公开(公告)号：US20140110562A1

公开(公告)日：2014-04-24

申请号：US14143663

申请日：2013-12-30

Applicant: Huawei Technologies Co., Ltd.

Inventor： Xiaolu Song ,  Lixian Wang ,  Ninghua Zhu

IPC: G02B6/42

CPC classification number: H05K1/025 ,  G02B6/4279 ,  H05K1/0233 ,  H05K2201/09727 ,  H05K2201/10022 ,  H05K2201/10121

Abstract: An optoelectronic device includes a packaged part and a core component. The core component includes a chip subcarrier and an optoelectronic chip. The device also includes a connecting plate that forms a coplanar waveguide transmission line together with the ground through a high-frequency transmission line and an isolation dielectric. The coplanar waveguide transmission line and a low-frequency line are connected to the packaged part and the core component and are configured to transmit a high-frequency signal and a low-frequency signal between the packaged part and the core component.

Abstract translation: 光电子器件包括封装部件和芯部件。 核心部件包括芯片副载波和光电芯片。 该装置还包括连接板，其通过高频传输线和隔离电介质与地面一起形成共面波导传输线。 共面波导传输线和低频线连接到封装部分和核心部件，并且被配置为在封装部分和核心部件之间传输高频信号和低频信号。

公开(公告)号：US09210802B2

公开(公告)日：2015-12-08

申请号：US14143663

申请日：2013-12-30

Applicant: Huawei Technologies Co., Ltd.

Inventor： Xiaolu Song ,  Lixian Wang ,  Ninghua Zhu

IPC: H05K1/02 ,  G02B6/42

CPC classification number: H05K1/025 ,  G02B6/4279 ,  H05K1/0233 ,  H05K2201/09727 ,  H05K2201/10022 ,  H05K2201/10121

Abstract: An optoelectronic device includes a packaged part and a core component. The core component includes a chip subcarrier and an optoelectronic chip. The device also includes a connecting plate that forms a coplanar waveguide transmission line together with the ground through a high-frequency transmission line and an isolation dielectric. The coplanar waveguide transmission line and a low-frequency line are connected to the packaged part and the core component and are configured to transmit a high-frequency signal and a low-frequency signal between the packaged part and the core component.

Abstract translation: 光电子器件包括封装部件和芯部件。 核心部件包括芯片副载波和光电芯片。 该装置还包括连接板，其通过高频传输线和隔离电介质与地面一起形成共面波导传输线。 共面波导传输线和低频线连接到封装部分和核心部件，并且被配置为在封装部分和核心部件之间传输高频信号和低频信号。