公开(公告)号：US20130119523A1

公开(公告)日：2013-05-16

申请号：US13656237

申请日：2012-10-19

Applicant: Huawei Device Co., Ltd.

Inventor： Yinghua CHENG ,  Rui SUN ,  Fengping WANG ,  Haixing DING

IPC: H01L23/552

CPC classification number: H01L23/552 ,  H01L23/3121 ,  H01L24/73 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/14 ,  H01L2924/141 ,  H01L2924/1434 ,  H01L2924/157 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/19107 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A packaging structure includes: a substrate (21), where the substrate (21) is arranged with a grounding end (27) and at least two circuit modules; a shielding separator (24) connected to the substrate (21) for separating the at least two circuit modules; a packaging insulator (25) applied on the substrate (21) for covering the at least two circuit modules, where the packaging insulator (25) is lower than the shielding separator (24); and a conductive coating (26) connected to the grounding end (27) and applied on the packaging insulator (25) for covering the packaging insulator (25) and the shielding separator (24). Therefore multiple shielded areas may be formed inside a packaging structure, which reduces electromagnetic interference between modules inside the packaging structure, and meanwhile, improves functional performance of circuits inside the packaging structure.

Abstract translation: 包装结构包括：基板（21），其中所述基板（21）布置有接地端（27）和至少两个电路模块; 连接到所述基板（21）的屏蔽分离器（24），用于分离所述至少两个电路模块; 施加在所述基板上的包装绝缘体，用于覆盖所述至少两个电路模块，在所述至少两个电路模块中，所述封装绝缘体）比所述屏蔽隔板（24）低。 以及连接到所述接地端（27）并且被施加在所述包装绝缘体（25）上以覆盖所述包装绝缘体（25）和所述屏蔽分离器（24）的导电涂层（26）。 因此，可以在封装结构内形成多个屏蔽区域，从而减少封装结构内的模块间的电磁干扰，同时提高封装结构内电路的功能性能。