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公开(公告)号：US07826148B2
公开(公告)日：2010-11-02
申请号：US11706192
申请日：2007-02-15
CPC分类号： B29D11/00019 , B29D11/00375
摘要： Aspheric lens structures with dual aspheric surfaces and fabrication methods thereof are disclosed. An aspheric lens structure includes a first lens component with an aspheric top surface disposed on a second lens component, wherein the interface between the first lens component and the second lens component is spherical. The second lens component includes an aspheric back surface, wherein the radius of curvature of the aspheric top surface of the first lens component is different than the radius of curvature of the aspheric back surface of the second lens component. The second lens component may also include a planar back surface with a third lens component disposed on the planar back surface of the second component. The third lens component includes an aspheric back surface, wherein the radius of curvature of the aspheric top surface of the first lens component is different than the radius of curvature of the aspheric back surface of the third lens component.
摘要翻译： 公开了具有双非球面表面的非球面透镜结构及其制造方法。 非球面透镜结构包括具有设置在第二透镜部件上的非球面顶表面的第一透镜部件，其中第一透镜部件和第二透镜部件之间的界面是球形的。 第二透镜部件包括非球面后表面，其中第一透镜部件的非球面上表面的曲率半径不同于第二透镜部件的非球面后表面的曲率半径。 第二透镜部件还可以包括平面后表面，其中第三透镜部件设置在第二部件的平面后表面上。 第三透镜部件包括非球面后表面，其中第一透镜部件的非球面顶表面的曲率半径不同于第三透镜部件的非球面后表面的曲率半径。
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公开(公告)号：US20080198481A1
公开(公告)日：2008-08-21
申请号：US11706192
申请日：2007-02-15
CPC分类号： B29D11/00019 , B29D11/00375
摘要： Aspheric lens structures with dual aspheric surfaces and fabrication methods thereof are disclosed. An aspheric lens structure includes a first lens component with an aspheric top surface disposed on a second lens component, wherein the interface between the first lens component and the second lens component is spherical. The second lens component includes an aspheric back surface, wherein the radius of curvature of the aspheric top surface of the first lens component is different than the radius of curvature of the aspheric back surface of the second lens component. The second lens component may also include a planar back surface with a third lens component disposed on the planar back surface of the second component. The third lens component includes an aspheric back surface, wherein the radius of curvature of the aspheric top surface of the first lens component is different than the radius of curvature of the aspheric back surface of the third lens component.
摘要翻译： 公开了具有双非球面表面的非球面透镜结构及其制造方法。 非球面透镜结构包括具有设置在第二透镜部件上的非球面顶表面的第一透镜部件，其中第一透镜部件和第二透镜部件之间的界面是球形的。 第二透镜部件包括非球面后表面，其中第一透镜部件的非球面上表面的曲率半径不同于第二透镜部件的非球面后表面的曲率半径。 第二透镜部件还可以包括平面后表面，其中第三透镜部件设置在第二部件的平面后表面上。 第三透镜部件包括非球面后表面，其中第一透镜部件的非球面顶表面的曲率半径不同于第三透镜部件的非球面后表面的曲率半径。
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3.发明申请Optoelectronic device chip having a composite spacer structure and method making same 有权具有复合间隔结构的光电器件芯片及其制造方法公开(公告)号：US20070267647A1
公开(公告)日：2007-11-22
申请号：US11438128
申请日：2006-05-22
申请人： Hsiao-Wen Lee , Peter Zung , Tzu-Han Lin , Tzy-Ying Lin , Chia-Yang Chang , Chien-Pang Lin
发明人： Hsiao-Wen Lee , Peter Zung , Tzu-Han Lin , Tzy-Ying Lin , Chia-Yang Chang , Chien-Pang Lin
IPC分类号： H01L33/00
CPC分类号： H01L27/14618 , H01L21/76898 , H01L23/481 , H01L27/14683 , H01L2223/6622 , H01L2224/274 , H01L2924/01079 , H01L2924/07811 , H01L2924/00
摘要： An optoelectronic device chip, and a method for making the chip, are disclosed. The chip comprises a device substrate, an optically transparent upper substrate, and a composite spacer layer which includes an adhesive material and a plurality of particles dispersed in said adhesive material. The distance between the device substrate and the upper substrate is controlled by the thickness of the composite spacer layer so that the variation is within the depth of focus of optical system.
摘要翻译： 公开了一种光电器件芯片及其制造方法。 芯片包括器件基板，光学透明上基板和复合间隔层，其包括粘合材料和分散在所述粘合材料中的多个颗粒。 器件基板和上基板之间的距离由复合间隔层的厚度控制，使得该变化在光学系统的焦深范围内。
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4.发明授权Optoelectronic device chip having a composite spacer structure and method making same 有权具有复合间隔结构的光电器件芯片及其制造方法公开(公告)号：US07860357B2
公开(公告)日：2010-12-28
申请号：US12228102
申请日：2008-08-09
申请人： Hsiao-Wen Lee , Peter Zung , Tzu-Han Lin , Tzy-Ying Lin , Chia-Yang Chang , Chien-Pang Lin
发明人： Hsiao-Wen Lee , Peter Zung , Tzu-Han Lin , Tzy-Ying Lin , Chia-Yang Chang , Chien-Pang Lin
IPC分类号： G02B6/12
CPC分类号： H01L27/14618 , H01L21/76898 , H01L23/481 , H01L27/14683 , H01L2223/6622 , H01L2224/274 , H01L2924/01079 , H01L2924/07811 , H01L2924/00
摘要： An optoelectronic device chip, and a method for making the chip, are disclosed. The chip comprises a device substrate, an optically transparent upper substrate, and a composite spacer layer which includes an adhesive material and a plurality of particles dispersed in said adhesive material. The distance between the device substrate and the upper substrate is controlled by the thickness of the composite spacer layer so that the variation is within the depth of focus of optical system.
摘要翻译： 公开了一种光电器件芯片及其制造方法。 芯片包括器件基板，光学透明上基板和复合间隔层，其包括粘合材料和分散在所述粘合材料中的多个颗粒。 器件基板和上基板之间的距离由复合间隔层的厚度控制，使得该变化在光学系统的焦深范围内。
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公开(公告)号：US20080303109A1
公开(公告)日：2008-12-11
申请号：US12228102
申请日：2008-08-09
申请人： Hsiao-Wen Lee , Peter Zung , Tzu-Han Lin , Tzy-Ying Lin , Chia-Yang Chang , Chien-Pang Lin
发明人： Hsiao-Wen Lee , Peter Zung , Tzu-Han Lin , Tzy-Ying Lin , Chia-Yang Chang , Chien-Pang Lin
IPC分类号： H01L31/0203
CPC分类号： H01L27/14618 , H01L21/76898 , H01L23/481 , H01L27/14683 , H01L2223/6622 , H01L2224/274 , H01L2924/01079 , H01L2924/07811 , H01L2924/00
摘要： An optoelectronic device chip, and a method for making the chip, are disclosed. The chip comprises a device substrate, an optically transparent upper substrate, and a composite spacer layer which includes an adhesive material and a plurality of particles dispersed in said adhesive material. The distance between the device substrate and the upper substrate is controlled by the thickness of the composite spacer layer so that the variation is within the depth of focus of optical system.
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6.发明授权Optoelectronic device chip having a composite spacer structure and method making same 有权具有复合间隔结构的光电器件芯片及其制造方法公开(公告)号：US07433555B2
公开(公告)日：2008-10-07
申请号：US11438128
申请日：2006-05-22
申请人： Hsiao-Wen Lee , Peter Zung , Tzu-Han Lin , Tzy-Ying Lin , Chia-Yang Chang , Chien-Pang Lin
发明人： Hsiao-Wen Lee , Peter Zung , Tzu-Han Lin , Tzy-Ying Lin , Chia-Yang Chang , Chien-Pang Lin
CPC分类号： H01L27/14618 , H01L21/76898 , H01L23/481 , H01L27/14683 , H01L2223/6622 , H01L2224/274 , H01L2924/01079 , H01L2924/07811 , H01L2924/00
摘要： An optoelectronic device chip, and a method for making the chip, are disclosed. The chip comprises a device substrate, an optically transparent upper substrate, and a composite spacer layer which includes an adhesive material and a plurality of particles dispersed in said adhesive material. The distance between the device substrate and the upper substrate is controlled by the thickness of the composite spacer layer so that the variation is within the depth of focus of optical system.
摘要翻译： 公开了一种光电器件芯片及其制造方法。 芯片包括器件基板，光学透明上基板和复合间隔层，其包括粘合材料和分散在所述粘合材料中的多个颗粒。 器件基板和上基板之间的距离由复合间隔层的厚度控制，使得该变化在光学系统的焦深范围内。
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7.发明授权公开(公告)号：US06858353B2
公开(公告)日：2005-02-22
申请号：US10196974
申请日：2002-07-17
摘要： An increased-contrast film for high-transmittance attenuated phase-shift masks (PSM's) is disclosed. A high-transmittance attenuated PSM includes a clear substrate, a shifter film selectively covering the clear substrate, and an increased-contrast film covering the shifter film to aid inspection of the PSM. The increased-contrast film may be removable, and may be photoresist. The increased-contrast film is preferably non-reactive to light used during the inspection of the PSM.
摘要翻译： 公开了一种用于高透光率衰减相移掩模（PSM's）的增强对比度膜。 高透光衰减PSM包括透明衬底，选择性地覆盖透明衬底的移位膜和覆盖移位膜的增加对比度膜以辅助PSM的检查。 增加的对比度膜可以是可去除的，并且可以是光致抗蚀剂。 增强对比度膜优选对于在PSM的检查期间使用的光是非反应性的。
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公开(公告)号：US20120194915A1
公开(公告)日：2012-08-02
申请号：US13280975
申请日：2011-10-25
申请人： Han-Lin WU , Chih-Chiang Ho , Lin-Ya Tseng , Chia-Yang Chang , Kuo-Jung Fu
发明人： Han-Lin WU , Chih-Chiang Ho , Lin-Ya Tseng , Chia-Yang Chang , Kuo-Jung Fu
IPC分类号： G02B27/12
CPC分类号： G02B3/0056 , G02B3/0031 , Y10S359/90
摘要： A method for forming a lens assembly is provided, including: providing a mold substrate, wherein at least a recess is formed from a surface of the mold substrate; providing a transparent substrate; disposing a lens precursor material on the surface of the mold substrate or on a first surface of the transparent substrate; disposing the mold substrate on the transparent substrate such that at least a portion of the lens precursor material is filled in the recess; disposing a mask on a second surface of the transparent substrate to partially cover the transparent substrate; after the mask is disposed, irradiating a light on the second surface of the transparent substrate to transform at least a portion of the lens precursor material on the first surface of the transparent substrate into a lens; and removing the mask and the mold substrate from the transparent substrate and the lens.
摘要翻译： 提供了一种用于形成透镜组件的方法，包括：提供模具基板，其中至少一个凹部由模具基板的表面形成; 提供透明基板; 在所述模具基板的表面上或所述透明基板的第一表面上设置透镜前体材料; 将所述模具基板设置在所述透明基板上，使得所述透镜前体材料的至少一部分填充在所述凹部中; 在所述透明基板的第二表面上设置掩模以部分地覆盖所述透明基板; 在掩模设置之后，将光照射在透明基板的第二表面上，以将透明基板的第一表面上的透镜前体材料的至少一部分转换成透镜; 以及从透明基板和透镜去除掩模和模具基板。
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公开(公告)号：US07796337B2
公开(公告)日：2010-09-14
申请号：US11717128
申请日：2007-03-13
IPC分类号： G02B27/10
CPC分类号： B29D11/00365
摘要： An optical microstructure plate and mold for fabricating the same is disclosed. The optical microstructure plate comprises a substrate. An optical microstructure element is formed on the substrate. A period alignment mark is disposed on the substrate to provide alignment for fabricating the optical microstructure element by a mold. A universal alignment mark is disposed on the substrate to provide alignment for bonding another plate therewith. Specifically, the mold comprises a concave within a mold substrate, a spoiler around the concave, and a buffer zone adjacent to the spoiler.
摘要翻译： 公开了一种用于制造它的光学微结构板和模具。 光学微结构板包括基底。 在基板上形成光学微结构元件。 周期对准标记设置在基板上以提供用于通过模具制造光学微结构元件的对准。 通用对准标记设置在基板上以提供用于将另一个板粘合的对准。 具体地，模具包括在模具基板内的凹部，围绕凹部的扰流板和与扰流板相邻的缓冲区域。
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公开(公告)号：US20090179138A1
公开(公告)日：2009-07-16
申请号：US12007887
申请日：2008-01-16
CPC分类号： G03F7/0002 , B29C33/10 , B29C33/3857 , B29C33/40 , B82Y10/00 , B82Y40/00
摘要： Soft mold and fabrication method thereof. The soft mold of the present invention comprises: a polymer layer having a printing pattern on a first surface thereof; at least one air channel on the first surface; and a back-plate attached to a second surface of the polymer layer. Additionally, the method for fabricating the soft mold includes: providing a mold having a predetermined pattern; positioning the mold in a cavity and calibrating the horizontal thereof; forming a polymer layer on the mold; attaching a back-plate to a top surface of the polymer layer and the dam; separating the polymer layer from the mold, wherein the polymer layer has a patterned surface; and cutting at least one air channel on the patterned surface of the polymer layer.
摘要翻译： 软模具及其制造方法。 本发明的软模具包括：在其第一表面上具有印刷图案的聚合物层; 在所述第一表面上的至少一个空气通道; 以及附接到聚合物层的第二表面的背板。 另外，制造软模具的方法包括：提供具有预定图案的模具; 将模具定位在空腔中并校准其水平面; 在模具上形成聚合物层; 将背板附接到聚合物层和坝的顶表面; 将聚合物层与模具分离，其中聚合物层具有图案化表面; 以及在聚合物层的图案化表面上切割至少一个空气通道。
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