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公开(公告)号：US09167729B2
公开(公告)日：2015-10-20
申请号：US14012659
申请日：2013-08-28
Applicant: Huawei Technologies Co., Ltd.
Inventor： Xiaohu Liu
CPC classification number: H05K7/20909 , H02M7/003 , H05K7/209 , H05K7/20918
Abstract: An inverter, a sealing air duct, and a heat dissipation system are disclosed. The inverter includes: an enclosure having a first cavity and a second cavity that are isolated from each other and sealed; a magnetic conversion circuit including magnetic elements that is arranged in the first cavity; a power conversion circuit including power tubes that is arranged in the second cavity; a heatsink arranged at the bottom of the enclosure and located outside the first cavity and the second cavity; a sealing air duct arranged outside the second cavity, where the columnar pipeline is sealed at two ends, the bottom surface is formed by a side wall of the second cavity or a substrate of the heatsink, and the bottom surface includes an air inlet and an air outlet to communicate with the second cavity and the at least one columnar pipeline.
Abstract translation: 公开了一种逆变器，密封空气管道和散热系统。 逆变器包括：具有彼此隔离并密封的第一腔和第二腔的外壳; 包括布置在所述第一腔中的磁性元件的磁转换电路; 功率转换电路，包括布置在所述第二腔中的功率管; 布置在外壳底部并位于第一腔和第二腔外部的散热器; 密封空气管道，布置在第二腔室的外部，柱状管道在两端密封，底面由第二腔室的侧壁或散热器的基底形成，底面包括空气入口和 空气出口与第二腔和至少一个柱状管道连通。
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公开(公告)号：US11272639B2
公开(公告)日：2022-03-08
申请号：US16462826
申请日：2017-02-07
Applicant: Huawei Technologies Co., Ltd.
Inventor： Guo Yang , Quanming Li , Xiaohu Liu , Wei Li , Zhiguo Zhang
Abstract: A heat dissipation apparatus includes a heat dissipation panel built in the electronic device. The heat dissipation panel includes a first heat conducting layer, including a first surface and a second surface. The first surface is a surface exposed to the outside when the first heat conducting layer is bent. The second surface is a surface opposite to the first surface. A first region on the first heat conducting layer is used to absorb heat released by a heat emitting component, and conduct the heat to a second region on the first heat conducting layer, to dissipate the heat. The heat dissipation panel also includes first flexible layer, including a third region. The third region adheres to a position that is on the second surface of the first heat conducting layer and that corresponds to a bending region.
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公开(公告)号：US20130343110A1
公开(公告)日：2013-12-26
申请号：US14012659
申请日：2013-08-28
Applicant: Huawei Technologies Co., Ltd.
Inventor： Xiaohu Liu
IPC: H02M7/00
CPC classification number: H05K7/20909 , H02M7/003 , H05K7/209 , H05K7/20918
Abstract: An inverter, a sealing air duct, and a heat dissipation system are disclosed. The inverter includes: an enclosure having a first cavity and a second cavity that are isolated from each other and sealed; a magnetic conversion circuit including magnetic elements that is arranged in the first cavity; a power conversion circuit including power tubes that is arranged in the second cavity; a heatsink arranged at the bottom of the enclosure and located outside the first cavity and the second cavity; a sealing air duct arranged outside the second cavity, where the columnar pipeline is sealed at two ends, the bottom surface is formed by a side wall of the second cavity or a substrate of the heatsink, and the bottom surface includes an air inlet and an air outlet to communicate with the second cavity and the at least one columnar pipeline.
Abstract translation: 公开了一种逆变器，密封空气管道和散热系统。 逆变器包括：具有彼此隔离并密封的第一腔和第二腔的外壳; 包括布置在所述第一腔中的磁性元件的磁转换电路; 功率转换电路，包括布置在所述第二腔中的功率管; 布置在外壳底部并位于第一腔和第二腔外部的散热器; 密封空气管道，布置在第二腔室的外部，柱状管道在两端密封，底面由第二腔室的侧壁或散热器的基底形成，底面包括空气入口和 空气出口与第二腔和至少一个柱状管道连通。
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