公开(公告)号：US20080318723A1

公开(公告)日：2008-12-25

申请号：US11950278

申请日：2007-12-04

申请人： Hyun Goo Kang ,  Jin Soo Lee

发明人： Hyun Goo Kang ,  Jin Soo Lee

IPC分类号： F16H31/00

CPC分类号： F16H61/0206 ,  F16H2200/006

摘要： A hydraulic control system of an eight-speed automatic transmission includes a first clutch/second clutch control portion controlled by a first proportional control solenoid valve and selectively supplying hydraulic pressure of a first pressure control valve to the first clutch or the second clutch; a third clutch control portion controlled by a second proportional control solenoid valve and supplying hydraulic pressure of a second pressure control valve to the third clutch; a fourth clutch/first brake control portion controlled by a third proportional control solenoid valve and selectively supplying hydraulic pressure of a third pressure control valve to the fourth clutch or the first brake, the fourth clutch/first brake control portion supplying reverse range pressure to the first brake at the reverse speed; and a second brake control portion controlled by a fourth proportional control solenoid valve and directly supplying hydraulic pressure of a fourth pressure control valve to the second brake.

摘要翻译： 八速自动变速器的液压控制系统包括由第一比例控制电磁阀控制的第一离合器/第二离合器控制部分，并且选择性地向第一离合器或第二离合器供给第一压力控制阀的液压; 由第二比例控制电磁阀控制的第三离合器控制部分，并向第三离合器供给第二压力控制阀的液压; 第四离合器/第一制动控制部，其由第三比例控制电磁阀控制，并选择性地向第四离合器或第一制动器供给第三压力控制阀的液压;第四离合器/第一制动控制部，向第 首先以反向速度制动; 以及由第四比例控制电磁阀控制的直接向第二制动器供给第四压力控制阀的液压的第二制动控制部。

公开(公告)号：US07985153B2

公开(公告)日：2011-07-26

申请号：US11950278

申请日：2007-12-04

申请人： Hyun Goo Kang ,  Jin Soo Lee

发明人： Hyun Goo Kang ,  Jin Soo Lee

IPC分类号： F16H61/30

CPC分类号： F16H61/0206 ,  F16H2200/006

摘要： A hydraulic control system of an eight-speed automatic transmission includes a first clutch/second clutch control portion controlled by a first proportional control solenoid valve and selectively supplying hydraulic pressure of a first pressure control valve to the first clutch or the second clutch; a third clutch control portion controlled by a second proportional control solenoid valve and supplying hydraulic pressure of a second pressure control valve to the third clutch; a fourth clutch/first brake control portion controlled by a third proportional control solenoid valve and selectively supplying hydraulic pressure of a third pressure control valve to the fourth clutch or the first brake, the fourth clutch/first brake control portion supplying reverse range pressure to the first brake at the reverse speed; and a second brake control portion controlled by a fourth proportional control solenoid valve and directly supplying hydraulic pressure of a fourth pressure control valve to the second brake.

摘要翻译： 八速自动变速器的液压控制系统包括由第一比例控制电磁阀控制的第一离合器/第二离合器控制部分，并且选择性地向第一离合器或第二离合器供给第一压力控制阀的液压; 由第二比例控制电磁阀控制的第三离合器控制部分，并向第三离合器供给第二压力控制阀的液压; 第四离合器/第一制动控制部，其由第三比例控制电磁阀控制，并选择性地向第四离合器或第一制动器供给第三压力控制阀的液压;第四离合器/第一制动控制部，向第 首先以反向速度制动; 以及由第四比例控制电磁阀控制的直接向第二制动器供给第四压力控制阀的液压的第二制动控制部。

公开(公告)号：US07833908B2

公开(公告)日：2010-11-16

申请号：US10556377

申请日：2004-05-11

申请人： Jea Gun Park ,  Takeo Katoh ,  Won Mo Lee ,  Hyun Goo Kang ,  Sung Jun Kim ,  Un Gyu Paik

发明人： Jea Gun Park ,  Takeo Katoh ,  Won Mo Lee ,  Hyun Goo Kang ,  Sung Jun Kim ,  Un Gyu Paik

IPC分类号： H01L21/302

CPC分类号： C09G1/02 ,  H01L21/31053

摘要： A slurry composition for chemical-mechanical polishing capable of compensating nanotopography effect present on the surface of a wafer, and a method for planarizing the surface of a semiconductor device that utilizes the same are disclosed. The slurry composition of the present invention is aimed at compensating the nanotopography effect during chemical mechanical polishing process of the oxide layer formed on the surface of the wafer, and contains abrasive particles and an additive, wherein the size of the abrasive particles and the concentration of the additive are controlled within predetermined ranges in order to control the deviation of thickness (OTD) of the oxide layer below a certain level after the chemical mechanical polishing process.

摘要翻译： 公开了一种能够补偿晶片表面上存在的纳米形貌效应的用于化学机械抛光的浆料组合物，以及用于平面化利用其的半导体器件的表面的方法。 本发明的浆料组合物旨在补偿在晶片表面形成的氧化物层的化学机械抛光过程中的纳米形貌作用，并且包含磨料颗粒和添加剂，其中磨料颗粒的尺寸和浓度 将添加剂控制在预定范围内，以便在化学机械抛光处理之后控制氧化物层的厚度（OTD）低于一定水平的偏差。