公开(公告)号：US09466769B2

公开(公告)日：2016-10-11

申请号：US14344871

申请日：2012-07-30

申请人： Hubert Halbritter ,  Heinz Haas ,  Claus Jaeger ,  Bernhard Stojetz

发明人： Hubert Halbritter ,  Heinz Haas ,  Claus Jaeger ,  Bernhard Stojetz

IPC分类号： H01L33/48 ,  H01L33/58 ,  H01L25/075 ,  F21V5/00 ,  F21Y105/00

CPC分类号： H01L33/48 ,  F21V5/007 ,  H01L25/0753 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2933/0058 ,  H01L2924/00

摘要： A method is provided for producing a plurality of optoelectronic components. A number of semiconductor chips are arranged on a connection carrier assembly. A frame assembly with a number of openings is arranged in such a way, relative to the connection carrier assembly, that the semiconductor chips are each arranged in one of the openings. A number of optical elements are positioned in such a way, relative to the frame assembly, that the optical elements cover the openings. The connection carrier assembly with the frame assembly and the optical elements is singulated into the number of optoelectronic components, such that each optoelectronic component includes one connection carrier with at least one optoelectronic semiconductor chip, one frame with at least one opening and at least one optical element.

摘要翻译： 提供了一种用于制造多个光电子部件的方法。 多个半导体芯片布置在连接载体组件上。 具有多个开口的框架组件以相对于连接托架组件的方式布置成半导体芯片各自布置在其中一个开口中。 多个光学元件相对于框架组件以这样的方式定位，使得光学元件覆盖开口。 具有框架组件和光学元件的连接支架组件被分成多个光电子部件，使得每个光电子部件包括具有至少一个光电子半导体芯片的一个连接载体，具有至少一个开口的一个框架和至少一个光学 元件。

公开(公告)号：US20140225147A1

公开(公告)日：2014-08-14

申请号：US14344871

申请日：2012-07-30

申请人： Hubert Halbritter ,  Heinz Haas ,  Claus Jaeger ,  Bernhard Stojetz

发明人： Hubert Halbritter ,  Heinz Haas ,  Claus Jaeger ,  Bernhard Stojetz

IPC分类号： H01L33/48

CPC分类号： H01L33/48 ,  F21V5/007 ,  H01L25/0753 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2933/0058 ,  H01L2924/00

摘要： A method is provided for producing a plurality of optoelectronic components. A number of semiconductor chips are arranged on a connection carrier assembly. A frame assembly with a number of openings is arranged in such a way, relative to the connection carrier assembly, that the semiconductor chips are each arranged in one of the openings. A number of optical elements are positioned in such a way, relative to the frame assembly, that the optical elements cover the openings. The connection carrier assembly with the frame assembly and the optical elements is singulated into the number of optoelectronic components, such that each optoelectronic component includes one connection carrier with at least one optoelectronic semiconductor chip, one frame with at least one opening and at least one optical element.

摘要翻译： 提供了一种用于制造多个光电子部件的方法。 多个半导体芯片布置在连接载体组件上。 具有多个开口的框架组件以相对于连接托架组件的方式布置成半导体芯片各自布置在其中一个开口中。 多个光学元件相对于框架组件以这样的方式定位，使得光学元件覆盖开口。 具有框架组件和光学元件的连接支架组件被分成多个光电子部件，使得每个光电子部件包括具有至少一个光电子半导体芯片的一个连接载体，具有至少一个开口的一个框架和至少一个光学 元件。