公开(公告)号：US20230318166A1

公开(公告)日：2023-10-05

申请号：US18180085

申请日：2023-03-07

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Luqi Zhang ,  Kun Li ,  Xianfeng Tang ,  Yanxing Luo

IPC: H01Q1/22 ,  H01Q9/04 ,  H01Q1/38 ,  H01Q1/50

CPC classification number: H01Q1/2283 ,  H01Q1/38 ,  H01Q1/50 ,  H01Q9/0407

Abstract: This disclosure provides a radio frequency chip, a signal transceiver, and a communication device. The radio frequency chip includes: a chip; a coupling structure, including: a resonator, where a resonant cavity is formed, and an inner wall of the resonant cavity is made of metal; a redistribution layer, arranged above the resonant cavity and including an redistribution layer (RDL) dielectric layer; a radiator, made of metal, formed into a centro-symmetric shape, arranged on a surface that is of the dielectric layer and that faces the resonator, and accommodated in the resonant cavity; a feeder, where one end of the feeder is connected to the chip, and the other end is inserted into the resonant cavity; a packaging structure, configured to package the chip and cover the redistribution layer, so that a signal generated by the chip can be efficiently coupled to a polymer transmission line.

公开(公告)号：US20230352807A1

公开(公告)日：2023-11-02

申请号：US18344251

申请日：2023-06-29

Applicant: Huawei Technologies Co., Ltd.

Inventor： Luqi Zhang ,  Kun Li ,  Rui Lyu ,  Yu Liu

IPC: H01P5/08 ,  H01L23/66 ,  H05K1/02

CPC classification number: H01P5/08 ,  H01L23/66 ,  H05K1/025 ,  H05K1/0246 ,  H01L2223/6677 ,  H01L2223/6627 ,  H05K2201/10098

Abstract: A terahertz carrier sending apparatus and a terahertz carrier receiving apparatus include a feed transmission line configured to receive an electrical signal sent by a radio frequency sending circuit. A mode excitation structure is configured to excite a terahertz signal. A mode conversion structure includes an inner cavity whose inner wall is metal. A circuit board is configured to fasten the feed transmission line and the mode excitation structure. The mode conversion structure further includes a positioning slot. A part of the circuit board and the mode excitation structure are inserted into the inner cavity of the mode conversion structure. A plurality of metal through holes are distributed on both sides of the mode excitation structure. A boundary of the positioning slot is metal and press-fitted on the metal through holes on the both sides of the mode excitation structure.

公开(公告)号：US11139572B2

公开(公告)日：2021-10-05

申请号：US16735313

申请日：2020-01-06

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Luqi Zhang ,  Rui Lyu ,  Xin Luo

IPC: H01Q5/307 ,  H01Q13/02 ,  H01Q21/00 ,  H01Q21/06

Abstract: This application provides a feed apparatus, a dual-band microwave antenna, and a dual-band antenna device. The feed apparatus includes a low-frequency feed and a high-frequency feed. The high-frequency feed is embedded into the low-frequency feed. The low-frequency feed includes a plurality of low-frequency array elements arranged in an array. The high-frequency feed includes a plurality of high-frequency array elements arranged in an array. At least one high-frequency array element is embedded into the low-frequency array element, and the low-frequency array element and each high-frequency array element embedded into the low-frequency array element have a common waveguide wall.