具有由图像捕获元件制造的图像捕获区域和围绕图像捕获区域的分隔区域。 至少一个透镜层堆叠在图像传感器芯片上，具有透明基板和安装在透明基板上的透镜，并且适于将投影图像聚焦到图像传感器芯片的图像捕获区域上。 所述至少一个接合层被布置成对应于图像传感器芯片的分隔区并且结合在图像传感器芯片和至少一个透镜层之间，胶粘剂与多个间隔元件的混合，每个 间隔元件被确定为接合层的高度。
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公开(公告)号：US07826148B2
公开(公告)日：2010-11-02
申请号：US11706192
申请日：2007-02-15
CPC分类号： B29D11/00019 , B29D11/00375
摘要： Aspheric lens structures with dual aspheric surfaces and fabrication methods thereof are disclosed. An aspheric lens structure includes a first lens component with an aspheric top surface disposed on a second lens component, wherein the interface between the first lens component and the second lens component is spherical. The second lens component includes an aspheric back surface, wherein the radius of curvature of the aspheric top surface of the first lens component is different than the radius of curvature of the aspheric back surface of the second lens component. The second lens component may also include a planar back surface with a third lens component disposed on the planar back surface of the second component. The third lens component includes an aspheric back surface, wherein the radius of curvature of the aspheric top surface of the first lens component is different than the radius of curvature of the aspheric back surface of the third lens component.
摘要翻译： 公开了具有双非球面表面的非球面透镜结构及其制造方法。 非球面透镜结构包括具有设置在第二透镜部件上的非球面顶表面的第一透镜部件，其中第一透镜部件和第二透镜部件之间的界面是球形的。 第二透镜部件包括非球面后表面，其中第一透镜部件的非球面上表面的曲率半径不同于第二透镜部件的非球面后表面的曲率半径。 第二透镜部件还可以包括平面后表面，其中第三透镜部件设置在第二部件的平面后表面上。 第三透镜部件包括非球面后表面，其中第一透镜部件的非球面顶表面的曲率半径不同于第三透镜部件的非球面后表面的曲率半径。
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公开(公告)号：US20080198481A1
公开(公告)日：2008-08-21
申请号：US11706192
申请日：2007-02-15
CPC分类号： B29D11/00019 , B29D11/00375
摘要： Aspheric lens structures with dual aspheric surfaces and fabrication methods thereof are disclosed. An aspheric lens structure includes a first lens component with an aspheric top surface disposed on a second lens component, wherein the interface between the first lens component and the second lens component is spherical. The second lens component includes an aspheric back surface, wherein the radius of curvature of the aspheric top surface of the first lens component is different than the radius of curvature of the aspheric back surface of the second lens component. The second lens component may also include a planar back surface with a third lens component disposed on the planar back surface of the second component. The third lens component includes an aspheric back surface, wherein the radius of curvature of the aspheric top surface of the first lens component is different than the radius of curvature of the aspheric back surface of the third lens component.
摘要翻译： 公开了具有双非球面表面的非球面透镜结构及其制造方法。 非球面透镜结构包括具有设置在第二透镜部件上的非球面顶表面的第一透镜部件，其中第一透镜部件和第二透镜部件之间的界面是球形的。 第二透镜部件包括非球面后表面，其中第一透镜部件的非球面上表面的曲率半径不同于第二透镜部件的非球面后表面的曲率半径。 第二透镜部件还可以包括平面后表面，其中第三透镜部件设置在第二部件的平面后表面上。 第三透镜部件包括非球面后表面，其中第一透镜部件的非球面顶表面的曲率半径不同于第三透镜部件的非球面后表面的曲率半径。
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6.发明授权Optoelectronic device chip having a composite spacer structure and method making same 有权具有复合间隔结构的光电器件芯片及其制造方法公开(公告)号：US07433555B2
公开(公告)日：2008-10-07
申请号：US11438128
申请日：2006-05-22
申请人： Hsiao-Wen Lee , Peter Zung , Tzu-Han Lin , Tzy-Ying Lin , Chia-Yang Chang , Chien-Pang Lin
发明人： Hsiao-Wen Lee , Peter Zung , Tzu-Han Lin , Tzy-Ying Lin , Chia-Yang Chang , Chien-Pang Lin
CPC分类号： H01L27/14618 , H01L21/76898 , H01L23/481 , H01L27/14683 , H01L2223/6622 , H01L2224/274 , H01L2924/01079 , H01L2924/07811 , H01L2924/00
摘要： An optoelectronic device chip, and a method for making the chip, are disclosed. The chip comprises a device substrate, an optically transparent upper substrate, and a composite spacer layer which includes an adhesive material and a plurality of particles dispersed in said adhesive material. The distance between the device substrate and the upper substrate is controlled by the thickness of the composite spacer layer so that the variation is within the depth of focus of optical system.
摘要翻译： 公开了一种光电器件芯片及其制造方法。 芯片包括器件基板，光学透明上基板和复合间隔层，其包括粘合材料和分散在所述粘合材料中的多个颗粒。 器件基板和上基板之间的距离由复合间隔层的厚度控制，使得该变化在光学系统的焦深范围内。
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7.发明授权Optoelectronic device chip having a composite spacer structure and method making same 有权具有复合间隔结构的光电器件芯片及其制造方法公开(公告)号：US07860357B2
公开(公告)日：2010-12-28
申请号：US12228102
申请日：2008-08-09
申请人： Hsiao-Wen Lee , Peter Zung , Tzu-Han Lin , Tzy-Ying Lin , Chia-Yang Chang , Chien-Pang Lin
发明人： Hsiao-Wen Lee , Peter Zung , Tzu-Han Lin , Tzy-Ying Lin , Chia-Yang Chang , Chien-Pang Lin
IPC分类号： G02B6/12
CPC分类号： H01L27/14618 , H01L21/76898 , H01L23/481 , H01L27/14683 , H01L2223/6622 , H01L2224/274 , H01L2924/01079 , H01L2924/07811 , H01L2924/00
摘要： An optoelectronic device chip, and a method for making the chip, are disclosed. The chip comprises a device substrate, an optically transparent upper substrate, and a composite spacer layer which includes an adhesive material and a plurality of particles dispersed in said adhesive material. The distance between the device substrate and the upper substrate is controlled by the thickness of the composite spacer layer so that the variation is within the depth of focus of optical system.
摘要翻译： 公开了一种光电器件芯片及其制造方法。 芯片包括器件基板，光学透明上基板和复合间隔层，其包括粘合材料和分散在所述粘合材料中的多个颗粒。 器件基板和上基板之间的距离由复合间隔层的厚度控制，使得该变化在光学系统的焦深范围内。
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公开(公告)号：US20080303109A1
公开(公告)日：2008-12-11
申请号：US12228102
申请日：2008-08-09
申请人： Hsiao-Wen Lee , Peter Zung , Tzu-Han Lin , Tzy-Ying Lin , Chia-Yang Chang , Chien-Pang Lin
发明人： Hsiao-Wen Lee , Peter Zung , Tzu-Han Lin , Tzy-Ying Lin , Chia-Yang Chang , Chien-Pang Lin
IPC分类号： H01L31/0203
CPC分类号： H01L27/14618 , H01L21/76898 , H01L23/481 , H01L27/14683 , H01L2223/6622 , H01L2224/274 , H01L2924/01079 , H01L2924/07811 , H01L2924/00
摘要： An optoelectronic device chip, and a method for making the chip, are disclosed. The chip comprises a device substrate, an optically transparent upper substrate, and a composite spacer layer which includes an adhesive material and a plurality of particles dispersed in said adhesive material. The distance between the device substrate and the upper substrate is controlled by the thickness of the composite spacer layer so that the variation is within the depth of focus of optical system.
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9.发明申请Optoelectronic device chip having a composite spacer structure and method making same 有权具有复合间隔结构的光电器件芯片及其制造方法公开(公告)号：US20070267647A1
公开(公告)日：2007-11-22
申请号：US11438128
申请日：2006-05-22
申请人： Hsiao-Wen Lee , Peter Zung , Tzu-Han Lin , Tzy-Ying Lin , Chia-Yang Chang , Chien-Pang Lin
发明人： Hsiao-Wen Lee , Peter Zung , Tzu-Han Lin , Tzy-Ying Lin , Chia-Yang Chang , Chien-Pang Lin
IPC分类号： H01L33/00
CPC分类号： H01L27/14618 , H01L21/76898 , H01L23/481 , H01L27/14683 , H01L2223/6622 , H01L2224/274 , H01L2924/01079 , H01L2924/07811 , H01L2924/00
摘要： An optoelectronic device chip, and a method for making the chip, are disclosed. The chip comprises a device substrate, an optically transparent upper substrate, and a composite spacer layer which includes an adhesive material and a plurality of particles dispersed in said adhesive material. The distance between the device substrate and the upper substrate is controlled by the thickness of the composite spacer layer so that the variation is within the depth of focus of optical system.
摘要翻译： 公开了一种光电器件芯片及其制造方法。 芯片包括器件基板，光学透明上基板和复合间隔层，其包括粘合材料和分散在所述粘合材料中的多个颗粒。 器件基板和上基板之间的距离由复合间隔层的厚度控制，使得该变化在光学系统的焦深范围内。
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公开(公告)号：US08000041B1
公开(公告)日：2011-08-16
申请号：US12886129
申请日：2010-09-20
申请人： Chien-Pang Lin , San-Yuan Chung , Weng-Chu Chu
发明人： Chien-Pang Lin , San-Yuan Chung , Weng-Chu Chu
CPC分类号： G02B7/021 , B29D11/00375 , G02B13/001
摘要： According to an embodiment of the present invention, a lens module is provided, which includes a first lens assembly including a first patterned substrate, a first recess formed from a first surface of the first patterned substrate, a first lens element disposed in the first recess, and a second lens element disposed on the first patterned substrate, wherein the second lens element aligns along an optical axis through the first lens element.
摘要翻译： 根据本发明的实施例，提供了一种透镜模块，其包括第一透镜组件，该第一透镜组件包括第一图案化衬底，由第一图案化衬底的第一表面形成的第一凹部，设置在第一凹部 以及设置在第一图案化基板上的第二透镜元件，其中第二透镜元件沿着光轴对准穿过第一透镜元件。
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