公开(公告)号：US20170314877A1

公开(公告)日：2017-11-02

申请号：US15651873

申请日：2017-07-17

Applicant: Huawei Technologies Co., Ltd.

Inventor： Zaizhong Xia ,  Shuainan Lin ,  Yuening Li

IPC: F28F13/08 ,  H05K7/20

CPC classification number: F28F13/08 ,  F28F3/02 ,  F28F13/06 ,  F28F2215/04 ,  H01L23/467 ,  H05K7/20 ,  H05K7/2039

Abstract: A heat dissipation apparatus, including a base plate, a guide fin group, and a heat dissipation fin group, where the guide fin group is formed on a surface of the base plate, the guide fin group is disposed with at least two guide fins that are disposed at an interval, and the at least two guide fins extend along a surface of the base plate from an edge of the base plate, and a flow path for flowing of an airflow is formed between two adjacent guide fins, and the heat dissipation fin group includes at least one heat dissipation fin, where the at least one heat dissipation fin is fixedly connected to the top of the at least two guide fins to dissipate heat of the at least two guide fins. The heat dissipation apparatus further includes, guide fins and a stopper fin.