Power Converter, Package Structure, and Heat Dissipation Structure

    公开(公告)号:US20240421100A1

    公开(公告)日:2024-12-19

    申请号:US18816415

    申请日:2024-08-27

    Abstract: A package structure includes a first substrate, a second substrate, pins, and a first die. The package structure is connected to a printed circuit board through the pins. The first substrate includes a first routing layer, a first insulation layer, and a first metal layer that are sequentially stacked, and the second substrate includes a second routing layer, a second insulation layer, and a second metal layer that are sequentially stacked. The first metal layer is mechanically and electrically connected to a first part of the second routing layer, and the first metal layer and the first part of the second routing layer are connected to a quiescent point. At least one die is disposed on a surface that is of the first routing layer and that is away from the first metal layer, and a contact point between the die and the first routing layer is a moving point.

    INVERTER AND PHOTOVOLTAIC ENERGY STORAGE SYSTEM

    公开(公告)号:US20250096698A1

    公开(公告)日:2025-03-20

    申请号:US18892057

    申请日:2024-09-20

    Abstract: An inverter includes a chassis, which has a cavity that accommodates a plurality of power devices and a partition and blocking assembly. The partition and blocking assembly divides the cavity of the chassis into two installation cavities, and the plurality of power devices are disposed in the two installation cavities. The chassis includes a first side wall and a second side wall that are adjacent to each other. An air inlet of a fan of the partition and blocking assembly communicates with one installation cavity, an air outlet of the fan communicates with the other installation cavity, and a direction from the air inlet to the air outlet faces away from the first side wall. A gap exists between the partition and blocking assembly and the second side wall, or the partition and blocking assembly is provided with a through hole.

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