公开(公告)号：US20120105187A1

公开(公告)日：2012-05-03

申请号：US13007680

申请日：2011-01-17

Applicant: Huo-Li LIN

Inventor： Huo-Li LIN

IPC: H01F27/02

CPC classification number: H01F27/02 ,  H01F1/147 ,  H01F27/365 ,  H01F2017/048

Abstract: An inductor device includes a coil, two conductive bases and a shell. The coil is located over and coupled with the two conductive bases. The shell covers the coil and exposes partial conductor bases. The shell is made by an alloy material consisting of Fe, Cr, Si, Mn, S, C, P and Al. The weight ratio of Cr is 10.5%˜13.5%, Si is 0.1%˜0.5%, Mn is 0.1%˜1.0%, S is 0.01%˜0.053%, C is 0.01%˜0.05%, P is 0.01%˜0.05% and Al is 0.1%˜1.0%.

Abstract translation: 电感器件包括线圈，两个导电基座和外壳。 线圈位于两个导电基底之上并与其连接。 壳体覆盖线圈并暴露部分导体基座。 壳由Fe，Cr，Si，Mn，S，C，P和Al组成的合金材料制成。 Cr的重量比为10.5％〜13.5％，Si为0.1％〜0.5％，Mn为0.1％〜1.0％，S为0.01％〜0.053％，C为0.01％〜0.05％，P为0.01％〜0.05 ％，Al为0.1％〜1.0％。

公开(公告)号：US20100060398A1

公开(公告)日：2010-03-11

申请号：US12235576

申请日：2008-09-22

Applicant: Huo-Li LIN

Inventor： Huo-Li LIN

IPC: H01F27/02 ,  H01F41/00

CPC classification number: H01F17/043 ,  H01F3/10 ,  H01F27/027 ,  H01F41/0246 ,  Y10T29/49075

Abstract: A method to fabricate a molding inductor structure and a molding inductor structure are provided. The method comprises the steps of: performing a high pressure process on a first magnetic material to form a baseboard, wherein a central area of the baseboard comprises a pillar; providing a metal coil, wherein the metal coil comprises an open coil center; connecting the metal coil and the baseboard such that the pillar lodges in the open coil center; placing the connected metal coil and the baseboard into a mold; and forming a covering structure by stuffing a second magnetic material with a high pressure process to cover the connected metal coil and the baseboard to form the molding inductor structure.

Abstract translation: 提供了一种制造模制电感器结构和模制电感器结构的方法。 该方法包括以下步骤：对第一磁性材料进行高压处理以形成基板，其中，所述基板的中心区域包括支柱; 提供金属线圈，其中所述金属线圈包括开放线圈中心; 连接金属线圈和踢脚板，使得支柱保持在开放的线圈中心; 将连接的金属线圈和基板放入模具中; 以及通过用高压处理填充第二磁性材料来覆盖连接的金属线圈和基板来形成覆盖结构以形成模制电感器结构。