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公开(公告)号：US11229145B2
公开(公告)日：2022-01-18
申请号：US16911030
申请日：2020-06-24
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor： Huan Peng , Gaoliang Xia
Abstract: An air baffle component includes an air baffle rotationally connected to a housing of a device chassis having a module insertion port. The air baffle component also includes a level-1 elastic component. The air baffle component further includes a level-2 elastic component. The air baffle component additionally includes a connecting rod. The connecting rod includes a force-bearing rod rotationally connected to the housing of the device chassis between the air baffle and the module insertion port. The connecting rod also includes a pull rod connected to the force-bearing rode. The connecting rod further includes a baffle column on the pull rod. The level-1 elastic component provides a first elastic force for the force-bearing rod, so that the baffle column is caused to abut against a surface of the air baffle opposite to the module insertion port. The level-2 elastic component provides a second elastic force for the air baffle.
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Patent Agency Ranking
公开(公告)号：US20240324146A1
公开(公告)日：2024-09-26
申请号：US18735565
申请日：2024-06-06
Applicant: Huawei Technologies Co., Ltd.
Inventor： Hui Jia , Gaoliang Xia , Dingfang Li
IPC: H05K7/20
CPC classification number: H05K7/20781 , H05K7/20254 , H05K7/20272
Abstract: A device node is provided. The device node includes a circuit board, a heat dissipation component and a housing having a cold liquid inlet and a liquid return outlet. The circuit board and the heat dissipation component are disposed in the housing, and at least one main chip is disposed on the circuit board. The heat dissipation component includes a spray plate and at least one liquid cold plate. Each liquid cold plate is configured to form a liquid cooling channel. Liquid cooling channels of all liquid cold plates are communicated to form a liquid cooling network. An inlet of the liquid cooling network is communicated with the cold liquid inlet. The spray plate has a spray channel communicated with an outlet of the liquid cooling network and liquid spray holes communicated with the spray channel, and a liquid outlet end of the liquid spray hole faces the circuit board.
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公开(公告)号：US12253199B2
公开(公告)日：2025-03-18
申请号：US17576284
申请日：2022-01-14
Applicant: Huawei Technologies Co., Ltd.
Inventor： Xinhu Gong , Haofeng Chen , Gaoliang Xia
Abstract: A joint includes a male module and a female module capable of docking with each other. The male module includes a core rod and a sliding cylinder that is slidably sleeved on an outer periphery of the core rod. A first valve port is disposed in the sliding cylinder, and the core rod is provided with a piston head that is in hermetic fit with the first valve port. The female module includes a valve body and a piston. A first channel is disposed in the valve body, the piston is slidably disposed in the first channel, and a second valve port that is in hermetic fit with the piston is disposed in the first channel.
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公开(公告)号：US11647608B2
公开(公告)日：2023-05-09
申请号：US17486593
申请日：2021-09-27
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor： Yiying Jian , Dingfang Li , Xinhu Gong , Gaoliang Xia
CPC classification number: H05K7/20418 , H05K7/20718
Abstract: The present disclosure relates to heat dissipation apparatus. One example heat dissipation apparatus includes a heat dissipation assembly and a bracket assembly, where the heat dissipation assembly is configured to dissipate heat for a server chip and includes a substrate and a heat sink, the heat dissipation assembly is connected to the bracket assembly, the bracket assembly includes a bracket and a plurality of first elastic structural members that are disposed on the bracket, each first elastic structural member includes a supporting portion and a connection portion, and at least one hook is disposed on the connection portion.
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公开(公告)号：US11903164B2
公开(公告)日：2024-02-13
申请号：US17552722
申请日：2021-12-16
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor： Xinhu Gong , Gaoliang Xia
IPC: H05K7/20 , H01L23/473
CPC classification number: H05K7/20254 , H01L23/473 , H05K7/20272
Abstract: A heat dissipation apparatus includes a heat-conducting plate, where a liquid channel is disposed on a first surface of the heat-conducting plate; a mounting base, where an accommodation cavity configured to accommodate a partial area that is in the heat-conducting plate and that includes a second surface is disposed on the mounting base. The first surface and the second surface are disposed opposite to each other. A pressing plate is configured to fasten the heat-conducting plate in the accommodation cavity. The pressing plate is detachably and firmly connected to the mounting base, a sealing cavity is formed between the pressing plate and the first surface of the heat-conducting plate, and the sealing cavity is configured to accommodate the liquid channel A liquid inlet connector and a liquid outlet connector that are connected to the liquid channel are disposed on the pressing plate.
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公开(公告)号：US20220136634A1
公开(公告)日：2022-05-05
申请号：US17576284
申请日：2022-01-14
Applicant: Huawei Technologies Co., Ltd.
Inventor： Xinhu Gong , Haofeng Chen , Gaoliang Xia
Abstract: A joint includes a male module and a female module capable of docking with each other. The male module includes a core rod and a sliding cylinder that is slidably sleeved on an outer periphery of the core rod. A first valve port is disposed in the sliding cylinder, and the core rod is provided with a piston head that is in hermetic fit with the first valve port. The female module includes a valve body and a piston. A first channel is disposed in the valve body, the piston is slidably disposed in the first channel, and a second valve port that is in hermetic fit with the piston is disposed in the first channel.
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