公开(公告)号：US20230268841A1

公开(公告)日：2023-08-24

申请号：US18169396

申请日：2023-02-15

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： Ren LIU ,  Weiping LIU ,  Shanchuan SHI

IPC: H02M3/335 ,  H02M1/44 ,  H02J7/06 ,  B60L53/22

CPC classification number: H02M3/3353 ,  H02M3/33561 ,  H02M1/44 ,  H02J7/06 ,  B60L53/22 ,  H02J2207/20 ,  B60L2210/30 ,  B60L2210/10

Abstract: A converting circuit and a charging apparatus and relates to the field of electronic technologies. In the converting circuit, two groups of parallel connected primary-side converting circuits are connected in a one-to-one correspondence with a primary side of a first transformer and a primary side of a second transformer, and two groups of parallel connected secondary-side converting circuits are connected in a one-to-one correspondence with a secondary side of the first transformer and a secondary side of the second transformer, and the two groups of parallel connected primary-side converting circuits or the two groups of parallel connected secondary-side converting circuits include a first input end and a second input end separately connected to a primary side of a third transformer. Therefore, a primary-side converting circuit does not need to be disposed for the third transformer, to effectively reduce circuit complexity and reduce the circuit costs.

公开(公告)号：US20240324142A1

公开(公告)日：2024-09-26

申请号：US18731522

申请日：2024-06-03

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： Zhaoxue CUI ,  Ren LIU ,  Lin DU ,  Tao LIANG ,  Ping LI

IPC: H05K7/20 ,  B60R16/03 ,  H02J7/00 ,  H05K1/11 ,  H05K1/14 ,  H05K1/18 ,  H05K7/14

CPC classification number: H05K7/20272 ,  B60R16/03 ,  H02J7/0042 ,  H05K1/11 ,  H05K1/144 ,  H05K1/181 ,  H05K7/1427

Abstract: A packaging structure is provided and may include a housing and a power component. The power component is disposed inside the housing. The housing may include a top cover and a bottom housing. The top cover may have a first heat transfer medium channel inside. The bottom housing may have a second heat transfer medium channel inside. The power component may include a first circuit board and a second circuit board. At least one first heating device may be disposed on the first circuit board. The first heating device may press against an inner wall of the top cover. At least one second heating device may be disposed on the second circuit board, and the second heating device may press against an inner wall of the bottom housing. When the foregoing structure is used, high power density and high heat dissipation efficiency can be achieved.