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公开(公告)号：US09941917B2
公开(公告)日：2018-04-10
申请号：US14982471
申请日：2015-12-29
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor： Chenglong Wang , Fredrik Ohlsson , Vadim Tsoi
Abstract: An embodiment of the present invention discloses a base station, including: a baseband unit, a radio remote unit, a power supply device, a signal transmission device, and a backup power supply device. The baseband unit and the radio remote unit are mounted on an antenna tower or a pole. At least one of the power supply device, the signal transmission device, or the backup power supply device is also mounted on the antenna tower or the pole.
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公开(公告)号：US12136937B2
公开(公告)日：2024-11-05
申请号：US17831140
申请日：2022-06-02
Applicant: Huawei Technologies Co., Ltd.
Inventor： Fredrik Ohlsson
Abstract: A device for transferring heat between a second module, for example an optical transceiver module, and a first module, for example a heat sink. The device comprises a holder for holding the second module, a first unit configured to be thermally coupled to the first module, and a second unit which is urged against the second module placed in the holder by a biasing apparatus. The first unit and the second unit are thermally coupled to one another through a heat-transferring apparatus such that an improved heat transfer can be provided between the first and second units, and hence between the second module and the first module. Furthermore, the disclosure also relates to an arrangement, including the device, and a network access node for a wireless communication system including any one of the device and the arrangement.
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公开(公告)号：US12114467B2
公开(公告)日：2024-10-08
申请号：US17871660
申请日：2022-07-22
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor： Magnus Kallmark , Fredrik Ohlsson , Vadim Tsoi , Reine Granstrom
IPC: H05K7/20 , H01L23/367 , H01L23/467
CPC classification number: H05K7/20409 , H01L23/3672 , H01L23/467 , F28F2215/04 , H05K7/20127 , H05K7/20509
Abstract: The invention relates to a heatsink for transferring heat from one or more electrical devices to a heat transfer medium. The heatsink includes a plurality of fins arranged on a frontside of the heatsink. The plurality of fins includes a first group of fins extending in a first planar direction and a second group of fins extending in a second planar direction angled in relation to the first planar direction. For example, the first group of fins may extend from the bottom to the top of the heatsink, while the second group of fins may extend from the first group of fins to the sides of the heatsink. In this way, the sides of the heatsink can be used as air outlets and the airflow through the heatsink can be increased.
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公开(公告)号：US20240023281A1
公开(公告)日：2024-01-18
申请号：US18477302
申请日：2023-09-28
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor： Fredrik Ohlsson , Vadim Tsoi , Long Li
IPC: H05K7/20
CPC classification number: H05K7/20336 , H05K7/20436
Abstract: A heat spreader for transferring heat from an electronic heat source to a heat sink, a system for cooling an electronic heat source, and a method for manufacturing a heat spreader are provided. The heat spreader includes a set of separate channels which are coupled with each other by an upper coupler and a lower coupler such that a cooling fluid circulates in the set of separate channels via the upper coupler and the lower coupler in operation.
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公开(公告)号：US10177449B2
公开(公告)日：2019-01-08
申请号：US15686351
申请日：2017-08-25
Applicant: Huawei Technologies Co., Ltd.
Inventor： Fredrik Ohlsson , Hannes Huotelin , Andrea Putaggio
Abstract: A radome assembly includes a radome member, a heat sink member, a seal member disposed between the radome member and the heat sink member, and a frame assembly configured to compress the seal member between the radome member and the heat sink member. The frame assembly includes a fixation member configured to be fixedly engaged with the heat sink member and an arm member, the arm member configured to engage the radome member to compress the seal member between the radome member and the heat sink member when the fixation member is engaged with the heat sink member, and wherein engagement of the fixation member with the heat sink member in a compressed state of the seal member forms a gap between the radome member and the heat sink member.
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Patent Agency Ranking
公开(公告)号：US20170352939A1
公开(公告)日：2017-12-07
申请号：US15686726
申请日：2017-08-25
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor： Fredrik Ohlsson , Peter Ekholm , Joakim Hoppe , Andrea Putaggio
CPC classification number: H01Q1/1228 , H01Q1/125 , H01Q1/246 , H01Q1/428
Abstract: A radio frequency assembly (100) is described. The radio frequency assembly (100) comprises a radio frequency unit (102) comprising at least one unit connection member (110, 112) and at least one antenna (168), a bracket (104) comprising at least one bracket connection member (114, 116), and, at least one fastening member (108, 170). At least one of said at least one unit connection member (110, 112) and said at least one bracket connection member (114, 116) is curved. Each unit connection member (110, 112) is configured to be connectable to a respective bracket connection member (114, 116) with use of the fastening member (108, 170).
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公开(公告)号：US12222165B2
公开(公告)日：2025-02-11
申请号：US17831230
申请日：2022-06-02
Applicant: Huawei Technologies Co., Ltd.
Inventor： Fredrik Ohlsson , Vadim Tsoi
Abstract: An apparatus for transferring heat from a heat source to air while the apparatus is connected to the heat source is provided. The apparatus has a heat sink comprising a heat sink base and a plurality of primary fins connected to the heat sink base. The apparatus includes a heat sink front. The heat sink base is configured to be thermally coupled to the heat source. Each primary fin of the plurality of primary fins has one or more conduits. The heat sink base includes a first chamber. The first chamber and the conduits together form a common space sealed off from the air surrounding the apparatus. The first chamber and the conduits together enclose a heat-carrying fluid in the common space formed by the first chamber and the conduits. A network access node for a wireless communication system is provided. The network access node comprises the above-described apparatus.
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公开(公告)号：US20240206126A1
公开(公告)日：2024-06-20
申请号：US18538908
申请日：2023-12-13
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor： Dzmitry Kushner , Christoffer Jarpner , Vadim Tsoi , Fredrik Ohlsson , Ying Dong , Marcus Lundh
IPC: H05K7/20
CPC classification number: H05K7/2039 , H05K7/20327
Abstract: An apparatus for transferring heat from a heat source to air, comprising a heat sink with a plurality of fins. A fin of the plurality of fins is configured as follows: the fin comprises a conduit arrangement for a heat-carrying fluid; in a boiling region of the fin, the conduit arrangement comprises a vapour guiding path; and in the boiling region, the conduit arrangement comprises one or more boiling chambers. Each of the one or more boiling chambers has an outer boundary. The respective boiling chamber is located within a chamber region defined by an imaginary quadrilateral having four sides and four vertices. By means of the arrangement and configuration of the boiling chambers and/or of the vapour guiding path, the heat transfer efficiency of the fin is improved.
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公开(公告)号：US11988882B2
公开(公告)日：2024-05-21
申请号：US17575337
申请日：2022-01-13
Applicant: Huawei Technologies Co., Ltd.
Inventor： Fredrik Ohlsson
CPC classification number: G02B6/4269 , H05K7/20418 , H05K7/2049
Abstract: The disclosure relates to a device for transferring heat between a second module, for example an optical transceiver module, and a first module, for example a heat sink. The device comprises a holder for holding the second module, a first unit configured to be thermally coupled to the first module, and a second unit which is urged against the second module placed in the holder by a biasing apparatus. The first and second units are thermally coupled to one another through a plurality of protrusions of the first or second unit and a plurality of complementary cavities of the other of the first and second unit.
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公开(公告)号：US20220137311A1
公开(公告)日：2022-05-05
申请号：US17575337
申请日：2022-01-13
Applicant: Huawei Technologies Co., Ltd.
Inventor： Fredrik Ohlsson
IPC: G02B6/42
Abstract: The disclosure relates to a device for transferring heat between a second module, for example an optical transceiver module, and a first module, for example a heat sink. The device comprises a holder for holding the second module, a first unit configured to be thermally coupled to the first module, and a second unit which is urged against the second module placed in the holder by a biasing apparatus. The first and second units are thermally coupled to one another through a plurality of protrusions of the first or second unit and a plurality of complementary cavities of the other of the first and second unit.
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