公开(公告)号：US11100039B2

公开(公告)日：2021-08-24

申请号：US16673253

申请日：2019-11-04

Applicant: Huawei Technologies Co., Ltd.

Inventor： Defu Liao ,  Fei Zhang ,  Honghui Liu

IPC: G06F15/163 ,  G06F13/40 ,  G06F15/17

Abstract: An interconnection system including a first gating unit and a second gating unit is provided. The first gating unit includes two terminals, with one terminal connecting to a first CPU directly, where the two terminals are indirectly connected when the first gating unit is in a first state. The second gating unit includes two terminals, with one terminal connecting to a second CPU, where the two terminals are connected when the second gating unit is in the first state. Another terminal of the first gating unit is connected to another terminal of the second gating unit. If both the first gating unit and the second gating unit are in the first state, the first CPU is connected to the second CPU.

公开(公告)号：US20200065291A1

公开(公告)日：2020-02-27

申请号：US16673253

申请日：2019-11-04

Applicant: Huawei Technologies Co., Ltd.

Inventor： Defu Liao ,  Fei Zhang ,  Honghui Liu

IPC: G06F15/163

Abstract: An interconnection system including a first gating unit and a second gating unit is provided. The first gating unit includes two terminals, with one terminal connecting to a first CPU directly, where the two terminals are indirectly connected when the first gating unit is in a first state. The second gating unit includes two terminals, with one terminal connecting to a second CPU, where the two terminals are connected when the second gating unit is in the first state. Another terminal of the first gating unit is connected to another terminal of the second gating unit. If both the first gating unit and the second gating unit are in the first state, the first CPU is connected to the second CPU.

公开(公告)号：US20170196124A1

公开(公告)日：2017-07-06

申请号：US15468859

申请日：2017-03-24

Applicant: Huawei Technologies Co., Ltd.

Inventor： Yaofeng Peng ,  Zhijian Li ,  Honghui Liu ,  Shanjiu Chi

IPC: H05K7/20 ,  F28D15/04 ,  F28D15/02

CPC classification number: H05K7/20681 ,  F28D15/0266 ,  F28D15/04 ,  H05K7/20327 ,  H05K7/20336 ,  H05K7/20381 ,  H05K7/20672 ,  H05K7/20809

Abstract: A system, including a first pipeline and a second pipeline, where the first pipeline includes a first steam pipe, a first liquid pipe, and an evaporation section connected between the first steam pipe and the first liquid pipe, and the second pipeline includes a second steam pipe, a second liquid pipe, and a heat exchanger connected between the second steam pipe and the second liquid pipe. Two pairs of quick connectors are respectively connected between the first steam pipe and the second steam pipe and between the first liquid pipe and the second liquid pipe. The loop heat pipe includes a valve and a nozzle that are configured for vacuum pumping. Refrigerant is provided inside the loop heat pipe. A capillary structure is provided inside the evaporation section to provide a capillary suction force to enable the refrigerant to circulate in the loop heat pipe.

公开(公告)号：US10470339B2

公开(公告)日：2019-11-05

申请号：US15468859

申请日：2017-03-24

Applicant: Huawei Technologies Co., Ltd.

Inventor： Yaofeng Peng ,  Zhijian Li ,  Honghui Liu ,  Shanjiu Chi

IPC: H05K7/20 ,  F28D15/02 ,  F28D15/04

Abstract: A system, including a first pipeline and a second pipeline, where the first pipeline includes a first steam pipe, a first liquid pipe, and an evaporation section connected between the first steam pipe and the first liquid pipe, and the second pipeline includes a second steam pipe, a second liquid pipe, and a heat exchanger connected between the second steam pipe and the second liquid pipe. Two pairs of quick connectors are respectively connected between the first steam pipe and the second steam pipe and between the first liquid pipe and the second liquid pipe. The loop heat pipe includes a valve and a nozzle that are configured for vacuum pumping. Refrigerant is provided inside the loop heat pipe. A capillary structure is provided inside the evaporation section to provide a capillary suction force to enable the refrigerant to circulate in the loop heat pipe.