Power Converter, Package Structure, and Heat Dissipation Structure

    公开(公告)号:US20240421100A1

    公开(公告)日:2024-12-19

    申请号:US18816415

    申请日:2024-08-27

    Abstract: A package structure includes a first substrate, a second substrate, pins, and a first die. The package structure is connected to a printed circuit board through the pins. The first substrate includes a first routing layer, a first insulation layer, and a first metal layer that are sequentially stacked, and the second substrate includes a second routing layer, a second insulation layer, and a second metal layer that are sequentially stacked. The first metal layer is mechanically and electrically connected to a first part of the second routing layer, and the first metal layer and the first part of the second routing layer are connected to a quiescent point. At least one die is disposed on a surface that is of the first routing layer and that is away from the first metal layer, and a contact point between the die and the first routing layer is a moving point.

    MAGNETIC ELEMENT, POWER SUPPLY, AND ELECTRONIC DEVICE

    公开(公告)号:US20230082478A1

    公开(公告)日:2023-03-16

    申请号:US17992862

    申请日:2022-11-22

    Abstract: This application provides a magnetic element, a power supply, and an electronic device. The magnetic element includes a magnetic core, a coil, and a skeleton, an accommodation space is provided in the magnetic core, and the coil is located in the accommodation space. Surfaces of the magnetic core include a first end face, a second end face, and a side surface connecting the first end face and the second end face. The skeleton is disposed on the side surface and is fixedly connected to the magnetic core. The first end face is flush with or protrudes from one end of the skeleton, and the second end face is flush with or protrudes from the other end of the skeleton.

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