公开(公告)号：US20130320555A1

公开(公告)日：2013-12-05

申请号：US13484488

申请日：2012-05-31

申请人： Hsien YU-TSENG ,  Shih-Kai LIN ,  Chin-Shen LIN ,  Yu-Sian JIANG ,  Heng-Kai LIU ,  Mu-Jen HUANG ,  Chien-Wen CHEN

发明人： Hsien YU-TSENG ,  Shih-Kai LIN ,  Chin-Shen LIN ,  Yu-Sian JIANG ,  Heng-Kai LIU ,  Mu-Jen HUANG ,  Chien-Wen CHEN

IPC分类号： H01L27/00 ,  G06F17/50

CPC分类号： H01L23/528 ,  G06F17/5068 ,  G06F17/5081 ,  G06F2217/12 ,  H01L21/76816 ,  H01L23/53228 ,  H01L27/0207

摘要： A method comprises: accessing data representing a layout of a layer of an integrated circuit (IC) comprising a plurality of polygons defining circuit patterns to be divided among a number (N) of photomasks for multi-patterning a single layer of a semiconductor substrate, where N is greater than one. For each set of N parallel polygons in the layout closer to each other than a minimum separation for patterning with a single photomask, at least N−1 stitches are inserted in each polygon within that set to divide each polygon into at least N parts, such that adjacent parts of different polygons are assigned to different photomasks from each other. Data representing assignment of each of the parts in each set to respective photomasks are stored in a non-transitory, computer readable storage medium that is accessible for use in a process to fabricate the N photomasks.

摘要翻译： 一种方法包括：访问表示集成电路（IC）的层的布局的数据，所述集成电路的层包括多个多边形，所述多边形限定电路图案，以划分数个（N）个光掩模，用于多个图案化半导体衬底的单层; 其中N大于1。 对于布局中的每个N个平行多边形组合，彼此比用用于单一光掩模进行图案化的最小间隔更靠近，在该组内的每个多边形中插入至少N-1个针脚，以将每个多边形分成至少N个部分，例如 不同多边形的相邻部分被分配给彼此不同的光掩模。 表示将每个组中的每个部分分配给相应光掩模的数据被存储在非瞬时的计算机可读存储介质中，该介质可访问以用于制造N个光掩模的过程。