公开(公告)号：US20070108577A1

公开(公告)日：2007-05-17

申请号：US11283596

申请日：2005-11-17

申请人： Hsiu Tu ,  Chen Peng ,  Mon Ho ,  Chung Hsin

发明人： Hsiu Tu ,  Chen Peng ,  Mon Ho ,  Chung Hsin

IPC分类号： H01L23/02

CPC分类号： H01L27/14625 ,  H01L23/10 ,  H01L23/3157 ,  H01L27/14618 ,  H01L27/14685 ,  H01L2924/0002 ,  H01L2924/00

摘要： An image sensor module with a protection layer and a method for manufacturing the same includes a substrate with an upper surface and a lower surface, a chip is mounted on the upper surface of the substrate, a plurality of wires are electrically connected the bonding pads of the chip to the first electrodes of the substrate, a adhered layer is coated on the upper surface of the substrate, a lens holder has a lateral wall, a protection layer and internal thread, the lateral wall is adhered on the upper surface of the substrate by the adhered layer to encapsulate the chip, so that the protection layer is located on the sensor region of the chip to prevent adhered layer flowed to the sensor region of the chip; and a lens barrel is formed with external thread screwed on the internal thread of the lens holder.

摘要翻译： 具有保护层的图像传感器模块及其制造方法包括具有上表面和下表面的基板，芯片安装在基板的上表面上，多条导线电连接到 芯片到基板的第一电极，粘合层涂覆在基板的上表面上，透镜保持器具有侧壁，保护层和内螺纹，侧壁粘附在基板的上表面上 通过粘附层封装芯片，使保护层位于芯片的传感器区域上，以防止粘附层流到芯片的传感器区域; 并且透镜筒形成有拧在透镜架的内螺纹上的外螺纹。

公开(公告)号：US20070096280A1

公开(公告)日：2007-05-03

申请号：US11265068

申请日：2005-11-01

申请人： Hsiu Tu ,  Chen Peng ,  Mon Ho ,  Chung Hsin

发明人： Hsiu Tu ,  Chen Peng ,  Mon Ho ,  Chung Hsin

IPC分类号： H01L23/02

CPC分类号： H01L31/02325 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14683 ,  H01L27/14685 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/8592 ,  H01L2924/00014

摘要： An image sensor module structure and method for manufacturing the same includes a substrate having an upper surface and a lower surface, a chip is mounted on the upper surface of the substrate, a plurality of wires are electrically connected the bonding pads of the chip to the first electrodes of the substrate, an adhered layer is coated on the upper surface of the substrate, a lens holder has a lateral wall and internal thread, the lateral wall is adhered on the upper surface of the substrate by the adhered layer to encapsulate the chip, so that the adhered layer is pressed to cover the wires, and a lens barrel is formed with external thread screwed on the internal thread of the lens holder.

摘要翻译： 图像传感器模块结构及其制造方法包括具有上表面和下表面的基板，芯片安装在基板的上表面上，多根导线将芯片的焊盘电连接到 基板的第一电极，在基板的上表面上涂覆粘附层，透镜架具有侧壁和内螺纹，侧壁通过粘附层粘附在基板的上表面上，以封装芯片 ，使得粘附层被覆以覆盖电线，并且透镜镜筒形成有外螺纹，螺纹固定在透镜保持器的内螺纹上。

公开(公告)号：US20070108544A1

公开(公告)日：2007-05-17

申请号：US11282392

申请日：2005-11-17

申请人： Hsiu Tu ,  Chen Peng ,  Mon Ho

发明人： Hsiu Tu ,  Chen Peng ,  Mon Ho

IPC分类号： H01L31/0203

CPC分类号： H01L27/14618 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014

摘要： An image sensor with a compound layer includes a substrate, a chip, wires, a compound layer, and a transparent layer. The substrate has an upper surface, which is formed with a central region and first electrodes arranged at the each side of the central region, and a lower surface, which is formed with second electrodes. The chip is mounted at the central region of the upper surface of the substrate. The chip has a sensor region and a plurality of bonding pads. The wires are electrically connected the bonding pads of the chip to the first electrodes of the substrate. The compound layer is located on the side of the chip and is covered on the wires. The transparent layer is arranged on the compound layer to cover the chip, so that the sensor region of the chip may be received optical signal through the transparent layer.

摘要翻译： 具有复合层的图像传感器包括基板，芯片，布线，复合层和透明层。 基板具有上表面，其形成有中心区域和布置在中心区域的每一侧的第一电极以及形成有第二电极的下表面。 芯片安装在基板的上表面的中心区域。 芯片具有传感器区域和多个接合焊盘。 电线将芯片的接合焊盘电连接到衬底的第一电极。 复合层位于芯片的一侧，并覆盖在电线上。 透明层布置在化合物层上以覆盖芯片，使得芯片的传感器区域可以通过透明层接收光信号。

公开(公告)号：US20070241272A1

公开(公告)日：2007-10-18

申请号：US11404730

申请日：2006-04-14

申请人： Jason Chuang ,  Mon Ho ,  Hsiu Tu ,  Chen Pin Peng ,  Chung Hsin ,  Wei Chang

发明人： Jason Chuang ,  Mon Ho ,  Hsiu Tu ,  Chen Pin Peng ,  Chung Hsin ,  Wei Chang

IPC分类号： H01J5/02

CPC分类号： H01L27/14618 ,  H01L27/14683 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014

摘要： An image sensor package structure includes a substrate, a chip, a plurality of wires, and a frame layer. The substrate has an upper surface, which is formed with first electrodes, and a lower surface, which is formed with second electrodes corresponding to electrically connect to the first electrodes. The chip has a sensor region and a plurality of bonding pads located at the side of the sensor region of the chip, and is mounted on the upper surface of the substrate. The plurality of wires are electrically connected the bonding pads of the chip to the first electrodes of the substrate. The frame layer is inserted with a transparent layer, and is arranged on the upper surface of the substrate to cover the chip.

摘要翻译： 图像传感器封装结构包括基板，芯片，多根导线和框架层。 基板具有形成有第一电极的上表面和形成有与第一电极电连接的第二电极的下表面。 芯片具有传感器区域和位于芯片的传感器区域侧的多个接合焊盘，并且安装在基板的上表面上。 多个导线将芯片的焊盘电连接到基板的第一电极。 框架层插入透明层，并且布置在基板的上表面上以覆盖芯片。

公开(公告)号：US20050062083A1

公开(公告)日：2005-03-24

申请号：US10671038

申请日：2003-09-24

申请人： Irving You ,  Jichen Wu ,  Hsiu Tu ,  Jason Chang ,  Figo Hsieh

发明人： Irving You ,  Jichen Wu ,  Hsiu Tu ,  Jason Chang ,  Figo Hsieh

IPC分类号： H01L21/336 ,  H01L27/146 ,  H01L31/0203 ,  H01L31/062

CPC分类号： H01L27/14618 ,  H01L27/14625 ,  H01L31/0203 ,  H01L2924/0002 ,  H01L2924/00

摘要： An image sensor module includes a substrate, a frame layer, a photosensitive chip, a transparent layer and a lens barrel. The substrate has a plurality of lead frame arranged in a matrix to form an upper surface, which is formed with a opening, and a lower surface, which is formed with a cavity penetrated from the opening. The frame layer is integrally formed with the substrate, and arranged at the periphery of the upper surface of the substrate to define a chamber together with the substrate, an internal thread being formed on the inner wall of the chamber. The photosensitive chip is mounted within the cavity of the substrate, and electrically coupled each of the lead frames in a flip chip manner. The transparent layer is covered onto the upper surface of the substrate to cover the opening. The lens barrel has a top surface, a bottom surface opposed to the top surface and a transparent region, a external thread formed between the top surface and the bottom surface, the lens barrel being arranged within the chamber of the frame layer, the external thread being screwed on the internal thread of the chamber.

摘要翻译： 图像传感器模块包括基板，框架层，感光芯片，透明层和镜筒。 基板具有以矩阵形式布置的多个引线框架，以形成形成有开口的上表面和形成有从开口穿入的空腔的下表面。 框架层与衬底一体地形成，并且布置在衬底的上表面的周边以与衬底一起限定腔室，内腔形成在腔室的内壁上。 感光芯片安装在基板的腔内，并以倒装芯片的方式电耦合每个引线框架。 透明层被覆盖在基板的上表面上以覆盖开口。 镜筒具有顶表面，与顶表面相对的底表面和透明区域，形成在顶表面和底表面之间的外螺纹，镜筒设置在框架层的腔室内，外螺纹 被拧在腔室的内螺纹上。