Light guide device and backlight module
    1.
    发明授权
    Light guide device and backlight module 有权
    导光装置和背光模组

    公开(公告)号:US08087812B2

    公开(公告)日:2012-01-03

    申请号:US12470722

    申请日:2009-05-22

    IPC分类号: G02F1/1335

    CPC分类号: G02B6/0088

    摘要: A light guide device and a backlight module. The backlight module comprises a light guide device and a plurality of light sources. The light guide device comprises a housing, comprising a frame around the housing; and a light guide plate, integrated inside the frame and comprising a light-emitting surface on one side of the light guide plate inside the frame and a light-receiving surface on one edge of the light guide plate, wherein a plurality of slots are disposed between the light guide plate and the frame and on other edges different from the edge whereon the light-receiving surface is disposed, and each of a plurality of barriers is disposed on an inner side of the light guide plate while being adjacent to one of the plurality of slots. The barriers are capable of reflecting the light traveling toward the frame back to the backlight module to improve the light efficiency.

    摘要翻译: 导光装置和背光模块。 背光模块包括导光装置和多个光源。 导光装置包括壳体,包括围绕壳体的框架; 以及导光板,其集成在所述框架内部并且包括在所述框架内的所述导光板的一侧上的发光面和所述导光板的一个边缘上的受光面,其中设置有多个狭槽 在导光板和框架之间以及与光接收表面的边缘不同的其它边缘上,并且多个屏障中的每一个设置在导光板的内侧,同时邻近于其中的一个 多个插槽。 障碍物能够将朝向框架的光返回到背光模块,以提高光效率。

    Optical display module with heat sink structure
    2.
    发明申请
    Optical display module with heat sink structure 审中-公开
    具有散热器结构的光学显示模块

    公开(公告)号:US20080043194A1

    公开(公告)日:2008-02-21

    申请号:US11503953

    申请日:2006-08-15

    IPC分类号: G02F1/1345

    摘要: An optical display module includes a liquid crystal panel, a driving IC, a flexible printed circuit board, a plurality of first pads, a plurality of second pads, at least a light source and a heat conductive member. The driving IC is provided on the liquid crystal panel and electrically connected to the flexible printed circuit board. The flexible printed circuit board includes through holes open at opposite sides. The first and second pads are provided on the opposite sides of the flexible printed circuit board respectively and connected to each other through the through holes. The light source electrically connected to the first pads. The heat conductive member is attached on the second pads. Heat of the light source is conducted to the heat conductive member through the first pads and the second pads in sequence to reduce the temperature around the light source.

    摘要翻译: 光学显示模块包括液晶面板,驱动IC,柔性印刷电路板,多个第一焊盘,多个第二焊盘,至少一个光源和导热部件。 驱动IC设置在液晶面板上并电连接到柔性印刷电路板。 柔性印刷电路板包括在相对侧开口的通孔。 第一和第二焊盘分别设置在柔性印刷电路板的相对侧上并通过通孔相互连接。 光源电连接到第一焊盘。 导热构件附接在第二垫上。 依次通过第一焊盘和第二焊盘将光源的热传导到导热部件,以降低光源周围的温度。

    Method of ITO layout to make IC bear the high-volt electrostatic discharge
    3.
    发明授权
    Method of ITO layout to make IC bear the high-volt electrostatic discharge 失效
    使ITO布局的方法使IC承受高压静电放电

    公开(公告)号:US06981234B2

    公开(公告)日:2005-12-27

    申请号:US10304736

    申请日:2002-11-27

    摘要: The present invention provides a method of ITO layout to make IC bear the high-volt electro static discharge, wherein the major steps include: designing the suitable circuit impedance and Layout at the position of Driver IC bonding and Interface on LCD Module(COG type) in accordance with the function and use of each pin; improving the protection function of ESD(Electro Static Discharge) in increasing the LCD Module assembly on the product of the client; wherein: connecting the pins of all VDD or VSS together at the bottom of the IC and the width of ITO layout spreading over the bottom of IC without influencing the layout of other pins after connecting VSS or VDD. Discharge the static electricity that enters the position of Module Interface and dissipate the electro static discharge by means of the ITO layout design of the big area to improve the protection ability of IC for the electro static discharge. Serial connect an extremely high impedance(3K˜50K Ω) in the Reset Pin. Increase the value (100˜1000 Ω) of ITO circuit impedance of Date bus, such as CS1.D/C,WR,RD,D0˜D7,C86 etc.

    摘要翻译: 本发明提供一种ITO布局方法,使IC承受高压静电放电,其主要步骤包括:在LCD模块(COG型)上的驱动IC接合位置和接口上设计合适的电路阻抗和布局, 按照每个针的功能和使用; 提高ESD(Electro Static Discharge)的保护功能,增加客户产品上的LCD模块组合; 其中:在IC底部将所有VDD或VSS的引脚连接在一起,并将ITO布局的宽度扩展到IC的底部,而不会在连接VSS或VDD后影响其他引脚的布局。 放电进入模块接口位置的静电,通过大面积的ITO布局设计消散静电放电,提高静电放电IC的保护能力。 在复位引脚中串行连接极高阻抗(3K〜50KΩ)。 增加日期总线的ITO电路阻抗值(100〜1000Ω),如CS1.D / C,WR,RD,D0〜D7,C86等。