-
公开(公告)号：US12289855B2
公开(公告)日：2025-04-29
申请号：US17987103
申请日：2022-11-15
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor： Huahua Xu , Zehong Chen , Xinhu Gong , Songlin Wang
Abstract: A chassis for a storage device includes a chassis body and an installation frame slidably installed in the chassis body by using a sliding assembly. The installation frame is configured to slide out from two ends of the chassis body. The sliding assembly includes a first sliding rail, a second sliding rail, and a first limiting assembly. The first sliding rail is fastened to the chassis body, the second sliding rail is fastened to the installation frame, and the first sliding rail and the second sliding rail are slidably assembled. The first limiting assembly includes a first clamping part and a second clamping part that fit with each other. A first drive component drives the first clamping part to be clamped with the second clamping part, and a second drive component drives the first clamping part to be detached from the second clamping part.
-
公开(公告)号：US11903164B2
公开(公告)日：2024-02-13
申请号：US17552722
申请日：2021-12-16
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor： Xinhu Gong , Gaoliang Xia
IPC: H05K7/20 , H01L23/473
CPC classification number: H05K7/20254 , H01L23/473 , H05K7/20272
Abstract: A heat dissipation apparatus includes a heat-conducting plate, where a liquid channel is disposed on a first surface of the heat-conducting plate; a mounting base, where an accommodation cavity configured to accommodate a partial area that is in the heat-conducting plate and that includes a second surface is disposed on the mounting base. The first surface and the second surface are disposed opposite to each other. A pressing plate is configured to fasten the heat-conducting plate in the accommodation cavity. The pressing plate is detachably and firmly connected to the mounting base, a sealing cavity is formed between the pressing plate and the first surface of the heat-conducting plate, and the sealing cavity is configured to accommodate the liquid channel A liquid inlet connector and a liquid outlet connector that are connected to the liquid channel are disposed on the pressing plate.
-
公开(公告)号：US20220136634A1
公开(公告)日：2022-05-05
申请号：US17576284
申请日：2022-01-14
Applicant: Huawei Technologies Co., Ltd.
Inventor： Xinhu Gong , Haofeng Chen , Gaoliang Xia
Abstract: A joint includes a male module and a female module capable of docking with each other. The male module includes a core rod and a sliding cylinder that is slidably sleeved on an outer periphery of the core rod. A first valve port is disposed in the sliding cylinder, and the core rod is provided with a piston head that is in hermetic fit with the first valve port. The female module includes a valve body and a piston. A first channel is disposed in the valve body, the piston is slidably disposed in the first channel, and a second valve port that is in hermetic fit with the piston is disposed in the first channel.
-
Patent Agency Ranking
公开(公告)号：US12224512B2
公开(公告)日：2025-02-11
申请号：US17680659
申请日：2022-02-25
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor： Huahua Xu , Xinhu Gong , Yinzhong Tang
Abstract: A circuit board assembly, a backplane interconnection system, and an electronic device are disclosed. The circuit board assembly includes a bracket and a circuit board, the circuit board is formed with a fastened part and a free part, the fastened part is connected to the bracket, the free part is suspended, a surface on which the free part and the fastened part are co-located is a first plane, the free part has an amplitude of swing in a first direction, the first direction is perpendicular to the first plane, the circuit board is configured to plug-connect to a front sub-circuit board, a first connector plug-connected to a first plug-connection end on the front sub-circuit board is disposed on the free part, and the amplitude of swing is capable of enabling the first connector to plug-connect to the first plug-connection end.
-
公开(公告)号：US20230066108A1
公开(公告)日：2023-03-02
申请号：US17987103
申请日：2022-11-15
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor： Huahua Xu , Zehong Chen , Xinhu Gong , Songlin Wang
Abstract: A chassis for a storage device includes a chassis body and an installation frame slidably installed in the chassis body by using a sliding assembly. The installation frame is configured to slide out from two ends of the chassis body. The sliding assembly includes a first sliding rail, a second sliding rail, and a first limiting assembly. The first sliding rail is fastened to the chassis body, the second sliding rail is fastened to the installation frame, and the first sliding rail and the second sliding rail are slidably assembled. The first limiting assembly includes a first clamping part and a second clamping part that fit with each other. A first drive component drives the first clamping part to be clamped with the second clamping part, and a second drive component drives the first clamping part to be detached from the second clamping part.
-
公开(公告)号：US12253199B2
公开(公告)日：2025-03-18
申请号：US17576284
申请日：2022-01-14
Applicant: Huawei Technologies Co., Ltd.
Inventor： Xinhu Gong , Haofeng Chen , Gaoliang Xia
Abstract: A joint includes a male module and a female module capable of docking with each other. The male module includes a core rod and a sliding cylinder that is slidably sleeved on an outer periphery of the core rod. A first valve port is disposed in the sliding cylinder, and the core rod is provided with a piston head that is in hermetic fit with the first valve port. The female module includes a valve body and a piston. A first channel is disposed in the valve body, the piston is slidably disposed in the first channel, and a second valve port that is in hermetic fit with the piston is disposed in the first channel.
-
公开(公告)号：US12238853B2
公开(公告)日：2025-02-25
申请号：US18191946
申请日：2023-03-29
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor： Hui Jia , Xinhu Gong , Dingfang Li
IPC: H05K1/02
Abstract: A heat sink includes: a first heat dissipation module in thermal contact with the first heat source; a heat dissipation base in thermal contact with the second heat source, where the heat dissipation base is fixed on the circuit board, the first heat dissipation module is floatingly fixed on the heat dissipation base, and the heat dissipation base is provided with a first opening; and a second heat dissipation module, disposed between the first heat dissipation module and the heat dissipation base, where the second heat dissipation module is fixed on the heat dissipation base, the second heat dissipation module is provided with a second opening corresponding to the first opening, and the first heat dissipation module sequentially runs through the second opening and the first opening to be in thermal contact with the first heat source.
-
公开(公告)号：US11647608B2
公开(公告)日：2023-05-09
申请号：US17486593
申请日：2021-09-27
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor： Yiying Jian , Dingfang Li , Xinhu Gong , Gaoliang Xia
CPC classification number: H05K7/20418 , H05K7/20718
Abstract: The present disclosure relates to heat dissipation apparatus. One example heat dissipation apparatus includes a heat dissipation assembly and a bracket assembly, where the heat dissipation assembly is configured to dissipate heat for a server chip and includes a substrate and a heat sink, the heat dissipation assembly is connected to the bracket assembly, the bracket assembly includes a bracket and a plurality of first elastic structural members that are disposed on the bracket, each first elastic structural member includes a supporting portion and a connection portion, and at least one hook is disposed on the connection portion.
-
-
-
-
-
-
-
Search Results
8
records
(took 0.015 seconds)
