摘要:
An image sensor package structure includes a substrate, a chip, a plurality of wires, and a frame layer. The substrate has an upper surface, which is formed with first electrodes, and a lower surface, which is formed with second electrodes corresponding to electrically connect to the first electrodes. The chip has a sensor region and a plurality of bonding pads located at the side of the sensor region of the chip, and is mounted on the upper surface of the substrate. The plurality of wires are electrically connected the bonding pads of the chip to the first electrodes of the substrate. The frame layer is inserted with a transparent layer, and is arranged on the upper surface of the substrate to cover the chip.
摘要:
An image sensor module with air escape hole includes a substrate having an upper surface and a lower surface. A chip is mounted on the upper surface of the substrate. A plurality of wires are electrically connected the chip to the upper surface of the substrate. An adhered layer is coated on the upper surface of the substrate. A lens holder is mounted on the upper surface of the substrate by the adhered glue, and formed with a top wall, a lateral wall, and an internal thread, wherein the top wall is formed with an air escape hole. A lens barrel is formed with an external thread screwed on the internal thread of the lens holder. And a filled glue is filled within the air escape hole of the lens holder.
摘要:
An image sensor module with air escape hole includes a substrate having an upper surface and a lower surface. A chip is mounted on the upper surface of the substrate. A plurality of wires are electrically connected the chip to the upper surface of the substrate. An adhered layer is coated on the upper surface of the substrate. A lens holder is mounted on the upper surface of the substrate by the adhered glue, and formed with a top wall, a lateral wall, and an internal thread, wherein the top wall is formed with an air escape hole. A lens barrel is formed with an external thread screwed on the internal thread of the lens holder. And a filled glue is filled within the air escape hole of the lens holder.
摘要:
An image sensor package structure includes a substrate, a chip, a plurality of wires, and a frame layer. The substrate has an upper surface, which is formed with first electrodes, and a lower surface, which is formed with second electrodes corresponding to electrically connect to the first electrodes. The chip has a sensor region and a plurality of bonding pads located at the side of the sensor region of the chip, and is mounted on the upper surface of the substrate. The plurality of wires are electrically connected the bonding pads of the chip to the first electrodes of the substrate. The frame layer is inserted with a transparent layer, and is arranged on the upper surface of the substrate to cover the chip.
摘要:
An RFID chip is modified with set data before being disposed in an electronic label so as to allow the electronic label to be selectively used with different types of RFID systems. The RFID chip includes a first data storage zone for storing first data set accessible by the first type of RFID system and the second type of RFID system; and a second data storage zone for storing second data set inaccessible by the first type of RFID system and the second type of RFID system. The second data set includes a modifiable code for indicating a type of the electronic label and with which of the first type of RFID system and the second type of RFID system the electronic label is to be used.
摘要:
A humidity measurement device comprises a capacitance measurement unit (101) and a microcontroller (102). The capacitance measurement unit (101) is used to output a frequency signal of a humidity-sensitive capacitor (C1) by the humidity-sensitive capacitor (C1) and a frequency signal of a reference capacitor (C2) by the reference capacitor (C2) respectively. The microcontroller (102) is used to obtain a frequency value of the humidity-sensitive capacitor (C1) and a frequency value of the reference capacitor (C2) based on the frequency signal of the humidity-sensitive capacitor (C1) and the frequency signal of the reference capacitor (C2), and obtain a current ambient humidity value by using a linear function relationship of a frequency difference between the humidity-sensitive capacitor (C1) and the reference capacitor (C2) and a humidity value. A humidity measurement method includes using the said humidity measurement device to measure a current ambient humidity value.
摘要:
The present invention provides a method for tourist guiding and showing information of tourist spots using a mobile device. The method comprises: an information center picking up information of a tourist spot from a database according to a request of a user and transmitting the information to a car electronic device, wherein the information comprises identification data of an identification device installed in the tourist spot; the user downloading the information from the car electronic device by the mobile device; and the mobile device displaying the information of the tourist spot according to the identification data after the user uses the mobile device to read the identification device.
摘要:
The invention discloses a method for authorized-user verification, which allows a host-end system to determine whether a holder of a user-end apparatus is an authorized user. The method includes: the host-end system sending a secret code to the user-end apparatus; the user-end apparatus scanning at least one biometric characteristic of the holder, generating encrypted data according to the secret code and the biometric characteristic, and sending the encrypted data to the host-end system; the host-end system decrypting the encrypted data to generate a decrypted secret code and a decrypted biometric characteristic, checking whether the decrypted secret code matches the secret code, and further checking whether the decrypted biometric characteristic matches a pre-stored biometric characteristic of the authorized user when the decrypted secret code matches the secret code.
摘要:
A laser diode and a manufacture method thereof are disclosed. The method of manufacturing the laser diode comprises the steps of: 1. coupling a photo diode chip with one of a plurality of pins on a frame; 2. coupling and overlapping a laser diode chip with the photo diode chip; 3. bonding the laser diode chip and the photo diode chip to the other pins on the frame by use of conducting wires; 4. using a housing having an opening, a notch, and a mounting chamber for holding the pins to complete the assembly of the laser diode; and 5. cutting off connected portions among the pins to obtain the laser diode. Be means of the simplified manufacture process, the laser diode is suitable for mass production and the production cost is substantially reduced.
摘要:
A method of protecting a brand by sale promotion includes the steps of (a) establishing an identification code of a product into a server by a manufacturer while encoding the identification code into a label of the product, wherein the identification code includes at least an attribute of the product; (b) shipping out the product to a retailer from the manufacturer; (c) enabling the identification code of the tag to be read by a consumer using a reader of the retailer to authenticate the authenticity of the product; (d) sending back the identification code to the server while the server determines the authenticity of the product and perform a prize check process according to the identification code; and (e) analyzing and saving the sale condition of the product.