公开(公告)号：US20240244802A1

公开(公告)日：2024-07-18

申请号：US18411345

申请日：2024-01-12

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： Yuting LIU ,  Lin DU ,  Shaolong LIU

IPC: H05K7/20 ,  B60L53/22 ,  H05K5/00

CPC classification number: H05K7/20854 ,  B60L53/22 ,  H05K5/0047

Abstract: A vehicle-mounted power supply apparatus and a vehicle. The vehicle-mounted power supply apparatus includes a power conversion circuit, an upper-layer PCB board, a lower-layer PCB board, a bottom cover, and a radiator. The upper-layer PCB board and the lower-layer PCB board are configured to bear a plurality of power switching transistors of the power conversion circuit, so that the power conversion circuit is distributed more flexibly. The lower-layer PCB board and a plurality of transformers are fastened to a bottom plate of the bottom cover, and cooled by heat dissipation through a lower-layer cooling channel in the bottom cover. The upper-layer PCB board and the radiator are sequentially stacked above the lower-layer PCB board and the plurality of transformers, and cooled by heat dissipation through an upper-layer cooling channel in the radiator.

公开(公告)号：US20240324142A1

公开(公告)日：2024-09-26

申请号：US18731522

申请日：2024-06-03

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： Zhaoxue CUI ,  Ren LIU ,  Lin DU ,  Tao LIANG ,  Ping LI

IPC: H05K7/20 ,  B60R16/03 ,  H02J7/00 ,  H05K1/11 ,  H05K1/14 ,  H05K1/18 ,  H05K7/14

CPC classification number: H05K7/20272 ,  B60R16/03 ,  H02J7/0042 ,  H05K1/11 ,  H05K1/144 ,  H05K1/181 ,  H05K7/1427

Abstract: A packaging structure is provided and may include a housing and a power component. The power component is disposed inside the housing. The housing may include a top cover and a bottom housing. The top cover may have a first heat transfer medium channel inside. The bottom housing may have a second heat transfer medium channel inside. The power component may include a first circuit board and a second circuit board. At least one first heating device may be disposed on the first circuit board. The first heating device may press against an inner wall of the top cover. At least one second heating device may be disposed on the second circuit board, and the second heating device may press against an inner wall of the bottom housing. When the foregoing structure is used, high power density and high heat dissipation efficiency can be achieved.