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    Image sensor module having precise image-projection control
    5.
    发明授权
    Image sensor module having precise image-projection control 有权
    图像传感器模块具有精确的图像投影控制

    公开(公告)号：US07703997B2

    公开(公告)日：2010-04-27

    申请号：US11653297

    申请日：2007-01-16

    申请人： Hsiao-Wen Lee ,  Tzu-Han Lin ,  Pai-Chun Peter Zung ,  Chien-Pang Lin

    发明人： Hsiao-Wen Lee ,  Tzu-Han Lin ,  Pai-Chun Peter Zung ,  Chien-Pang Lin

    IPC分类号： G03B17/00 ,  H04N5/335 ,  H04N5/225 ,  G02B7/02

    CPC分类号： H04N5/2254 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/1469 ,  H01L2924/16195 ,  H04N5/2257

    摘要： An image sensor module comprises an image sensor chip, at least one lens layer, and at least one bonding layer. The image sensor chip has an image capturing zone manufactured with an image capturing element, and a partition zone surrounding the image capturing zone. The at least one lens layer is stacked on the image sensor chip, having a transparent substrate and a lens mounted on the transparent substrate and adapted to focus the projected image onto the image capturing zone of the image sensor chip. The at least one bonding layer is arranged corresponding to the partition zone of the image sensor chip and bonded between the image sensor chip and the at least one lens layer, mixing of a glue agent and a plurality of spacer elements with which the height of each the spacer elements is determined to be the height of the bonding layer.

    摘要翻译： 图像传感器模块包括图像传感器芯片，至少一个透镜层和至少一个结合层。 图像传感器芯片具有由图像捕获元件制造的图像捕获区域和围绕图像捕获区域的分隔区域。 至少一个透镜层堆叠在图像传感器芯片上，具有透明基板和安装在透明基板上的透镜，并且适于将投影图像聚焦到图像传感器芯片的图像捕获区域上。 所述至少一个接合层被布置成对应于图像传感器芯片的分隔区并且结合在图像传感器芯片和至少一个透镜层之间，胶粘剂与多个间隔元件的混合，每个 间隔元件被确定为接合层的高度。

    Image sensor module having precise image-projection control
    6.
    发明申请
    Image sensor module having precise image-projection control 有权
    图像传感器模块具有精确的图像投影控制

    公开(公告)号：US20070166029A1

    公开(公告)日：2007-07-19

    申请号：US11653297

    申请日：2007-01-16

    申请人： Hsiao-Wen Lee ,  Tzu-Han Lin ,  Pai-Chun Peter Zung ,  Chien-Pang Lin

    发明人： Hsiao-Wen Lee ,  Tzu-Han Lin ,  Pai-Chun Peter Zung ,  Chien-Pang Lin

    IPC分类号： G03B17/00

    CPC分类号： H04N5/2254 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/1469 ,  H01L2924/16195 ,  H04N5/2257

    摘要： An image sensor module comprises an image sensor chip, at least one lens layer, and at least one bonding layer. The image sensor chip has an image capturing zone manufactured with an image capturing element, and a partition zone surrounding the image capturing zone. The at least one lens layer is stacked on the image sensor chip, having a transparent substrate and a lens mounted on the transparent substrate and adapted to focus the projected image onto the image capturing zone of the image sensor chip. The at least one bonding layer is arranged corresponding to the partition zone of the image sensor chip and bonded between the image sensor chip and the at least one lens layer, mixing of a glue agent and a plurality of spacer elements with which the height of each the spacer elements is determined to be the height of the bonding layer.

    摘要翻译： 图像传感器模块包括图像传感器芯片，至少一个透镜层和至少一个结合层。 图像传感器芯片具有由图像捕获元件制造的图像捕获区域和围绕图像捕获区域的分隔区域。 至少一个透镜层堆叠在图像传感器芯片上，具有透明基板和安装在透明基板上的透镜，并且适于将投影图像聚焦到图像传感器芯片的图像捕获区域上。 所述至少一个接合层被布置成对应于图像传感器芯片的分隔区并且结合在图像传感器芯片和至少一个透镜层之间，胶粘剂与多个间隔元件的混合，每个 间隔元件被确定为接合层的高度。

    Wafer level image module
    7.
    发明申请
    Wafer level image module 有权
    晶圆级图像模块

    公开(公告)号：US20070070511A1

    公开(公告)日：2007-03-29

    申请号：US11528461

    申请日：2006-09-28

    申请人： Hsiao-Wen Lee ,  Pai-Chun Peter Zung ,  Tzu-Han Lin

    发明人： Hsiao-Wen Lee ,  Pai-Chun Peter Zung ,  Tzu-Han Lin

    IPC分类号： G02B21/02

    CPC分类号： H04N5/2254 ,  H04N5/2257

    摘要： A wafer level image module includes a photo sensor for outputting an electrical signal upon receiving light, a lens set for focusing incident light onto the photo sensor, and an adjustment member disposed between the photo sensor and the lens set for controlling the distance between the photo sensor and the lens set to compensate the focus offset of the photo sensor for enabling the lens set to accurately focus the incident light onto the photo sensor in an in-focus manner so as to provide a high image quality.

    摘要翻译： 晶片级图像模块包括用于在接收光时输出电信号的光传感器，用于将入射光聚焦到光传感器上的透镜组以及设置在光传感器和透镜组之间的调节构件，用于控制照片之间的距离 传感器和透镜设置以补偿光传感器的聚焦偏移，以使透镜组能够以聚焦方式精确地将入射光聚焦到光传感器上，从而提供高图像质量。

    Method for making wafer level image module
    8.
    发明授权
    Method for making wafer level image module 有权
    制造晶圆级图像模块的方法

    公开(公告)号：US08524521B2

    公开(公告)日：2013-09-03

    申请号：US12539309

    申请日：2009-08-11

    申请人： Hsiao-Wen Lee ,  Pai-Chun Peter Zung ,  Tzu-Han Lin

    发明人： Hsiao-Wen Lee ,  Pai-Chun Peter Zung ,  Tzu-Han Lin

    IPC分类号： H01L21/00

    CPC分类号： H04N5/2254 ,  H04N5/2257

    摘要： A wafer level image module includes a photo sensor for outputting an electrical signal upon receiving light, a lens set for focusing incident light onto the photo sensor, and an adjustment member disposed between the photo sensor and the lens set for controlling the distance between the photo sensor and the lens set to compensate the focus offset of the photo sensor for enabling the lens set to accurately focus the incident light onto the photo sensor in an in-focus manner so as to provide a high image quality.

    摘要翻译： 晶片级图像模块包括用于在接收光时输出电信号的光传感器，用于将入射光聚焦到光传感器上的透镜组以及设置在光传感器和透镜组之间的调节构件，用于控制照片之间的距离 传感器和透镜设置以补偿光传感器的聚焦偏移，以使透镜组能够以聚焦方式精确地将入射光聚焦到光传感器上，从而提供高图像质量。

    Wafer level image module
    9.
    发明授权
    Wafer level image module 有权
    晶圆级图像模块

    公开(公告)号：US07592680B2

    公开(公告)日：2009-09-22

    申请号：US11528461

    申请日：2006-09-28

    申请人： Hsiao-Wen Lee ,  Pai-Chun Peter Zung ,  Tzu-Han Lin

    发明人： Hsiao-Wen Lee ,  Pai-Chun Peter Zung ,  Tzu-Han Lin

    IPC分类号： H01L27/14

    CPC分类号： H04N5/2254 ,  H04N5/2257

    摘要： A wafer level image module includes a photo sensor for outputting an electrical signal upon receiving light, a lens set for focusing incident light onto the photo sensor, and an adjustment member disposed between the photo sensor and the lens set for controlling the distance between the photo sensor and the lens set to compensate the focus offset of the photo sensor for enabling the lens set to accurately focus the incident light onto the photo sensor in an in-focus manner so as to provide a high image quality.

    摘要翻译： 晶片级图像模块包括用于在接收光时输出电信号的光传感器，用于将入射光聚焦到光传感器上的透镜组以及设置在光传感器和透镜组之间的调节构件，用于控制照片之间的距离 传感器和透镜设置以补偿光传感器的聚焦偏移，以使透镜组能够以聚焦方式精确地将入射光聚焦到光传感器上，从而提供高图像质量。

    Method of fabricating isolation structures for CMOS image sensor chip scale packages
    10.
    发明授权
    Method of fabricating isolation structures for CMOS image sensor chip scale packages 有权
    制造CMOS图像传感器芯片级封装的隔离结构的方法

    公开(公告)号：US07833810B2

    公开(公告)日：2010-11-16

    申请号：US12493758

    申请日：2009-06-29

    申请人： Tzu-Han Lin ,  Tzy-Ying Lin ,  Fang-Chang Liu ,  Kai-Chih Wang

    发明人： Tzu-Han Lin ,  Tzy-Ying Lin ,  Fang-Chang Liu ,  Kai-Chih Wang

    IPC分类号： H01L21/00 ,  H01L23/544

    CPC分类号： H01L27/14618 ,  H01L24/05 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2924/01078 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/3025 ,  H01L2924/00

    摘要： Isolation structure for CMOS image sensor device chip scale packages and fabrication methods thereof. A CMOS image sensor chip scale package includes a transparent substrate configured as a support structure for the package. The transparent substrate includes a first cutting edge and a second cutting edge. A CMOS image sensor die with a die circuitry is mounted on the transparent substrate. An encapsulant is disposed on the substrate encapsulating the CMOS image sensor die. A connection extends from the die circuitry to a plurality of terminal contacts for the package on the encapsulant, wherein the connection is exposed by the first cutting edge. An isolation structure is disposed on the first cutting edge passivating the exposed connection and co-planed with the second cutting edge.

    摘要翻译： CMOS图像传感器芯片级封装的隔离结构及其制造方法。 CMOS图像传感器芯片级封装包括被配置为用于封装的支撑结构的透明衬底。 透明基板包括第一切削刃和第二切削刃。 具有裸片电路的CMOS图像传感器芯片安装在透明基板上。 密封剂设置在封装有CMOS图像传感器芯片的基板上。 连接从管芯电路延伸到密封剂上的封装的多个端子触头，其中连接由第一切削刃暴露。 隔离结构设置在第一切削刃上，钝化暴露的连接并与第二切削刃共同设计。