公开(公告)号：US20240079957A1

公开(公告)日：2024-03-07

申请号：US18506308

申请日：2023-11-10

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： Shousong Ou ,  Haitao Chen ,  Xingzhong Zhang

IPC: H02M3/07 ,  H02M3/00 ,  H02M3/158

CPC classification number: H02M3/07 ,  H02M3/01 ,  H02M3/158

Abstract: A resonant switched capacitor converter includes a control system, a first capacitor, a plurality of resonant systems, and a plurality of second capacitors coupled in series. The first capacitor is coupled in series to the second capacitors. One resonant system corresponds to one second capacitor. Each of the resonant systems includes a first switch system, a resonant circuit, and a second switch system. The control system is coupled to the resonant systems and configured to control, based on a target output voltage gain, switches in the first switch system and the second switch system in each resonant system to be turned on or turned off, to enable the resonant switched capacitor converter to obtain an output voltage gain equal to the target output voltage gain.

公开(公告)号：US12107496B2

公开(公告)日：2024-10-01

申请号：US17848155

申请日：2022-06-23

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： Haitao Chen ,  Xingzhong Zhang

IPC: H02M3/155 ,  H02J7/00 ,  H02M3/00 ,  H02M3/07

CPC classification number: H02M3/155 ,  H02J7/0016 ,  H02M3/01 ,  H02M3/07

Abstract: A converter circuit includes a capacitor module and a balance module. The capacitor module includes at least a first capacitor and a second capacitor. The balance module includes at least a first resonant circuit. The first resonant circuit includes at least two switch groups connected in parallel and a first resonant cavity bridged between the two switch groups. The first capacitor and the second capacitor are connected in series. The first resonant circuit is separately bridged between two ends of the first capacitor and between two ends of the second capacitor. The balance module controls each switch in the first resonant circuit, so that each switch works with the first resonant cavity to affect a current, to balance a voltage between the two ends of the first capacitor and a voltage between the two ends of the second capacitor.

公开(公告)号：US20240421100A1

公开(公告)日：2024-12-19

申请号：US18816415

申请日：2024-08-27

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： Xingzhong Zhang ,  Shanwu Chen ,  Jiebin Cheng ,  Baoshan Wu ,  Weiping Song

IPC: H01L23/552 ,  H01L23/057 ,  H01L23/31 ,  H01L23/367 ,  H01L23/498 ,  H01L23/538 ,  H01L25/065

Abstract: A package structure includes a first substrate, a second substrate, pins, and a first die. The package structure is connected to a printed circuit board through the pins. The first substrate includes a first routing layer, a first insulation layer, and a first metal layer that are sequentially stacked, and the second substrate includes a second routing layer, a second insulation layer, and a second metal layer that are sequentially stacked. The first metal layer is mechanically and electrically connected to a first part of the second routing layer, and the first metal layer and the first part of the second routing layer are connected to a quiescent point. At least one die is disposed on a surface that is of the first routing layer and that is away from the first metal layer, and a contact point between the die and the first routing layer is a moving point.